| A review of thickness measurements of thick transparent layers using optical interferometry J Park, JA Kim, H Ahn, J Bae, J Jin International Journal of Precision Engineering and Manufacturing 20, 463-477, 2019 | 91 | 2019 |
| Uncertainty improvement of geometrical thickness and refractive index measurement of a silicon wafer using a femtosecond pulse laser S Maeng, J Park, B O, J Jin Optics Express 20 (11), 12184-12190, 2012 | 68 | 2012 |
| Measurement of thickness profile and refractive index variation of a silicon wafer using the optical comb of a femtosecond pulse laser J Park, J Jin, JW Kim, JA Kim Optics Communications 305, 170-174, 2013 | 48 | 2013 |
| Vibration-insensitive measurements of the thickness profile of large glass panels J Park, J Bae, J Jin, JA Kim, JW Kim Optics Express 23 (26), 32941-32949, 2015 | 40 | 2015 |
| Absolute distance measurement method without a non-measurable range and directional ambiguity based on the spectral-domain interferometer using the optical comb of the … J Park, J Jin, JA Kim, JW Kim Applied Physics Letters 109 (24), 2016 | 35 | 2016 |
| Fizeau-type interferometric probe to measure geometrical thickness of silicon wafers J Jin, S Maeng, J Park, JA Kim, JW Kim Optics express 22 (19), 23427-23432, 2014 | 34 | 2014 |
| Modified Roberts-Langenbeck test for measuring thickness and refractive index variation of silicon wafers J Park, L Chen, Q Wang, U Griesmann Optics Express 20 (18), 20078-20089, 2012 | 31 | 2012 |
| Vibration-desensitized interferometer by continuous phase shifting with high-speed fringe capturing J Park, SW Kim Optics Letters 35 (1), 19-21, 2009 | 31 | 2009 |
| Total physical thickness measurement of a multi-layered wafer using a spectral-domain interferometer with an optical comb J Bae, J Park, H Ahn, J Jin Optics Express 25 (11), 12689-12697, 2017 | 30 | 2017 |
| A novel method for simultaneous measurement of thickness, refractive index, bow, and warp of a large silicon wafer using a spectral-domain interferometer J Park, J Bae, YS Jang, J Jin Metrologia 57 (6), 064001, 2020 | 23 | 2020 |
| Sub-100-nm precision distance measurement by means of all-fiber photonic microwave mixing YS Jang, J Park, J Jin Optics Express 29 (8), 12229-12239, 2021 | 21 | 2021 |
| Optical method for simultaneous thickness measurements of two layers with a significant thickness difference J Bae, J Park, H Ahn, J Jin Optics Express 29 (20), 31615-31631, 2021 | 20 | 2021 |
| Physical thickness and group refractive index measurement of individual layers for double-stacked microstructures using spectral-domain interferometry J Park, J Bae, JA Kim, J Jin Optics Communications 431, 181-186, 2019 | 20 | 2019 |
| A hybrid non-destructive measuring method of three-dimensional profile of through silicon vias for realization of smart devices H Ahn, J Bae, J Park, J Jin Scientific Reports 8 (1), 15342, 2018 | 19 | 2018 |
| Simultaneous measurement method of the physical thickness and group refractive index free from a non-measurable range J Park, H Mori, J Jin Optics Express 27 (17), 24682-24692, 2019 | 18 | 2019 |
| Comb-mode resolved spectral domain interferometer enabled by a broadband electro-optic frequency comb YS Jang, J Park, J Jin Photonics Research 11 (1), 72-80, 2022 | 17 | 2022 |
| Optical fiber-based confocal and interferometric system for measuring the depth and diameter of through silicon vias H Ahn, J Park, JA Kim, J Jin Journal of Lightwave Technology 34 (23), 5462-5466, 2016 | 17 | 2016 |
| Periodic-error-free all-fiber distance measurement method with photonic microwave modulation toward on-chip-based devices YS Jang, J Park, J Jin IEEE Transactions on Instrumentation and Measurement 71, 1-7, 2022 | 16 | 2022 |
| Precise thickness profile measurement insensitive to spatial and temporal temperature gradients on a large glass substrate J Park, H Mori, YS Jang, J Jin Applied Optics 59 (20), 5881-5887, 2020 | 16 | 2020 |
| Precise measurement of the thickness of silicon wafers by double-sided interferometer and bilateral comparison A Hirai, Y Bitou, J Bae, J Park, J Jin Metrologia 58 (5), 054002, 2021 | 14 | 2021 |