Natural fibre-reinforced composite for ballistic applications: A review KO Odesanya, R Ahmad, M Jawaid, S Bingol, GO Adebayo, YH Wong Journal of Polymers and the Environment 29 (12), 3795-3812, 2021 | 54 | 2021 |
Optimizing cutting conditions and prediction of surface roughness in face milling of AZ61 using regression analysis and artificial neural network NH Alharthi, S Bingol, AT Abbas, AE Ragab, EA El-Danaf, HF Alharbi Advances in Materials Science and Engineering 2017 (1), 7560468, 2017 | 36 | 2017 |
Constituents and performance of no-clean flux for electronic solder S Wakeel, A Haseeb, MA Afifi, S Bingol, KL Hoon Microelectronics Reliability 123, 114177, 2021 | 33 | 2021 |
Extrusion load prediction of gear-like profile for different die geometries using ANN and FEM with experimental verification S Bingöl, Ö Ayer, T Altinbalik The International Journal of Advanced Manufacturing Technology 76, 983-992, 2015 | 30 | 2015 |
Selection of sustainable material for the manufacturing of complex automotive products using a new hybrid Goal Programming Model for Best Worst Method–Proximity Indexed Value … S Wakeel, S Bingol, MN Bashir, S Ahmad Proceedings of the Institution of Mechanical Engineers, Part L: Journal of …, 2021 | 29 | 2021 |
Prediction of cutting conditions in turning AZ61 and parameters optimization using regression analysis and artificial neural network NH Alharthi, S Bingol, AT Abbas, AE Ragab, MF Aly, HF Alharbi Advances in Materials Science and Engineering 2018 (1), 1825291, 2018 | 22 | 2018 |
Analysis of extrusion welding in magnesium alloys–numerical predictions and metallurgical verification N Alharthi, S Bingöl, A Ventura, W Misiolek Procedia engineering 81, 658-663, 2014 | 19 | 2014 |
Selection of Automotive Brake Material Using Different MCDM Techniques and Their Comparisons. F Jahan, M Soni, S Wakeel, S Ahmad, S Bingol Journal of Engineering Science & Technology Review 15 (1), 2022 | 16 | 2022 |
Effect of different extrusion temperature and speed on extrusion welds S Bingöl, MS Keskin Journal of achievements in materials and manufacturing engineering 23 (2), 39-42, 2007 | 15 | 2007 |
A new hybrid LGPMBWM-PIV method for automotive material selection S Wakeel, S Bingol, S Ahmad, MN Bashir, MSMM Emamat, Z Ding, ... Informatica 45 (1), 2021 | 14 | 2021 |
Application of gene expression programming in hot metal forming for intelligent manufacturing S Bingöl, HY Kılıçgedik Neural Computing and Applications 30, 937-945, 2018 | 14 | 2018 |
Experimental and numerical study on the strength of aluminum extrusion welding S Bingöl, A Bozacı Materials 8 (7), 4389-4399, 2015 | 14 | 2015 |
A hybrid multi-criteria decision making method for robot selection in flexible manufacturing system S Ahmad, S Bingöl, S Wakeel Middle East Journal of Science 6 (2), 68-77, 2020 | 11 | 2020 |
Prediction of the true stress of ZE20 magnesium alloy at different temperatures and strain rates S Bingöl, W Misiolek, S Bingöl, W Misiolek Stroj. Vestnik/Journal Mech. Eng 61 (10), 610-617, 2015 | 11 | 2015 |
Effect of cobalt nanoparticles on mechanical properties of Sn–58Bi solder joint MN Bashir, HM Saad, M Rizwan, S Bingöl, IA Channa, M Gul, A Haseeb, ... Journal of Materials Science. Materials in Electronics 33 (28), 22573-22579, 2022 | 10 | 2022 |
Effect of cobalt nanoparticles on mechanical properties of Sn–58Bi solder joint M Nasir Bashir, HM Saad, M Rizwan, S Bingöl, IA Channa, M Gul, ... Journal of Materials Science: Materials in Electronics 33 (28), 22573-22579, 2022 | 8 | 2022 |
A quality problem in seam welds in aluminum extrusion S Bingöl, MS Keskin Archives of Materials Science and Engineering 28 (7), 397-400, 2007 | 8 | 2007 |
An extrusion simulation of an aluminum profile by porthole die Ö Ayer, S Bingöl, İ Karakaya Vibroengineering procedia 27, 139-144, 2019 | 7 | 2019 |
A novel approach based on grey simplified best–worst method and grey possibility degree for evaluating materials in semiconductor industries MSMM Emamat, S Wakeel, M Amiri, S Ahmad, S Bingol Soft Computing 27 (22), 17043-17062, 2023 | 6 | 2023 |
Supplier selection for high temperature die attach by hybrid entropy-range of value MCDM technique: a semiconductor industry S Wakeel, S Ahmad, S Bingol, MN Bashir, TC Paçal, ZA Khan 2020 21st International Conference on Electronic Packaging Technology (ICEPT …, 2020 | 6 | 2020 |