Ikuti
Lien Chin Wei
Lien Chin Wei
Nama lainnyaWilliam Lien Chin Wei
Email yang diverifikasi di ngc.com - Beranda
Judul
Dikutip oleh
Dikutip oleh
Tahun
An experimental investigation of forced convective cooling performance of a microchannel heat sink with Al2O3/water nanofluid
CJ Ho, LC Wei, ZW Li
Applied Thermal Engineering 30 (2-3), 96-103, 2010
5342010
Thermal conductivity of metal powders for powder bed additive manufacturing
LC Wei, LE Ehrlich, MJ Powell-Palm, C Montgomery, J Beuth, JA Malen
Additive Manufacturing 21, 201-208, 2018
2242018
Interpretation of thermoreflectance measurements with a two-temperature model including non-surface heat deposition
KT Regner, LC Wei, JA Malen
Journal of Applied Physics 118 (23), 2015
312015
Amplified charge and discharge rates in phase change materials for energy storage using spatially-enhanced thermal conductivity
LC Wei, JA Malen
Applied Energy 181, 224-231, 2016
272016
Thermal conductivity of metal powders for powder bed additive manufacturing, Addit. Manuf. 21 (2018) 201–208
LC Wei, LE Ehrlich, MJ Powell-Palm, C Montgomery, J Beuth, JA Malen
18
Thermal conductivity of metal powders for powder bed additive manufacturing. Addit Manuf 21: 201–208
LC Wei, LE Ehrlich, MJ Powell-Palm, C Montgomery, J Beuth, JA Malen
62018
Hot-spot thermal management by phase change materials enhanced by spatially graded metal meshes
LC Wei, JA Malen
International Journal of Heat and Mass Transfer 150, 119153, 2020
42020
JA Malen Thermal conductivity of metal powders for powder bed additive manufacturing., 2018, 21
LC Wei, LE Ehrlich, MJ Powell-Palm, C Montgomery, J Beuth
DOI: https://doi. org/10.1016/j. addma 2, 201-208, 2018
42018
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