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Jie ShanCornell UniversityEmail verificata su cornell.edu- Kin Fai MakMax Planck Institute for the Structure and Dynamics of Matter, Cornell UniversityEmail verificata su cornell.edu
- Shengwei JiangCornell universityEmail verificata su cornell.edu
- Kenji WatanabeNational Institute for Materials ScienceEmail verificata su nims.go.jp
- Yang XuInstitute of Physics, Chinese Academy of SciencesEmail verificata su iphy.ac.cn
- Yang Zhang (张阳)University of Tennessee Knoxville, MIT, MPI CPfS/IFWEmail verificata su utk.edu
- Xiaoxue LiuTsung-Dao Lee Institute, Shanghai Jiao Tong UniversityEmail verificata su sjtu.edu.cn
- Jinfeng JiaDept. of Phys., Shanghai Jiaotong UniversityEmail verificata su sjtu.edu.cn
- Yanhao TangZhejiang UniversityEmail verificata su zju.edu.cn
- T.TaniguchiNational Institute for Materials ScienceEmail verificata su nims.go.jp
- Song LiuColumbia UniversityEmail verificata su columbia.edu
- Liang FuMassachusetts Institute of TechnologyEmail verificata su mit.edu
- Jiacheng ZhuCornell UniversityEmail verificata su cornell.edu
- Allan H. MacDonaldUniversity of Texas Austin, Indiana University, NRC Canada, U of TorontoEmail verificata su physics.utexas.edu
- Kaifei KangEmail verificata su cornell.edu
- Fan XuShanghai Jiao Tong UniversityEmail verificata su sjtu.edu.cn
- Zhiwen ShiProfessor of Physics, Shanghai Jiao Tong UniversityEmail verificata su sjtu.edu.cn
- Katayun BarmakPhilips Electronics Professor, Dept. of Applied Physics and Applied Mathematics, Columbia UniversityEmail verificata su columbia.edu
- Zefang Wangpostdoc, Cornell UniversityEmail verificata su psu.edu
- Nikhil SivadasSenior Research Engineer, Samsung - AMLEmail verificata su samsung.com
