| Fiber-to-chip fusion splicing for low-loss photonic packaging J Nauriyal, M Song, R Yu, J Cardenas Optica 6 (5), 549-552, 2019 | 47 | 2019 |
| Enhanced on-chip phase measurement by inverse weak value amplification M Song, J Steinmetz, Y Zhang, J Nauriyal, K Lyons, AN Jordan, ... Nature Communications 12 (1), 6247, 2021 | 23 | 2021 |
| Engineered second-order nonlinearity in silicon nitride Y Zhang, J Nauriyal, M Song, M Granados Baez, X He, T Macdonald, ... Optical Materials Express 13 (1), 237-246, 2022 | 11 | 2022 |
| Fiber to chip fusion splicing for robust, low loss photonic packaging J Nauriyal, M Song, R Yu, J Cardenas arXiv preprint arXiv:1810.09531, 2018 | 5 | 2018 |
| Enhanced on-chip phase measurement by weak value amplification M Song, J Steinmetz, Y Zhang, J Nauriyal, MG Baez, AN Jordan, ... 2020 Conference on Lasers and Electro-Optics (CLEO), 1-2, 2020 | 4 | 2020 |
| Fiber array to chip attach using laser fusion splicing for low loss J Nauriyal, M Song, Y Zhang, M Granados-Baez, J Cardenas Optics Express 31 (13), 21863-21869, 2023 | 2 | 2023 |
| Low-loss, single-shot fiber-array to chip attach using laser fusion splicing J Nauriyal, Y Zhang, M Song, J Cardenas 2022 IEEE Photonics Conference (IPC), 1-2, 2022 | 2 | 2022 |
| Packaging integrated photonic devices to increase scalability using laser fusion splicing J Nauriyal, M Song, M Granados-Baez, Y Zhang, J Cardenas Applied Industrial Optics: Spectroscopy, Imaging and Metrology, M3A. 2, 2022 | 2 | 2022 |
| Integrated optical gyroscope with inverse weak value amplification M Song, J Nauriyal, J Steinmetz, S Pumulo, N Achuthan, K Lyons, ... CLEO: Science and Innovations, STh4J. 3, 2022 | 1 | 2022 |
| System and method for attaching optical fibers to chips J Cardenas, J Nauriyal US Patent 10,976,495, 2021 | 1 | 2021 |
| Single-shot, multiple i/o photonic chip to fiber array packaging using fusion splicing J Nauriyal, M Song, M Granados-Baez, Y Zhang, J Cardenas CLEO: Science and Innovations, JTh2B. 9, 2020 | 1 | 2020 |
| Low loss and robust photonic packaging using fusion splicing J Nauriyal, M Song, R Yu, J Cardenas CLEO: Applications and Technology, ATh3I. 2, 2019 | 1 | 2019 |
| System and method for attaching optical fibers to chips JC Gonzalez, J Nauriyal US Patent App. 18/369,281, 2024 | | 2024 |
| System and method for attaching optical fibers to chips J Cardenas, J Nauriyal US Patent 11,789,207, 2023 | | 2023 |
| High-speed Electro-optic Modulation in Silicon Nitride Y Zhang, J Nauriyal, M Song, M Granados-Baez, X He, T MacDonald, ... CLEO: Science and Innovations, SF2K. 3, 2023 | | 2023 |
| Low-Loss, High Extinction Ratio Fiber to Chip Connection via Laser Fusion for Polarization Maintaining Fibers S Kumar, J Nauriyal, J Cardenas 2023 Optical Fiber Communications Conference and Exhibition (OFC), 1-3, 2023 | | 2023 |
| Fiber to Chip Fusion Splicing for Low Loss Optical Coupling J Nauriyal University of Rochester, 2023 | | 2023 |
| Multiple I/O photonic chip to fiber array packaging using fusion splicing in a single shot J Nauriyal, Y Zhang, M Song, J Cardenas 2020 IEEE Photonics Conference (IPC), 1-2, 2020 | | 2020 |
| System and method for attaching optical fibers to chips J Cardenas, J NAURIYAL | | 2018 |
| Fiber to Chip Fusion Splicing for Robust, Low Loss Optical Coupling J Nauriyal, R Yu, M Song, J Cardenas CLEO: QELS_Fundamental Science, JW2A. 72, 2018 | | 2018 |
