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Liancheng WangCollege of Mechanical and Electrical Engineering, Central South University, Changsha Hunan, ChinaEmail verificata su semi.ac.cn
Hongwei ZhuTsinghua UniversityEmail verificata su tsinghua.edu.cn
Manijeh RazeghiNorthwestern UniversityEmail verificata su eecs.northwestern.edu
Arash DehzangiAssistant Professor at Northwestern UniversityEmail verificata su northwestern.edu
Hongjian LiSolid State Lighting & Energy Electronics Center, UCSBEmail verificata su ucsb.edu
Panpan LiUniversity of California, Santa BarbaraEmail verificata su ucsb.edu
Hoi Wai ChoiProfessor, Electrical and Electronic Engineering, The University of Hong KongEmail verificata su hku.hk
Abbas HaddadiResearch Assistant Professor at Northwestern UniversityEmail verificata su u.northwestern.edu
Romain ChevallierNorthwestern UniversityEmail verificata su u.northwestern.edu
Lining LiuInstitute of Semiconductors, Chinese Academy of SciencesEmail verificata su semi.ac.cn
Zi-Hui ZhangProfessor, Hebei University of TechnologyEmail verificata su hebut.edu.cn
liu zhiqiangInstitute of Semiconductors, Chinese Academy of SciencesEmail verificata su semi.ac.cn
Jianlong XuInstitute of Functional Nano & Soft Materials, Soochow UniversityEmail verificata su suda.edu.cn
Jian-An HuangAssistant Professor, Academy Research Fellow, and Group Leader, University of OuluEmail verificata su oulu.fi
Donghai WuInstitute of Semiconductor, CASEmail verificata su semi.ac.cn
Segui![Yiyun Zhang](https://usercontent.cljtscd.com/citations?view_op=view_photo&user=YxLX2rUAAAAJ&citpid=3)
Yiyun Zhang
Institute of Semiconcutors, Chinese Academy of Sciences
Email verificata su semi.ac.cn