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Jung Ho Shin
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Anno
Micro light‐emitting diodes for display and flexible biomedical applications
HE Lee, JH Shin, JH Park, SK Hong, SH Park, SH Lee, JH Lee, IS Kang, ...
Advanced Functional Materials 29 (24), 1808075, 2019
2122019
Novel electronics for flexible and neuromorphic computing
HE Lee, JH Park, TJ Kim, D Im, JH Shin, DH Kim, B Mohammad, IS Kang, ...
Advanced Functional Materials 28 (32), 1801690, 2018
1292018
Monolithic flexible vertical GaN light‐emitting diodes for a transparent wireless brain optical stimulator
HE Lee, JH Choi, SH Lee, M Jeong, JH Shin, DJ Joe, DH Kim, CW Kim, ...
Advanced Materials 30 (28), 1800649, 2018
1262018
Wireless powered wearable micro light-emitting diodes
HE Lee, D Lee, TI Lee, JH Shin, GM Choi, C Kim, SH Lee, JH Lee, ...
Nano Energy 55, 454-462, 2019
1082019
Trichogenic photostimulation using monolithic flexible vertical AlGaInP light-emitting diodes
HE Lee, SH Lee, M Jeong, JH Shin, Y Ahn, D Kim, SH Oh, SH Yun, ...
ACS nano 12 (9), 9587-9595, 2018
872018
Optogenetic control of body movements via flexible vertical light-emitting diodes on brain surface
SH Lee, J Kim, JH Shin, HE Lee, IS Kang, K Gwak, DS Kim, D Kim, KJ Lee
Nano Energy 44, 447-455, 2018
842018
Optogenetic brain neuromodulation by stray magnetic field via flash-enhanced magneto-mechano-triboelectric nanogenerator
HE Lee, JH Park, D Jang, JH Shin, TH Im, JH Lee, SK Hong, HS Wang, ...
Nano Energy 75, 104951, 2020
742020
Hierarchically Surface‐Textured Ultrastable Hybrid Film for Large‐Scale Triboelectric Nanogenerators
H Lee, HE Lee, HS Wang, SM Kang, D Lee, YH Kim, JH Shin, YW Lim, ...
Advanced functional materials 30 (49), 2005610, 2020
512020
Self-powered flexible full-color display via dielectric-tuned hybrimer triboelectric nanogenerators
SM Kang, HE Lee, HS Wang, JH Shin, W Jo, Y Lee, H Lee, D Lee, YH Kim, ...
ACS Energy Letters 6 (11), 4097-4107, 2021
232021
A Flash‐Induced Robust Cu Electrode on Glass Substrates and Its Application for Thin‐Film μLEDs
JH Shin, JH Park, J Seo, TH Im, JC Kim, HE Lee, DH Kim, KY Woo, ...
Advanced Materials 33 (13), 2007186, 2021
212021
Wearable surface‐lighting micro‐light‐emitting diode patch for melanogenesis inhibition
JH Lee, Y Ahn, HE Lee, YN Jang, AY Park, S Kim, YH Jung, SH Sung, ...
Advanced Healthcare Materials 12 (1), 2201796, 2023
202023
Siloxane Hybrid Material-Encapsulated Highly Robust Flexible μLEDs for Biocompatible Lighting Applications
HE Lee, D Lee, TI Lee, J Jang, J Jang, YW Lim, JH Shin, SM Kang, ...
ACS Applied Materials & Interfaces 14 (24), 28258-28269, 2022
122022
Universal selective transfer printing via micro-vacuum force
SH Park, TJ Kim, HE Lee, BS Ma, M Song, MS Kim, JH Shin, SH Lee, ...
nature communications 14 (1), 7744, 2023
92023
Flexible micro light-emitting diodes for wearable applications
HE Lee, JH Shin, SH Lee, JH Lee, SH Park, KJ Lee
Light-Emitting Devices, Materials, and Applications 10940, 52-58, 2019
82019
Light-material interfaces for self-powered optoelectronics
JH Shin, YB Kim, JH Park, JS Lee, SH Park, SH Lee, JH Lee, KJ Lee
Journal of Materials Chemistry A 9 (46), 25694-25705, 2021
72021
Laser-assisted bonding with compression (LABC) based tiling bonding technology, enabling technology for chiplet integration
KS Choi, J Joo, GM Choi, C Lee, KS Jang, JH Oh, J Shin, HG Yun, ...
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 1385-1389, 2023
52023
Polarity control of siloxane composite films for triboelectric nanogenerator based self-powered body temperature monitoring
SM Kang, JH Shin, JH Kim, HS Kang, CK Jeong, HE Lee, BS Bae
Nano Energy 127, 109742, 2024
42024
Siloxane Hybrid Materials: Hierarchically Surface‐Textured Ultrastable Hybrid Film for Large‐Scale Triboelectric Nanogenerators (Adv. Funct. Mater. 49/2020)
H Lee, HE Lee, HS Wang, SM Kang, D Lee, YH Kim, JH Shin, YW Lim, ...
Advanced Functional Materials 30 (49), 2070327, 2020
12020
Light‐Emitting Diodes: Monolithic Flexible Vertical GaN Light‐Emitting Diodes for a Transparent Wireless Brain Optical Stimulator (Adv. Mater. 28/2018)
HE Lee, JH Choi, SH Lee, M Jeong, JH Shin, DJ Joe, DH Kim, CW Kim, ...
Advanced Materials 30 (28), 1870208, 2018
12018
Laser Assisted Bonding (LAB) Based Flip-Chip Process for Fine Pitch Solder Bumps Device Using Laser Non-Conductive Paste (NCP)
KS Jang, YS Eom, GM Choi, J Joo, J Shin, JH Oh, CM Lee, JE Jung, ...
2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC), 1-4, 2024
2024
Il sistema al momento non può eseguire l'operazione. Riprova più tardi.
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