| Heterogeneous interconnect stitching technology with compressible microinterconnects for dense multi-die integration X Zhang, PK Jo, M Zia, GS May, MS Bakir IEEE Electron Device Letters 38 (2), 255-257, 2016 | 23 | 2016 |
| Design, fabrication, and characterization of dense compressible microinterconnects PK Jo, M Zia, JL Gonzalez, H Oh, MS Bakir IEEE Transactions on Components, Packaging and Manufacturing Technology 7 (7 …, 2017 | 19 | 2017 |
| Heterogeneous multi-die stitching enabled by fine-pitch and multi-height compressible microinterconnects (CMIs) PK Jo, X Zhang, JL Gonzalez, GS May, MS Bakir IEEE Transactions on Electron Devices 65 (7), 2957-2963, 2018 | 13 | 2018 |
| Flexible interconnect design using a mechanically-focused, multi-objective genetic algorithm JL Gonzalez, PK Jo, R Abbaspour, MS Bakir Journal of Microelectromechanical Systems 27 (4), 677-685, 2018 | 6 | 2018 |
| Dense and highly elastic compressible microinterconnects (CMIs) for electronic microsystems PK Jo, M Zia, JL Gonzalez, MS Bakir 2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 684-689, 2017 | 6 | 2017 |
| 3-D integrated electronic microplate platform for low-cost repeatable biosensing applications M Zia, T Chi, JS Park, A Su, JL Gonzalez, PK Jo, MP Styczynski, H Wang, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 6 …, 2016 | 6 | 2016 |
| Electrical characterization and benchmarking of polylithic integration using fused-silica stitch-chips with compressible microinterconnects for RF/mm-wave applications T Zheng, PK Jo, SK Rajan, MS Bakir IEEE Transactions on Components, Packaging and Manufacturing Technology 11 …, 2021 | 5 | 2021 |
| Polylithic integration for RF/MM-Wave chiplets using stitch-chips: Modeling, fabrication, and characterization T Zheng, PK Jo, SK Rajan, MS Bakir 2020 IEEE/MTT-S International Microwave Symposium (IMS), 1035-1038, 2020 | 5 | 2020 |
| Polylithic integration of 2.5-D and 3-D chiplets enabled by multi-height and fine-pitch CMIs PK Jo, SK Rajan, JL Gonzalez, MS Bakir IEEE Transactions on Components, Packaging and Manufacturing Technology 10 …, 2020 | 5 | 2020 |
| Heterogeneous multi-die stitching: Technology demonstration and design considerations PK Jo, MO Hossen, X Zhang, Y Zhang, MS Bakir 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 1512-1518, 2018 | 5 | 2018 |
| Multi-die polylithic integration enabled by heterogeneous interconnect stitching technology (HIST) PK Jo, T Zheng, MS Bakir 2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging …, 2018 | 4 | 2018 |
| A disposable and self-aligned 3-D integrated bio-sensing interface module for CMOS cell-based biosensor applications JL Gonzalez, PK Jo, R Abbaspour, MS Bakir IEEE Electron Device Letters 39 (8), 1215-1218, 2018 | 4 | 2018 |
| Interconnection technology innovations in 2.5 D integrated electronic systems PA Thadesar, PK Jo, MS Bakir Advances in Embedded and Fan‐Out Wafer‐Level Packaging Technologies, 501-520, 2019 | 3 | 2019 |
| Polylithic integration of heterogeneous multi-die enabled by compressible microinterconnects PK Jo Georgia Institute of Technology, 2019 | 2 | 2019 |
| Polylithic integration of 2.5 D and 3D Chiplets using interconnect stitching PK Jo, T Zheng, MS Bakir 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 1803-1808, 2019 | 2 | 2019 |
| Monolithic-like heterogeneously integrated microsystems using dense low-loss interconnects H Oh, X Zhang, PK Jo, GS May, MS Bakir 2017 IEEE 17th Topical Meeting on Silicon Monolithic Integrated Circuits in …, 2017 | 1 | 2017 |
| Heterogeneous Integration Enabled by 3D Stitch-Chips S Oh, Z Zhang, G Yan, PK Jo, MS Bakir IEEE Transactions on Components, Packaging and Manufacturing Technology, 2024 | | 2024 |
| Mechanically flexible interconnects, methods of making the same, and methods of use MS Bakir, PK Jo US Patent 10,636,731, 2020 | | 2020 |
| Heterogeneous Multi-Die High-Density Interconnect Stitching PK Jo, X Zhang, JL Gonzalez, MS Bakir | | |
| Heterogeneous 3D IC Stacking Using Ultra-Dense Mechanically Flexible Interconnects PK Jo, M Zia, JL Gonzalez, C Zhang, MS Bakir | | |
Muneeb ZiaResearch Engineer, Georgia Institute of TechnologyEmail yang diverifikasi di gatech.edu