| Heat transfer enhancement− A brief review of literature in 2020 and prospects Z Guo, L Cheng, H Cao, H Zhang, X Huang, J Min Heat transfer research 52 (10), 2021 | 39 | 2021 |
| Enhancement of hot spot cooling by capped diamond layer deposition for multifinger AlGaN/GaN HEMTs H Zhang, Z Guo, Y Lu IEEE Transactions on Electron Devices 67 (1), 47-52, 2019 | 31 | 2019 |
| Near-junction microfluidic cooling for GaN HEMT with capped diamond heat spreader H Zhang, Z Guo International Journal of Heat and Mass Transfer 186, 122476, 2022 | 27 | 2022 |
| Thickness dependence and anisotropy of capped diamond thermal conductivity on cooling of pulse-operated GaN HEMTs H Zhang, Z Guo IEEE Transactions on Components, Packaging and Manufacturing Technology 11 …, 2021 | 27 | 2021 |
| An overview of heat transfer enhancement literature in 2019 Z Guo, Y Tao, Y Nan, H Zhang, X Huang, H Cao, J Min, Y Cai, Y Hao, ... Heat Transfer Research 51 (9), 2020 | 18 | 2020 |
| Methods and Apparatus for Flow Balancing H Hemminger, H Zhang, Q Qi, C Chen, T Dunn US Patent App. 63/699,221, 2024 | | 2024 |
| Methods and Apparatus for Lift Pin Error Detection M Rickett, H Zhang, S Garg, T Dunn, R Fernandes US Patent App. 63/661,182, 2024 | | 2024 |
| Apparatus for a Substrate Support with Multi-Zone Control S Garg, H Zhang, T Dunn, R Muthaiah, P Sharma US Patent App. 63/613,195, 2023 | | 2023 |
| Methods and Apparatus for a Susceptor Assembly S Garg, H Zhang, T Dunn, G Jackson US Patent App. 63/535,658, 2023 | | 2023 |
| Thermal Switch for Wafer Temperature Modulation H Zhang US Patent App. 63/536,044, 2023 | | 2023 |
| Near-Junction Cooling of GaN HEMT by Capped Diamond Heat Spreader and Embedded Microchannels H Zhang Rutgers The State University of New Jersey, School of Graduate Studies, 2022 | | 2022 |
Zhixiong GuoProfessor, Rutgers University, Mechanical and Aerospace EngineeringEmail verificata su jove.rutgers.edu