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Xiaofeng QianAssociate Professor, Department of Materials Science and Engineering, Texas A&M UniversityEmail verificata su tamu.edu- Ju LiProfessor of Nuclear Science and Engineering and Materials Science and Engineering, MIT, USAEmail verificata su mit.edu
- Haowei XuMITEmail verificata su mit.edu
- Jian ZhouProfessor, MSE, Xi'an Jiaotong UniversityEmail verificata su xjtu.edu.cn
- Guiyin XuDonghua University; Massachusetts Institute of TechnologyEmail verificata su mit.edu
- Liang FuMassachusetts Institute of TechnologyEmail verificata su mit.edu
- Ri HeNingbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences,Email verificata su nimte.ac.cn
- Fei XueZhejiang UniversityEmail verificata su zju.edu.cn
- Ying WangAssistant Professor, ECE, University of Wisconsin-MadisonEmail verificata su wisc.edu
- Xiang ZHANGUniversity of Hong KongEmail verificata su hku.hk
- Aaron M. LindenbergProfessor, Department of Materials Science and Engineering / Photon Science, Stanford/SLACEmail verificata su stanford.edu
- Wenbin LiAssistant Professor at Westlake UniversityEmail verificata su westlake.edu.cn
- Shi LiuWestlake UniversityEmail verificata su westlake.edu.cn
- Haiyan WangPurdue UniversityEmail verificata su purdue.edu
- Yishu ZhangZhejiang UniversityEmail verificata su zju.edu.cn
- Kai ChangInstitute of Semiconductors, CASEmail verificata su semi.ac.cn
- Ching-Wu ChuUniversity of HoustonEmail verificata su uh.edu
- Enzheng ShiAssistant Professor, PI, Westlake University, School of EngineeringEmail verificata su westlake.edu.cn
- Jingshan Qi (齐景山)Jiangsu Normal UniversityEmail verificata su jsnu.edu.cn
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Hua Wang
Zhejiang University; Massachusetts Institute of Technology; Texas A&M University
Email verificata su mit.edu - Home page