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Sudipta SealUniversity of Central FloridaEmail verificata su ucf.edu
Chong AhnProfessor of Electrical Engineering, University of CincinnatiEmail verificata su ucmail.uc.edu
Satyajit ShuklaSenior Principal Scientist, CSIR-NIIST, IndiaEmail verificata su niist.res.in
Pawan PathakUniversity of Central FloridaEmail verificata su ucf.edu
Ehsan Yakhshi-TaftiLG Electronics USAEmail verificata su lge.com
Xiaochen WangUniversity of Central FloridaEmail verificata su knights.ucf.edu
Woo Hyoung LeeDepartment of Civil, Environmental, and Construction Engineering, University of Central FloridaEmail verificata su ucf.edu
Roxana ShabaniSenior Design Engineer at ASMLEmail verificata su asml.com
Ghanashyam LondeIntel CorporationEmail verificata su intel.com
Lei ZhaiUniversity of Central FloridaEmail verificata su ucf.edu
Jin W. ChoiMichigan Technological UniversityEmail verificata su mtu.edu
Jong-Hyun AhnYonsei UniversityEmail verificata su yonsei.ac.kr
Alireza KarbalaeiPhD, Mechanical and Aerospace EngineeringEmail verificata su nasa.gov
Nae-Eung LeeProfessor of Materials Science and Engineering, Sungkyunkwan University, KoreaEmail verificata su skku.edu
Shekhar BhansaliFlorida International UniversityEmail verificata su fiu.edu
ramki kalyanaramanProfessor of Engineering, Cañada CollegeEmail verificata su smccd.edu
Sang-Hoon BaeWashington University in Saint LouisEmail verificata su mit.edu
Sameer DeshpandeApplied Materials IncEmail verificata su amat.com
Amit KumarUCF, BRIDG, BSIEmail verificata su brewerscience.com
Craig J. NealUniversity of Central FloridaEmail verificata su ucf.edu