In situ diagnostics and prognostics of wire bonding faults in IGBT modules for electric vehicle drives B Ji, V Pickert, W Cao, B Zahawi IEEE Transactions on Power Electronics 28 (12), 5568-5577, 2013 | 383 | 2013 |
In-Situ Diagnostics and Prognostics of Solder Fatigue in IGBT Modules for Electric Vehicle Drives B Ji, X Song, W Cao, V Pickert, Y HU, J Mackersie, G Pierce Power Electronics, IEEE Transactions on 30 (3), 1535 - 1543, 2015 | 231 | 2015 |
Real-Time Temperature Estimation for Power MOSFETs Considering Thermal Aging Effects H Chen, B Ji, V Pickert, W Cao Device and Materials Reliability, IEEE Transactions on 14 (1), 220-228, 2014 | 224 | 2014 |
New SR Drive With Integrated Charging Capacity for Plug-In Hybrid Electric Vehicles (PHEVs) Y Hu, X Song, W Cao, B Ji Industrial Electronics, IEEE Transactions on 61 (10), 5722-5731, 2014 | 192 | 2014 |
Three-port DC–DC converter for stand-alone photovoltaic systems Y Hu, W Xiao, W Cao, B Ji, DJ Morrow IEEE Transactions on Power Electronics 30 (6), 3068-3076, 2014 | 188 | 2014 |
Multiobjective Design Optimization of IGBT Power Modules Considering Power Cycling and Thermal Cycling B Ji, X Song, E Sciberras, W Cao, Y Hu, V Pickert Power Electronics, IEEE Transactions on 30 (5), 2493 - 2504, 2014 | 141 | 2014 |
Thermography-based virtual MPPT scheme for improving PV energy efficiency under partial shading conditions Y Hu, W Cao, J Wu, B Ji, D Holliday IEEE transactions on power electronics 29 (11), 5667-5672, 2014 | 123 | 2014 |
A novel state-of-charge estimation method of lithium-ion batteries combining the grey model and genetic algorithms L Chen, Z Wang, Z Lü, J Li, B Ji, H Wei, H Pan IEEE Transactions on Power Electronics 33 (10), 8797-8807, 2017 | 112 | 2017 |
A near-state three-dimensional space vector modulation for a three-phase four-leg voltage source inverter M Zhang, DJ Atkinson, B Ji, M Armstrong, M Ma IEEE Transactions on Power Electronics 29 (11), 5715-5726, 2014 | 106 | 2014 |
Gate–emitter pre-threshold voltage as a health-sensitive parameter for IGBT chip failure monitoring in high-voltage multichip IGBT power modules R Mandeya, C Chen, V Pickert, RT Naayagi, B Ji IEEE Transactions on Power Electronics 34 (9), 9158-9169, 2018 | 79 | 2018 |
In-situ bond wire health monitoring circuit for IGBT power modules B Ji, V Pickert, B Zahawi, M Zhang Power Electronics, Machines and Drives (PEMD 2012), 6th IET International …, 2012 | 70* | 2012 |
Liquid metal magnetohydrodynamic pump for junction temperature control of power modules Y Yerasimou, V Pickert, B Ji, X Song IEEE transactions on power electronics 33 (12), 10583-10593, 2018 | 62 | 2018 |
Investigation on degradation of SiC MOSFET under surge current stress of body diode X Jiang, J Wang, J Chen, Z Li, D Zhai, X Yang, B Ji, ZJ Shen IEEE Journal of Emerging and Selected Topics in Power Electronics 8 (1), 77-89, 2019 | 60 | 2019 |
Active gate delay time control of Si/SiC hybrid switch for junction temperature balance over a wide power range Z Li, J Wang, L Deng, Z He, X Yang, B Ji, ZJ Shen IEEE Transactions on Power Electronics 35 (5), 5354-5365, 2019 | 55 | 2019 |
Nonlinear analysis and control of interleaved boost converter using real-time cycle to cycle variable slope compensation H Wu, V Pickert, D Giaouris, B Ji IEEE Transactions on Power Electronics 32 (9), 7256-7270, 2016 | 55 | 2016 |
Power loss model and device sizing optimization of Si/SiC hybrid switches Z Li, J Wang, B Ji, ZJ Shen IEEE Transactions on Power Electronics 35 (8), 8512-8523, 2019 | 51 | 2019 |
New multi-stage DC–DC converters for grid-connected photovoltaic systems Y Hu, W Cao, B Ji, J Si, X Chen Renewable energy 74, 247-254, 2015 | 47 | 2015 |
A novel remaining useful life prediction framework for lithium‐ion battery using grey model and particle filtering L Chen, H Wang, J Chen, J An, B Ji, Z Lyu, W Cao, H Pan International Journal of Energy Research 44 (9), 7435-7449, 2020 | 44 | 2020 |
Surrogate-based analysis and optimization for the design of heat sinks with jet impingement X Song, J Zhang, S Kang, M Ma, B Ji, W Cao, V Pickert IEEE Transactions on Components, Packaging and Manufacturing Technology 4 (3 …, 2013 | 35 | 2013 |
Onboard condition monitoring of solder fatigue in IGBT power modules B Ji, V Pickert, WP Cao, L Xing 2013 9th IEEE International Symposium on Diagnostics for Electric Machines …, 2013 | 30 | 2013 |