| Subsurface damage and phase transformation in laser-assisted nanometric cutting of single crystal silicon X Chen, C Liu, J Ke, J Zhang, X Shu, J Xu Materials & Design 190, 108524, 2020 | 107 | 2020 |
| Numerical investigation on subsurface damage in nanometric cutting of single-crystal silicon at elevated temperatures C Liu, X Chen, J Ke, Z She, J Zhang, J Xiao, J Xu Journal of Manufacturing Processes 68, 1060-1071, 2021 | 51 | 2021 |
| Thermal conductivity of cross-linked polyethylene from molecular dynamics simulation X Xiong, M Yang, C Liu, X Li, D Tang Journal of Applied Physics 122 (3), 2017 | 46 | 2017 |
| Enhancing the ductile machinability of single-crystal silicon by laser-assisted diamond cutting J Ke, X Chen, C Liu, J Zhang, H Yang, J Xu The International Journal of Advanced Manufacturing Technology, 1-18, 2022 | 34 | 2022 |
| Fundamental investigation of subsurface damage on the quality factor of hemispherical fused silica shell resonator J Chu, X Liu, C Liu, J Zhang, J Xiao, X Wang, X Chen, J Xu Sensors and Actuators A: Physical 335, 113365, 2022 | 29 | 2022 |
| Molecular dynamics simulation on cutting mechanism in the hybrid machining process of single-crystal silicon C Liu, W He, J Chu, J Zhang, X Chen, J Xiao, J Xu Nanoscale Research Letters 16, 1-15, 2021 | 29 | 2021 |
| Machinability of single crystal calcium fluoride by applying elliptical vibration diamond cutting J Zhang, J Zhang, C Liu, X Chen, J Xiao, J Xu Precision Engineering 66, 306-314, 2020 | 29 | 2020 |
| Experimental investigation on the ductile machinability of fused silica during in-situ laser assisted diamond cutting C Lin, X Chen, W He, G Xu, C Liu, J Zhang, J Xu Journal of Manufacturing Processes 84, 383-393, 2022 | 27 | 2022 |
| Molecular dynamics simulation on crystal defects of single-crystal silicon during elliptical vibration cutting C Liu, S To, X Sheng, J Xu International Journal of Mechanical Sciences 244, 108072, 2023 | 25 | 2023 |
| Numerical investigation on the temperature effect in nanometric cutting of polycrystalline silicon C Liu, W Xu, J Zhang, J Xiao, X Chen, J Xu International Journal of Mechanical Sciences 220, 107172, 2022 | 22 | 2022 |
| Numerical investigation on material removal mechanism in elliptical vibration cutting of single-crystal silicon C Liu, J Zhang, J Zhang, J Chu, X Chen, J Xiao, J Xu Materials Science in Semiconductor Processing 134, 106019, 2021 | 18 | 2021 |
| A simulation investigation on elliptical vibration cutting of single-crystal silicon C Liu, J Zhang, J Zhang, X Chen, J Xiao, J Xu The International Journal of Advanced Manufacturing Technology 108, 2231-2243, 2020 | 17 | 2020 |
| Effect of temperature on ductile-to-brittle transition in diamond cutting of silicon W He, C Liu, G Xu, J Zhang, J Xiao, X Chen, J Xu The International Journal of Advanced Manufacturing Technology 116, 3447-3462, 2021 | 16 | 2021 |
| Effect of tool rake angle on the material removal mechanism transition of single-crystal silicon: a molecular dynamics study C Liu, J Chu, J Zhang, J Zhang, X Chen, J Xiao, J Xu The International Journal of Advanced Manufacturing Technology 115, 3631-3644, 2021 | 16 | 2021 |
| Ultra-precision cutting characteristics of binderless tungsten carbide by in-heat-process laser-assisted diamond machining J Ke, X Chen, C Liu, G Xu, Z She, J Zhang, J Xu International Journal of Refractory Metals and Hard Materials 115, 106311, 2023 | 14 | 2023 |
| Atomic-scale investigation of Pt composition on deformation mechanism of AuPt alloy during nano-scratching process C Liu, Z Zhuang, J Chen, WS Yip, S To Surfaces and Interfaces 40, 103126, 2023 | 11 | 2023 |
| Molecular dynamics simulation on structure evolution of silica glass in nano-cutting at high temperature C Liu, J Chu, X Chen, J Xiao, J Xu Molecular Simulation 46 (13), 957-965, 2020 | 11 | 2020 |
| Molecular dynamic simulation of tool groove wear in nanoscale cutting of silicon C Liu, X Chen, J Zhang, J Zhang, J Chu, J Xiao, J Xu AIP Advances 10 (1), 2020 | 11 | 2020 |
| Investigation on system design methodology and cutting force optimization in laser-assisted diamond machining of single-crystal silicon J Ke, Y Fu, C Liu, J Zhang, X Chen, J Xu Journal of Manufacturing Processes 115, 1-17, 2024 | 8 | 2024 |
| Influence of micro grooves of diamond tool on silicon cutting: a molecular dynamic study C Liu, J Zhang, J Zhang, X Chen, W He, J Xiao, J Xu Molecular Simulation 46 (2), 92-101, 2020 | 6 | 2020 |
Jianfeng XuHuazhong University of Science and TechnologyEmail verificata su hust.edu.cn
