| Determination of Anand constants for SAC solders using stress-strain or creep data M Motalab, Z Cai, JC Suhling, P Lall 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in …, 2012 | 224 | 2012 |
| Improved predictions of lead free solder joint reliability that include aging effects M Motalab, Z Cai, JC Suhling, J Zhang, JL Evans, MJ Bozack, P Lall 2012 IEEE 62nd Electronic Components and Technology Conference, 513-531, 2012 | 144 | 2012 |
| Correlation of reliability models including aging effects with thermal cycling reliability data M Motalab, M Mustafa, JC Suhling, J Zhang, J Evans, MJ Bozack, P Lall 2013 IEEE 63rd Electronic Components and Technology Conference, 986-1004, 2013 | 131 | 2013 |
| The effects of aging on the Anand viscoplastic constitutive model for SAC305 solder MM Basit, M Motalab, JC Suhling, P Lall Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena …, 2014 | 109 | 2014 |
| Thermal cycling reliability of aged PBGA assemblies-comparison of Weibull failure data and finite element model predictions MM Basit, M Motalab, JC Suhling, Z Hai, J Evans, MJ Bozack, P Lall 2015 IEEE 65th electronic components and technology conference (ECTC), 106-117, 2015 | 72 | 2015 |
| The Anand parameters for SAC solders after extreme aging M Basit, S Ahmed, M Motalab, JC Roberts, JC Suhling, P Lall 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2016 | 60 | 2016 |
| Graphene and its elemental analogue: A molecular dynamics view of fracture phenomenon T Rakib, S Mojumder, S Das, S Saha, M Motalab Physica B: Condensed Matter 515, 67-74, 2017 | 57 | 2017 |
| Investigation on the mechanical properties and fracture phenomenon of silicon doped graphene by molecular dynamics simulation MH Rahman, S Mitra, M Motalab, P Bose RSC advances 10 (52), 31318-31332, 2020 | 37 | 2020 |
| Investigation on mechanical properties of polycrystalline W nanowire S Saha, MA Motalab, M Mahboob Computational Materials Science 136, 52-59, 2017 | 37 | 2017 |
| Atomistic representation of anomalies in the failure behaviour of nanocrystalline silicene T Rakib, S Saha, M Motalab, S Mojumder, MM Islam Scientific Reports 7 (1), 14629, 2017 | 35 | 2017 |
| Nature of creep deformation in nanocrystalline Tungsten S Saha, M Motalab Computational Materials Science 149, 360-372, 2018 | 34 | 2018 |
| Atomistic investigations on the mechanical properties and fracture mechanisms of indium phosphide nanowires TH Pial, T Rakib, S Mojumder, M Motalab, MAS Akanda Physical Chemistry Chemical Physics 20 (13), 8647-8657, 2018 | 34 | 2018 |
| Characterization of microprocessor chip stress distributions during component packaging and thermal cycling J Roberts, S Hussain, MK Rahim, M Motalab, JC Suhling, RC Jaeger, ... 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC …, 2010 | 32 | 2010 |
| A constitutive model for lead free solder including aging effects and its application to microelectronic packaging M Motalab Auburn University, 2013 | 30 | 2013 |
| Tuning the mechanical properties of silicene nanosheet by auxiliary cracks: a molecular dynamics study SM Nahid, S Nahian, M Motalab, T Rakib, S Mojumder, MM Islam RSC advances 8 (53), 30354-30365, 2018 | 28 | 2018 |
| Atomistic analysis to characterize the impact of temperature and defects on the mechanical properties of germanene sheet R Paul, T Tasnim, S Saha, M Motalab Materials Research Express 5 (1), 015062, 2018 | 27 | 2018 |
| Viscoplastic constitutive model for lead-free solder including effects of silver content, solidification profile, and severe aging M Basit, M Motalab, JC Suhling, P Lall International Electronic Packaging Technical Conference and Exhibition 56895 …, 2015 | 27 | 2015 |
| Atomistic insights into mechanical and thermal properties of stanene with defects S Das, S Mojumder, T Rakib, MM Islam, M Motalab Physica B: Condensed Matter 553, 127-136, 2019 | 26 | 2019 |
| Atomistic study of hardening mechanism in Al-Cu nanostructure S Mojumder, T Rakib, M Motalab Journal of Nanoparticle Research 21, 1-12, 2019 | 25 | 2019 |
| Atomistic analysis of the thermomechanical properties of Sn–Ag–Cu solder materials at the nanoscale with the MEAM potential M Motalab, R Paul, S Saha, S Mojumder, T Ahmed, JC Suhling Journal of molecular modeling 25, 1-10, 2019 | 25 | 2019 |
