| Accurate online power estimation and automatic battery behavior based power model generation for smartphones L Zhang, B Tiwana, Z Qian, Z Wang, RP Dick, ZM Mao, L Yang Proceedings of the eighth IEEE/ACM/IFIP international conference on Hardware …, 2010 | 1609 | 2010 |
| TGFF: task graphs for free RP Dick, DL Rhodes, W Wolf Proceedings of the Sixth International Workshop on Hardware/Software …, 1998 | 1378 | 1998 |
| Indoor localization without infrastructure using the acoustic background spectrum SP Tarzia, PA Dinda, RP Dick, G Memik Proceedings of the 9th international conference on Mobile systems …, 2011 | 438 | 2011 |
| Temperature-aware scheduling and assignment for hard real-time applications on MPSoCs T Chantem, RP Dick, XS Hu Proceedings of the conference on Design, automation and test in Europe, 288-293, 2008 | 353 | 2008 |
| MOGAC: a multiobjective genetic algorithm for hardware-software cosynthesis of distributed embedded systems RP Dick, NK Jha IEEE transactions on computer-aided design of integrated circuits and …, 1998 | 341 | 1998 |
| The next generation of low-cost personal air quality sensors for quantitative exposure monitoring R Piedrahita, Y Xiang, N Masson, J Ortega, A Collier, Y Jiang, K Li, ... Atmospheric Measurement Techniques 7 (10), 3325-3336, 2014 | 337 | 2014 |
| Accurate temperature-dependent integrated circuit leakage power estimation is easy Y Liu, RP Dick, L Shang, H Yang 2007 Design, Automation & Test in Europe Conference & Exhibition, 1-6, 2007 | 310 | 2007 |
| Ariel: Automatic wi-fi based room fingerprinting for indoor localization Y Jiang, X Pan, K Li, Q Lv, RP Dick, M Hannigan, L Shang Proceedings of the 2012 ACM conference on ubiquitous computing, 441-450, 2012 | 250 | 2012 |
| Three-dimensional chip-multiprocessor run-time thermal management C Zhu, Z Gu, L Shang, RP Dick, R Joseph IEEE Transactions on Computer-Aided Design of Integrated Circuits and …, 2008 | 241 | 2008 |
| C-pack: A high-performance microprocessor cache compression algorithm X Chen, L Yang, RP Dick, L Shang, H Lekatsas IEEE transactions on very large scale integration (VLSI) systems 18 (8 …, 2009 | 233 | 2009 |
| Embedded systems synthesis benchmark suites (e3s) R Dick http://ziyang. eecs. umich. edu/~ dickrp/e3s/, 2008 | 180 | 2008 |
| Power, thermal, and reliability modeling in nanometer-scale microprocessors D Brooks, RP Dick, R Joseph, L Shang Ieee Micro 27 (3), 49-62, 2007 | 178 | 2007 |
| ISAC: Integrated space-and-time-adaptive chip-package thermal analysis Y Yang, Z Gu, C Zhu, RP Dick, L Shang IEEE Transactions on Computer-Aided Design of Integrated Circuits and …, 2006 | 177 | 2006 |
| Thermal vs energy optimization for dvfs-enabled processors in embedded systems Y Liu, H Yang, RP Dick, H Wang, L Shang 8th International Symposium on Quality Electronic Design (ISQED'07), 204-209, 2007 | 176 | 2007 |
| Cache contention and application performance prediction for multi-core systems C Xu, X Chen, RP Dick, ZM Mao 2010 IEEE International Symposium on Performance Analysis of Systems …, 2010 | 171 | 2010 |
| Aggregate characterization of user behavior in Twitter and analysis of the retweet graph DR Bild, Y Liu, RP Dick, ZM Mao, DS Wallach ACM Transactions on Internet Technology (TOIT) 15 (1), 1-24, 2015 | 170 | 2015 |
| MAQS: a personalized mobile sensing system for indoor air quality monitoring Y Jiang, K Li, L Tian, R Piedrahita, X Yun, O Mansata, Q Lv, RP Dick, ... Proceedings of the 13th international conference on Ubiquitous computing …, 2011 | 169 | 2011 |
| Adaptive analysis methods L Shang, Y Yang, R Dick US Patent App. 11/713,790, 2007 | 158 | 2007 |
| Hallway based automatic indoor floorplan construction using room fingerprints Y Jiang, Y Xiang, X Pan, K Li, Q Lv, RP Dick, L Shang, M Hannigan Proceedings of the 2013 ACM international joint conference on Pervasive and …, 2013 | 156 | 2013 |
| 3D-STAF: scalable temperature and leakage aware floorplanning for three-dimensional integrated circuits P Zhou, Y Ma, Z Li, RP Dick, L Shang, H Zhou, X Hong, Q Zhou 2007 IEEE/ACM International Conference on Computer-Aided Design, 590-597, 2007 | 151 | 2007 |
Li ShangFudan University, Univ. Colorado BoulderEmail verificata su fudan.edu.cn