| Three-Phase LLC Series Resonant DC/DC Converter Using SiC MOSFETs to Realize High-Voltage and High-Frequency Operation Y Nakakohara, H Otake, TM Evans, T Yoshida, M Tsuruya, K Nakahara IEEE Transactions on Industrial Electronics 63 (4), 2103-2110, 2015 | 129 | 2015 |
| PowerSynth: A power module layout generation tool TM Evans, Q Le, S Mukherjee, I Al Razi, T Vrotsos, Y Peng, HA Mantooth IEEE Transactions on Power Electronics 34 (6), 5063-5078, 2018 | 73 | 2018 |
| PowerSynth design automation flow for hierarchical and heterogeneous 2.5-D multichip power modules I Al Razi, Q Le, TM Evans, S Mukherjee, HA Mantooth, Y Peng IEEE Transactions on Power Electronics 36 (8), 8919-8933, 2021 | 42 | 2021 |
| Emerging trends in silicon carbide power electronics design HA Mantooth, T Evans, C Farnell, Q Le, R Murphree CPSS Transactions on Power Electronics and Applications 2 (3), 161-169, 2017 | 30 | 2017 |
| Development of SiC power devices and modules for automotive motor drive use T Evans, T Hanada, Y Nakano, T Nakamura 2013 IEEE International Meeting for Future of Electron Devices, Kansai, 116-117, 2013 | 23 | 2013 |
| Powersynth 2: Physical design automation for high-density 3-d multichip power modules I Al Razi, Q Le, TM Evans, HA Mantooth, Y Peng IEEE Transactions on Power Electronics 38 (4), 4698-4713, 2022 | 19 | 2022 |
| PEEC method and hierarchical approach towards 3D multichip power module (MCPM) layout optimization Q Le, T Evans, Y Peng, HA Mantooth 2019 IEEE International Workshop on Integrated Power Packaging (IWIPP), 131-136, 2019 | 19 | 2019 |
| Toward partial discharge reduction by corner correction in power module layouts S Mukherjee, T Evans, B Narayanasamy, Q Le, AI Emon, A Deshpande, ... 2018 IEEE 19th Workshop on Control and Modeling for Power Electronics …, 2018 | 19 | 2018 |
| Modeling and analysis of near-field radiated emission in wide bandgap power modules AI Emon, B Narayanasamy, TM Evans, F Luo, HA Mantooth 2019 International Symposium on Electromagnetic Compatibility-EMC EUROPE …, 2019 | 18 | 2019 |
| Electronic design automation (EDA) tools and considerations for electro-thermo-mechanical co-design of high voltage power modules TM Evans, S Mukherjee, Y Peng, HA Mantooth 2020 IEEE Energy Conversion Congress and Exposition (ECCE), 5046-5052, 2020 | 16 | 2020 |
| Response surface modeling for parasitic extraction for multi-objective optimization of multi-chip power modules (MCPMs) Q Le, T Evans, S Mukherjee, Y Peng, T Vrotsos, HA Mantooth 2017 IEEE 5th Workshop on Wide Bandgap Power Devices and Applications (WiPDA …, 2017 | 16 | 2017 |
| Electrothermal Cosimulation for Predicting the Power Loss and Temperature of SiC MOSFET Dies Assembled in a Power Module Y Nakamura, TM Evans, N Kuroda, H Sakairi, Y Nakakohara, H Otake, ... IEEE Transactions on Power Electronics 35 (3), 2950-2958, 2019 | 13 | 2019 |
| Fast and Accurate Parasitic Extraction in Multichip Power Module Design Automation Considering Eddy-Current Losses Q Le, I Al Razi, TM Evans, S Mukherjee, Y Peng, HA Mantooth IEEE Journal of Emerging and Selected Topics in Power Electronics 11 (6 …, 2022 | 12 | 2022 |
| Packaging issues for high-voltage power electronic modules SS Ang, T Evans, J Zhou, K Schirmer, H Zhang, B Rowden, J Balda, ... ECS Transactions 34 (1), 893, 2011 | 8 | 2011 |
| Development of EDA techniques for power module EMI modeling and layout optimization TM Evans, Q Le, B Narayanasamy, Y Peng, F Luo, HA Mantooth International Symposium on Microelectronics 2019 (1), 000193-000198, 2019 | 7 | 2019 |
| Placement and routing for power module layout TM Evans, Y Peng, HA Mantooth 2021 IEEE Design Methodologies Conference (DMC), 1-6, 2021 | 5 | 2021 |
| PowerSynth progression on layout optimization for reliability and signal integrity Y Peng, Q Le, I Al Razi, S Mukherjee, T Evans, HA Mantooth Nonlinear Theory and Its Applications, IEICE 11 (2), 124-144, 2020 | 4 | 2020 |
| A Partial Discharge Inception Voltage Modeling Approach S Mukherjee, TM Evans, DR Huitink, HA Mantooth IEEE Open Journal of Power Electronics 4, 148-160, 2023 | 2 | 2023 |
| Electro-Thermal Simulation for Predicting the Temperature of SiC Dies in the Power Module of a High Frequency Operating Power Converter Y Nakamura, TM Evans, H Otake, Y Nakakohara, H Sakairi, N Kuroda, ... PCIM Europe 2018; International Exhibition and Conference for Power …, 2018 | 2 | 2018 |
| VLSI-Inspired Design Automation for Scalable Power Electronics Layout Optimization TM Evans, Y Peng, HA Mantooth 2023 IEEE Design Methodologies Conference (DMC), 1-6, 2023 | 1 | 2023 |