| Localized silicon fusion and eutectic bonding for MEMS fabrication and packaging YT Cheng, L Lin, K Najafi Journal of microelectromechanical systems 9 (1), 3-8, 2000 | 335 | 2000 |
| Vacuum packaging technology using localized aluminum/silicon-to-glass bonding YT Cheng, WT Hsu, K Najafi, CTC Nguyen, L Lin Journal of Microelectromechanical Systems 11 (5), 556-565, 2002 | 285 | 2002 |
| Process for making microstructures and microstructures made thereby L Lin, YT Cheng, K Najafi, KD Wise US Patent 6,232,150, 2001 | 206 | 2001 |
| Catalytic pyrolysis of solid biomass and related biofuels, aromatic, and olefin compounds GW Huber, YT Cheng, T Carlson, T Vispute, J Jae, G Tompsett US Patent 8,277,643, 2012 | 182 | 2012 |
| Development of a flexible SU-8/PDMS-based antenna CP Lin, CH Chang, YT Cheng, CF Jou IEEE Antennas and wireless propagation letters 10, 1108-1111, 2011 | 152 | 2011 |
| A robust high-Q micromachined RF inductor for RFIC applications JW Lin, CC Chen, YT Cheng IEEE Transactions on Electron Devices 52 (7), 1489-1496, 2005 | 112 | 2005 |
| A hermetic glass-silicon package formed using localized aluminum/silicon-glass bonding YT Cheng, L Lin, K Najafi Journal of Microelectromechanical Systems 10 (3), 392-399, 2001 | 111 | 2001 |
| Silicon chip carrier with conductive through-vias and method for fabricating same D Edelstein, P Andry, L Buchwalter, J Casey, S Goma, R Horton, ... US Patent App. 11/242,221, 2006 | 94 | 2006 |
| Microstructures L Lin, YT Cheng, K Najafi, KD Wise US Patent 6,436,853, 2002 | 86 | 2002 |
| Comparative study of hot embossed micro structures fabricated by laboratory and commercial environments L Lin, YT Cheng, CJ Chiu Microsystem Technologies 4, 113-116, 1998 | 84 | 1998 |
| Formation of silicon-gold eutectic bond using localized heating method LLL Lin, YTCYT Cheng, KNK Najafi Japanese journal of applied physics 37 (11B), L1412, 1998 | 73 | 1998 |
| Synthesis and characterization of Ni-P-CNT's nanocomposite film for MEMS applications GR Shen, YT Cheng, LN Tsai IEEE Transactions on Nanotechnology 4 (5), 539-547, 2005 | 57 | 2005 |
| A low-power milliwatt electromagnetic microspeaker using a PDMS membrane for hearing aids application YC Chen, YT Cheng 2011 IEEE 24th International Conference on Micro Electro Mechanical Systems …, 2011 | 45 | 2011 |
| A low temperature wafer-level hermetic MEMS package using UV curable adhesive ZH Liang, YT Cheng, W Hsu, YW Lee 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE …, 2004 | 43 | 2004 |
| An inkjet-printed flexible non-enzymatic lactate sensor for clinical blood plasma test YS Huang, KY Chen, YT Cheng, CK Lee, HE Tsai IEEE Electron Device Letters 41 (4), 597-600, 2020 | 38 | 2020 |
| A 37.5-mW 8-dBm-EIRP 15.5-HPBW 338-GHz Terahertz Transmitter Using SoP Heterogeneous System Integration CH Li, TY Chao, CW Lai, WC Chen, CL Ko, CN Kuo, YT Cheng, MC Kuo, ... IEEE Transactions on Microwave Theory and Techniques 63 (2), 470-480, 2015 | 37 | 2015 |
| Localized bonding with PSG or indium solder as intermediate layer YT Cheng, L Lin, K Najafi Technical Digest. IEEE International MEMS 99 Conference. Twelfth IEEE …, 1999 | 37 | 1999 |
| The inductance enhancement study of spiral inductor using Ni–AAO nanocomposite core MC Hsu, TY Chao, YT Cheng, CM Liu, C Chen IEEE transactions on nanotechnology 8 (3), 281-285, 2009 | 36 | 2009 |
| A capacitive micromachined ultrasonic transducer array for minimally invasive medical diagnosis J Chen, X Cheng, CC Chen, PC Li, JH Liu, YT Cheng Journal of microelectromechanical systems 17 (3), 599-610, 2008 | 35 | 2008 |
| Performance improvement of an electrothermal microactuator fabricated using Ni-diamond nanocomposite LN Tsai, GR Shen, YT Cheng, W Hsu Journal of Microelectromechanical Systems 15 (1), 149-158, 2006 | 34 | 2006 |
