| Effect of Bi addition on the activation energy for the growth of Cu5Zn8 intermetallic in the Sn–Zn lead-free solder R Mayappan, ZA Ahmad Intermetallics 18 (4), 730-735, 2010 | 101 | 2010 |
| The effect of crosshead speed on the joint strength between Sn-Zn-Bi lead-free solders and Cu substrate R Mayappan, AB Ismail, ZA Ahmad, T Ariga, LB Hussain Journal of alloys and compounds 436 (1-2), 112-117, 2007 | 50 | 2007 |
| Effect of sample perimeter and temperature on Sn–Zn based lead-free solders R Mayappan, AB Ismail, ZA Ahmad, T Ariga, LB Hussain Materials Letters 60 (19), 2383-2389, 2006 | 39 | 2006 |
| The effect of adding Zn into the Sn–Ag–Cu solder on the intermetallic growth rate R Mayappan, I Yahya, NA Ab Ghani, HA Hamid Journal of Materials Science: Materials in Electronics 25 (7), 2913-2922, 2014 | 34 | 2014 |
| Phase development in La2O3 doped Al2O3: TiO2 ceramic membranes US Bjoerkert, R Mayappan, D Holland, MH Lewis Journal of the European Ceramic Society 19 (10), 1847-1857, 1999 | 18 | 1999 |
| Improvement in intermetallic thickness and joint strength in carbon nanotube composite Sn-3.5 Ag lead-free solder R Mayappan, AA Hassan, NA Ab Ghani, I Yahya, J Andas Materials Today: Proceedings 3 (6), 1338-1344, 2016 | 15 | 2016 |
| Wetting and intermetallic study between Sn-3.5 Ag-1.0 Cu-xZn lead-free solders and copper substrate (x= 0, 0.1, 0.4, 0.7) R Mayappan Advanced Materials Research 501, 150-154, 2012 | 13 | 2012 |
| Wetting Properties of Sn–Pb, Sn–Zn and Sn–Zn–Bi Lead–Free Solders R Mayappan, AB Ismail, ZA Ahmad, T Ariga, LB Hussain Jurnal Teknologi 46, 1–14, 2007 | 13* | 2007 |
| Research Advances of Composite Solder Material Fabricated via Powder Metallurgy Route MRAZA Mohd Salleh M. A. A., Zan @ Hazizi M. H., Mustafa Advanced Materials Research 626, 791-796, 2013 | 12 | 2013 |
| Growth of Cu-Zn5 and Cu5Zn8 Intermetallic Compounds in the Sn-9Zn/Cu Joint During Liquid State Aging R Mayappan, RA Zaman, ZZ Abidin | 12 | 2011 |
| Activation energy for Cu-Sn intermetallic in CNT-reinforced Sn-1.0 Ag-0.5 Cu solder R Mayappan, A Salleh, NA Tokiran, NA Awang Soldering & Surface Mount Technology 32 (2), 65-72, 2020 | 11 | 2020 |
| Temperature and flux effect on contact angles and intermetallic between Sn-8Zn-3Bi lead-free solder and Cu substrate R Mayappan, ZA Ahmad Sains Malaysiana 38 (3), 395-400, 2009 | 11 | 2009 |
| Intermetallic growth activation energy improvement in graphene doped Sn-3.5 Ag solder R Mayappan, A Salleh Materials Letters 310, 131480, 2022 | 6 | 2022 |
| Silver effect on the intermetallic growth in the Sn-8Zn-3Bi lead-free solder R Mayappan, NA Jasli Materials Today: Proceedings 5 (9), 17553-17560, 2018 | 6 | 2018 |
| The effect of Ni addition on Cu-Sn intermetallic growth rate values in the SAC solder R Mayappan, NAA Ghani, I Yahya AIP Conference Proceedings 2031 (1), 2018 | 5 | 2018 |
| Morphology and Intermetallics Study of (Sn-8Zn-3Bi)-1Ag Solder under Liquid-State Aging NA Jasli, H Abd Hamid, R Mayappan Advanced Materials Research 620, 273-277, 2013 | 5 | 2013 |
| The effect of graphene on the intermetallic and joint strength of Sn-3.5 Ag lead-free solder R Mayappan, A Salleh, J Andas AIP Conference Proceedings 1877 (1), 2017 | 4 | 2017 |
| Intermetallic growth retardation with the addition of graphene in the Sn-3.5 Ag lead-free solder R Mayappan, A Salleh IOP Conference Series: Materials Science and Engineering 205 (1), 012017, 2017 | 4 | 2017 |
| Intermetallic evolution of Sn-3.5 Ag-1.0 Cu-0.1 Zn/Cu interface under thermal aging I Yahya, NA Ab Ghani, NNZ Abiddin, H Abd Hamid, R Mayappan Advanced Materials Research 620, 142-146, 2013 | 4 | 2013 |
| Characterization of Sn-3.5 Ag-1.0 Cu lead-free solder prepared via powder metallurgy method I Yahya, NA Ab Ghani, MAA Mohd Salleh, H Abd Hamid, ZA Ahmad, ... Advanced Materials Research 501, 160-164, 2012 | 4 | 2012 |
Mohd Nazree DermanAssoc.Prof.Email verificata su unimap.edu.my