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Sedat Bingol
Sedat Bingol
Affiliazione sconosciuta
Email verificata su dicle.edu.tr
Titolo
Citata da
Citata da
Anno
Natural fibre-reinforced composite for ballistic applications: A review
KO Odesanya, R Ahmad, M Jawaid, S Bingol, GO Adebayo, YH Wong
Journal of Polymers and the Environment 29 (12), 3795-3812, 2021
542021
Optimizing cutting conditions and prediction of surface roughness in face milling of AZ61 using regression analysis and artificial neural network
NH Alharthi, S Bingol, AT Abbas, AE Ragab, EA El-Danaf, HF Alharbi
Advances in Materials Science and Engineering 2017 (1), 7560468, 2017
362017
Constituents and performance of no-clean flux for electronic solder
S Wakeel, A Haseeb, MA Afifi, S Bingol, KL Hoon
Microelectronics Reliability 123, 114177, 2021
332021
Extrusion load prediction of gear-like profile for different die geometries using ANN and FEM with experimental verification
S Bingöl, Ö Ayer, T Altinbalik
The International Journal of Advanced Manufacturing Technology 76, 983-992, 2015
302015
Selection of sustainable material for the manufacturing of complex automotive products using a new hybrid Goal Programming Model for Best Worst Method–Proximity Indexed Value …
S Wakeel, S Bingol, MN Bashir, S Ahmad
Proceedings of the Institution of Mechanical Engineers, Part L: Journal of …, 2021
292021
Prediction of cutting conditions in turning AZ61 and parameters optimization using regression analysis and artificial neural network
NH Alharthi, S Bingol, AT Abbas, AE Ragab, MF Aly, HF Alharbi
Advances in Materials Science and Engineering 2018 (1), 1825291, 2018
222018
Analysis of extrusion welding in magnesium alloys–numerical predictions and metallurgical verification
N Alharthi, S Bingöl, A Ventura, W Misiolek
Procedia engineering 81, 658-663, 2014
192014
Selection of Automotive Brake Material Using Different MCDM Techniques and Their Comparisons.
F Jahan, M Soni, S Wakeel, S Ahmad, S Bingol
Journal of Engineering Science & Technology Review 15 (1), 2022
162022
Effect of different extrusion temperature and speed on extrusion welds
S Bingöl, MS Keskin
Journal of achievements in materials and manufacturing engineering 23 (2), 39-42, 2007
152007
A new hybrid LGPMBWM-PIV method for automotive material selection
S Wakeel, S Bingol, S Ahmad, MN Bashir, MSMM Emamat, Z Ding, ...
Informatica 45 (1), 2021
142021
Application of gene expression programming in hot metal forming for intelligent manufacturing
S Bingöl, HY Kılıçgedik
Neural Computing and Applications 30, 937-945, 2018
142018
Experimental and numerical study on the strength of aluminum extrusion welding
S Bingöl, A Bozacı
Materials 8 (7), 4389-4399, 2015
142015
A hybrid multi-criteria decision making method for robot selection in flexible manufacturing system
S Ahmad, S Bingöl, S Wakeel
Middle East Journal of Science 6 (2), 68-77, 2020
112020
Prediction of the true stress of ZE20 magnesium alloy at different temperatures and strain rates
S Bingöl, W Misiolek, S Bingöl, W Misiolek
Stroj. Vestnik/Journal Mech. Eng 61 (10), 610-617, 2015
112015
Effect of cobalt nanoparticles on mechanical properties of Sn–58Bi solder joint
MN Bashir, HM Saad, M Rizwan, S Bingöl, IA Channa, M Gul, A Haseeb, ...
Journal of Materials Science. Materials in Electronics 33 (28), 22573-22579, 2022
102022
Effect of cobalt nanoparticles on mechanical properties of Sn–58Bi solder joint
M Nasir Bashir, HM Saad, M Rizwan, S Bingöl, IA Channa, M Gul, ...
Journal of Materials Science: Materials in Electronics 33 (28), 22573-22579, 2022
82022
A quality problem in seam welds in aluminum extrusion
S Bingöl, MS Keskin
Archives of Materials Science and Engineering 28 (7), 397-400, 2007
82007
An extrusion simulation of an aluminum profile by porthole die
Ö Ayer, S Bingöl, İ Karakaya
Vibroengineering procedia 27, 139-144, 2019
72019
A novel approach based on grey simplified best–worst method and grey possibility degree for evaluating materials in semiconductor industries
MSMM Emamat, S Wakeel, M Amiri, S Ahmad, S Bingol
Soft Computing 27 (22), 17043-17062, 2023
62023
Supplier selection for high temperature die attach by hybrid entropy-range of value MCDM technique: a semiconductor industry
S Wakeel, S Ahmad, S Bingol, MN Bashir, TC Paçal, ZA Khan
2020 21st International Conference on Electronic Packaging Technology (ICEPT …, 2020
62020
Il sistema al momento non può eseguire l'operazione. Riprova più tardi.
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