| Dielectric constant and refractive index of poly (siloxane–imide) block copolymer MBH Othman, MR Ramli, LY Tyng, Z Ahmad, HM Akil Materials & Design 32 (6), 3173-3182, 2011 | 79 | 2011 |
| Cross-link network of polydimethylsiloxane via addition and condensation (RTV) mechanisms. Part I: Synthesis and thermal properties MR Ramli, MBH Othman, A Arifin, Z Ahmad Polymer degradation and stability 96 (12), 2064-2070, 2011 | 56 | 2011 |
| Effect of crosslink density on the refractive index of a polysiloxane network based on 2, 4, 6, 8‐tetramethyl‐2, 4, 6, 8‐tetravinylcyclotetrasiloxane LY Tyng, MR Ramli, MBH Othman, R Ramli, ZAM Ishak, Z Ahmad Polymer international 62 (3), 382-389, 2013 | 47 | 2013 |
| Stretchable conductive ink based on polysiloxane–silver composite and its application as a frequency reconfigurable patch antenna for wearable electronics MR Ramli, S Ibrahim, Z Ahmad, ISZ Abidin, MF Ain ACS applied materials & interfaces 11 (31), 28033-28042, 2019 | 42 | 2019 |
| Effect of cross-link density on optoelectronic properties of thermally cured 1, 2-epoxy-5-hexene incorporated polysiloxane SN Yahya, CK Lin, MR Ramli, M Jaafar, Z Ahmad Materials & Design 47, 416-423, 2013 | 25 | 2013 |
| Alignment of silver nanoparticles in polysiloxane crosslink network under direct electric field MS Masraff, AMNAA Rahman, MR Ramli, MKM Jamil, MK Abdullah, ... Composites Science and Technology 203, 108611, 2021 | 19 | 2021 |
| Crosslink network and phenyl content on the optical, hardness, and thermal aging of PDMS LED encapsulant M Lay, MR Ramli, R Ramli, NC Mang, Z Ahmad Journal of Applied Polymer Science 136 (34), 47895, 2019 | 16 | 2019 |
| Investigation of hygrothermally induced failures in multilayer ceramic capacitors during thermal reflow process RK Apalowo, A Abas, Z Bachok, MFM Sharif, FC Ani, MR Ramli, ... Microelectronics Reliability 146, 115028, 2023 | 10 | 2023 |
| Synthesis of carbazole‐substituted poly (dimethylsiloxane) and its improved refractive index NH Nordin, MR Ramli, N Othman, Z Ahmad Journal of Applied Polymer Science 132 (11), 2015 | 9 | 2015 |
| Thermal cycling effect on the crack formation of solder joint in ball grid array package MF Suhaimi, MA Bakar, A Jalar, FC Ani, MR Ramli Journal of Physics: Conference Series 2169 (1), 012006, 2022 | 7 | 2022 |
| Effect of moisture content on crack formation during reflow soldering of ball grid array (BGA) component SMMSM Zain, FC Ani, MR Ramli, A Jalar, MA Bakar International Conference on Innovative Technology, Engineering and Science …, 2020 | 7 | 2020 |
| Interphase volume calculation of polyimide/TiO2 nanofibers nanocomposite based on dielectric constant model and its effect on glass transition M Lay, S Meng, MR Ramli, Z Ahmad, H Ismail, TS Huat, M Todo Journal of Materials Science: Materials in Electronics 29, 20742-20749, 2018 | 7 | 2018 |
| Effect of alloy particle size and stencil aperture shape on solder printing quality MS Mohamed Sunar, M Abu Bakar, A Jalar, MR Ramli, F Che Ani Microelectronics International 39 (2), 81-90, 2022 | 6 | 2022 |
| Numerical modelling of the delamination in multi-layered ceramic capacitor during the thermal reflow process FC Ng, A Abas, MR Ramli, MFM Sharif, FC Ani Soldering & Surface Mount Technology 35 (3), 166-174, 2022 | 5 | 2022 |
| Effect of potting encapsulation on crack formation and propagation in electronic package A Jalar, SMMSM Zain, FC Ani, MR Ramli, MA Bakar International Conference on Innovative Technology, Engineering and Science …, 2020 | 5 | 2020 |
| Surface roughness effect on optical loss in waveguide using isotropically induced crosslink network of siloxane–polyimide copolymer NF Mohd Ibrahim, MR Ramli, A Rusli, MK Abd Rahman, Z Ahmad Journal of Applied Polymer Science 137 (47), 49554, 2020 | 5 | 2020 |
| Numerical investigation of thermal fatigue crack growth behavior in SAC305 BGA solder joints RK Apalowo, MA Abas, MAF Muhamed Mukhtar, F Che Ani, MR Ramli Soldering & Surface Mount Technology 36 (2), 101-110, 2024 | 4 | 2024 |
| Thermal fatigue life prediction and intermetallic compound behaviour of SAC305 BGA solder joints subject to accelerated thermal cycling test RK Apalowo, MA Abas, F Che Ani, MAF Muhamed Mukhtar, MR Ramli Soldering & Surface Mount Technology 36 (3), 154-164, 2024 | 2 | 2024 |
| Investigation of moisture-induced crack propagation in the soft-termination multi-layer ceramic capacitor during thermal reflow process Z Bachok, A Abas, HAL Raja Gobal, N Yusoff, MR Ramli, MF Mohd Sharif, ... Soldering & Surface Mount Technology 35 (5), 305-318, 2023 | 2 | 2023 |
| Effect of stencil wall aperture on solder paste release via stencil printing MSM Sunar, MA Bakar, A Jalar, FC Ani, MR Ramli Journal of Physics: Conference Series 2169 (1), 012037, 2022 | 2 | 2022 |