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Takao SomeyaProfessor, Department of Electric and Electronic Engineering, The University of TokyoEmail verificata su ee.t.u-tokyo.ac.jp
Tomoyuki YokotaUniversity of TokyoEmail verificata su ntech.t.u-tokyo.ac.jp
Mitsuru TakenakaThe University of TokyoEmail verificata su mosfet.t.u-tokyo.ac.jp
Shinichi TakagiThe University of TokyoEmail verificata su ee.t.u-tokyo.ac.jp
Sanghyeon KimKAIST, KIST, imec, The University of TokyoEmail verificata su kaist.ac.kr
Yan Wang (王 燕)Guangdong Technion, Israel Institute of Technology; The University of Tokyo; Monash University (PhD)Email verificata su technion.ac.il
Hanbit JinETRIEmail verificata su etri.re.kr
Kenjiro FukudaThin-Film Device Laboratory, RIKENEmail verificata su riken.go.jp
Naoji MatsuhisaAssociate Professor, Research Center for Advanced Science and Technology, The University of TokyoEmail verificata su iis.u-tokyo.ac.jp
Amir ReuvenyCornell TechEmail verificata su cornell.edu
Takuya HoshiiTokyo Institute of TechnologyEmail verificata su m.titech.ac.jp
Ryosho NakaneThe University of TokyoEmail verificata su cryst.t.u-tokyo.ac.jp
Robert NawrockiAssistant Professor, Purdue UniversityEmail verificata su purdue.edu
Wonryung LeeKorea Institute of Science and Technology (KIST)Email verificata su kist.re.kr
Sungjun ParkElectrical and Computer Engineering, Ajou UniversityEmail verificata su ajou.ac.kr
Hyunjae LeeStaff Engineer, Material Development Team, Samsung Semiconductor R&D Center