Emre Salman

Dikutip oleh

	Semua	Sejak 2020
Kutipan	1698	786
indeks-h	23	15
indeks-i10	46	22

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32 artikel

5 artikel

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Pengarang bersama

Eby G. FriedmanDistinguished Professor, University of RochesterEmail yang diverifikasi di ece.rochester.edu
Baris TaskinProfessor of ECE, Drexel UniversityEmail yang diverifikasi di coe.drexel.edu
A. Can SitikSoftware Engineer, Intel Co.Email yang diverifikasi di intel.com
Shahrzad TowfighianProfessor of Mechanical Engineering, Binghamton UniversityEmail yang diverifikasi di binghamton.edu
Ryan WillingUniversity of Western OntarioEmail yang diverifikasi di uwo.ca
Hailang WangApple Inc.Email yang diverifikasi di apple.com
Chen Perkins YanCadence Design SystemsEmail yang diverifikasi di cadence.com
Tutu WanStony Brook UniversityEmail yang diverifikasi di stonybrook.edu
Weicheng LiuStony Brook UniversityEmail yang diverifikasi di stonybrook.edu
Qiaoyan YuUniversity of New Hampshire; University of RochesterEmail yang diverifikasi di unh.edu
Kayhan KucukcakarANSYS, Inc.Email yang diverifikasi di ansys.com
Ali DasdanZoominfo & KD (Knowledge Discovery) ConsultingEmail yang diverifikasi di zoominfo.com
yasha karimiAdjunct Research Professor at Stony Brook UniversityEmail yang diverifikasi di stonybrook.edu
Jaya DofeCalifornia State University, FullertonEmail yang diverifikasi di fullerton.edu
Zhihua GanStony Brook UniversityEmail yang diverifikasi di stonybrook.edu
Mallika RathoreHardware Engineer, GoogleEmail yang diverifikasi di alumni.stonybrook.edu
Selçuk KöseProfessor of Electrical and Computer Engineering, University of RochesterEmail yang diverifikasi di rochester.edu
Alex Doboli, PhDStony Brook University, State University of New YorkEmail yang diverifikasi di stonybrook.edu

Ikuti

Emre Salman

Professor of Electrical and Computer Engineering, Stony Brook University

Email yang diverifikasi di stonybrook.edu - Beranda

Integrated circuits VLSI


Judul Urutkan menurut kutipan Urutkan menurut tahun Urutkan menurut judul	Dikutip oleh Dikutip oleh	Tahun
High performance integrated circuit design E Salman, EG Friedman (No Title), 2012	187	2012
Exploiting setup–hold-time interdependence in static timing analysis E Salman, A Dasdan, F Taraporevala, K Kucukcakar, EG Friedman IEEE Transactions on Computer-Aided Design of Integrated Circuits and …, 2007	83	2007
Mono3D: Open source cell library for monolithic 3-D integrated circuits C Yan, E Salman IEEE Transactions on Circuits and Systems I: Regular Papers 65 (3), 1075-1085, 2017	66	2017
Shielding methodologies in the presence of power/ground noise S Kose, E Salman, EG Friedman IEEE Transactions on Very Large Scale Integration (VLSI) Systems 19 (8 …, 2010	62	2010
A smart knee implant using triboelectric energy harvesters A Ibrahim, M Jain, E Salman, R Willing, S Towfighian Smart materials and Structures 28 (2), 025040, 2019	55	2019
Hardware security threats and potential countermeasures in emerging 3D ICs J Dofe, Q Yu, H Wang, E Salman Proceedings of the 26th edition on Great Lakes Symposium on VLSI, 69-74, 2016	51	2016
Monolithic 3D Integrated circuits: Recent trends and future prospects K Dhananjay, P Shukla, VF Pavlidis, A Coskun, E Salman IEEE Transactions on Circuits and Systems II: Express Briefs 68 (3), 837-843, 2021	45	2021
Power distribution in TSV-based 3-D processor-memory stacks SM Satheesh, E Salman IEEE Journal on Emerging and Selected Topics in Circuits and Systems 2 (4 …, 2012	44	2012
Worst case power/ground noise estimation using an equivalent transition time for resonance E Salman, EG Friedman, RM Secareanu, OL Hartin IEEE Transactions on Circuits and Systems I: Regular Papers 56 (5), 997-1004, 2009	44	2009
Boosting the efficiency of a footstep piezoelectric-stack energy harvester using the synchronized switch technology H Liu, R Hua, Y Lu, Y Wang, E Salman, J Liang Journal of intelligent material systems and structures 30 (6), 813-822, 2019	43	2019
Pessimism reduction in static timing analysis using interdependent setup and hold times E Salman, A Dasdan, F Taraporevala, K Kucukcakar, EG Friedman 7th International Symposium on Quality Electronic Design (ISQED'06), 6 pp.-164, 2006	39	2006
An overview of thermal challenges and opportunities for monolithic 3D ICs P Shukla, AK Coskun, VF Pavlidis, E Salman Proceedings of the 2019 on Great Lakes Symposium on VLSI, 439-444, 2019	37	2019
Perspective paper—Can AC computing be an alternative for wirelessly powered IoT devices? T Wan, Y Karimi, M Stanaćević, E Salman IEEE Embedded Systems Letters 9 (1), 13-16, 2017	35	2017
Design Methodology for Voltage-Scaled Clock Distribution Networks C Sitik, W Liu, B Taskin, E Salman IEEE Transactions on Very Large Scale Integration (VLSI) Systems 24 (10 …, 2016	35	2016
Hardware-efficient logic camouflaging for monolithic 3-D ICs C Yan, J Dofe, S Kontak, Q Yu, E Salman IEEE Transactions on Circuits and Systems II: Express Briefs 65 (6), 799-803, 2017	29	2017
Methodology for efficient substrate noise analysis in large-scale mixed-signal circuits E Salman, R Jakushokas, EG Friedman, RM Secareanu, OL Hartin IEEE Transactions on Very Large Scale Integration (VLSI) Systems 17 (10 …, 2009	29	2009
Switching Noise and Timing Characteristics in Nanoscale Integrated Circuits E Salman ProQuest, 2009	28	2009
Characterizing sequential cells using interdependent setup and hold times, and utilizing the sequential cell characterizations in static timing analysis A Dasdan, E Salman, FP Taraporevala, K Kucukcakar, Synopsys, Inc., ... US Patent 7,506,293, 2009	27	2009
AC computing methodology for RF-powered IoT devices T Wan, Y Karimi, M Stanaćević, E Salman IEEE Transactions on Very Large Scale Integration (VLSI) Systems 27 (5 …, 2019	26	2019
Transistor-level camouflaged logic locking method for monolithic 3D IC security J Dofe, C Yan, S Kontak, E Salman, Q Yu 2016 IEEE Asian Hardware-Oriented Security and Trust (AsianHOST), 1-6, 2016	26	2016

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