| The material removal and surface generation mechanism in ultra-precision grinding of silicon wafers H Tao, Y Liu, D Zhao, X Lu International Journal of Mechanical Sciences 222, 107240, 2022 | 35 | 2022 |
| Spiral tool path generation method in a NURBS parameter space for the ultra-precision diamond turning of freeform surfaces S He, J Xuan, W Du, Q Xia, S Xiong, L Zhang, Y Wang, J Wu, H Tao, T Shi Journal of Manufacturing Processes 60, 340-355, 2020 | 33 | 2020 |
| Undeformed chip width non-uniformity modeling and surface roughness prediction in wafer self-rotational grinding process H Tao, Y Liu, D Zhao, X Lu Tribology International 171, 107547, 2022 | 31 | 2022 |
| Prioritization analysis and compensation of geometric errors for ultra-precision lathe based on the random forest methodology H Tao, R Chen, J Xuan, Q Xia, Z Yang, X Zhang, S He, T Shi Precision Engineering 61, 23-40, 2020 | 29 | 2020 |
| Dual attention dense convolutional network for intelligent fault diagnosis of spindle-rolling bearings S Jiang, J Xuan, J Duan, J Lin, H Tao, Q Xia, R Jing, S Xiong, T Shi Journal of Vibration and Control 27 (21-22), 2403-2419, 2021 | 20 | 2021 |
| Prediction and measurement for grinding force in wafer self-rotational grinding H Tao, Y Liu, D Zhao, X Lu International Journal of Mechanical Sciences 258, 108530, 2023 | 19 | 2023 |
| Ductile deformation and subsurface damage evolution mechanism of silicon wafer induced by ultra-precision grinding process H Tao, Y Liu, D Zhao, X Lu Tribology International 189, 108879, 2023 | 19 | 2023 |
| Influence of anisotropy on material removal and deformation mechanism based on nanoscratch tests of monocrystal silicon H Tao, Q Zeng, Y Liu, D Zhao, X Lu Tribology International 187, 108736, 2023 | 19 | 2023 |
| Effects of wheel spindle vibration on surface formation in wafer self-rotational grinding process H Tao, Y Liu, D Zhao, X Lu International Journal of Mechanical Sciences 232, 107620, 2022 | 16 | 2022 |
| A new approach to identify geometric errors directly from the surface topography of workpiece in ultra-precision machining H Tao, R Chen, J Xuan, Q Xia, Z Yang, X Zhang, S He, T Shi The International Journal of Advanced Manufacturing Technology 106, 5159-5173, 2020 | 16 | 2020 |
| Cutting speed dependence of material removal mechanism for monocrystal silicon H Tao, Y Liu, C Wang, D Zhao, X Lu International Journal of Mechanical Sciences 264, 108816, 2024 | 15 | 2024 |
| Effects of grinding-induced surface topography on the material removal mechanism of silicon chemical mechanical polishing H Tao, Q Zeng, Y Liu, D Zhao, X Lu Applied Surface Science 631, 157509, 2023 | 15 | 2023 |
| An investigation on the total thickness variation control and optimization in the wafer backside grinding process Y Liu, H Tao, D Zhao, X Lu Materials 15 (12), 4230, 2022 | 11 | 2022 |
