עקוב אחר
Sung Kyu Lim
Sung Kyu Lim
Professor, Georgia Institute of Technology
כתובת אימייל מאומתת בדומיין ece.gatech.edu - דף הבית
כותרת
צוטט על ידי
צוטט על ידי
שנה
3D-MAPS: 3D massively parallel processor with stacked memory‏
DH Kim, K Athikulwongse, M Healy, M Hossain, M Jung, I Khorosh, ...‏
Solid-State Circuits Conference Digest of Technical Papers (ISSCC), 2012 …, 2012‏
398*2012
A study of through-silicon-via impact on the 3D stacked IC layout‏
DH Kim, K Athikulwongse, SK Lim‏
Proceedings of the 2009 International Conference on Computer-Aided Design …, 2009‏
3442009
TSV stress-aware full-chip mechanical reliability analysis and optimization for 3D IC‏
M Jung, J Mitra, DZ Pan, SK Lim‏
Communications of the ACM 57 (1), 107-115, 2014‏
2352014
Design and CAD methodologies for low power gate-level monolithic 3D ICs‏
SA Panth, K Samadi, Y Du, SK Lim‏
Proceedings of the 2014 international symposium on Low power electronics and …, 2014‏
208*2014
Edge separability-based circuit clustering with application to multilevel circuit partitioning‏
J Cong, SK Lim‏
IEEE Transactions on Computer-Aided Design of Integrated Circuits and …, 2004‏
195*2004
Multiobjective microarchitectural floorplanning for 2-D and 3-D ICs‏
M Healy, M Vittes, M Ekpanyapong, CS Ballapuram, SK Lim, HHS Lee, ...‏
IEEE Transactions on Computer-Aided Design of Integrated Circuits and …, 2006‏
186*2006
TSV stress aware timing analysis with applications to 3D-IC layout optimization‏
J Yang, K Athikulwongse, YJ Lee, SK Lim, DZ Pan‏
Proceedings of the 47th Design Automation Conference, 803-806, 2010‏
168*2010
Low-power and reliable clock network design for through-silicon via (TSV) based 3D ICs‏
X Zhao, J Minz, SK Lim‏
IEEE Transactions on Components, Packaging and Manufacturing Technology 1 (2 …, 2010‏
164*2010
Thermal characterization of interlayer microfluidic cooling of three-dimensional integrated circuits with nonuniform heat flux‏
YJ Kim, YK Joshi, AG Fedorov, YJ Lee, SK Lim‏
1462010
Design method and test structure to characterize and repair TSV defect induced signal degradation in 3D system‏
M Cho, C Liu, DH Kim, SK Lim, S Mukhopadhyay‏
2010 IEEE/ACM International Conference on Computer-Aided Design (ICCAD), 694-697, 2010‏
144*2010
Architecture, chip, and package co-design flow for 2.5 D IC design enabling heterogeneous IP reuse‏
J Kim, G Murali, H Park, E Qin, H Kwon, V Chaitanya, K Chekuri, N Dasari, ...‏
Proceedings of the 56th Annual Design Automation Conference 2019, 1-6, 2019‏
143*2019
3D floorplanning with thermal vias‏
E Wong, SK Lim‏
Proceedings of the Design Automation & Test in Europe Conference 1, 1-6, 2006‏
1372006
Stress-driven 3D-IC placement with TSV keep-out zone and regularity study‏
K Athikulwongse, A Chakraborty, JS Yang, DZ Pan, SK Lim‏
2010 IEEE/ACM International Conference on Computer-Aided Design (ICCAD), 669-674, 2010‏
1362010
A design tradeoff study with monolithic 3D integration‏
C Liu, SK Lim‏
Thirteenth International Symposium on Quality Electronic Design (ISQED), 529-536, 2012‏
1292012
Physical design for 3D system on package‏
SK Lim‏
IEEE Design & Test of Computers 22 (6), 532-539, 2005‏
1282005
Full-chip TSV-to-TSV coupling analysis and optimization in 3D IC‏
C Liu, T Song, J Cho, J Kim, J Kim, SK Lim‏
Proceedings of the 48th Design Automation Conference, 783-788, 2011‏
1252011
Pre-bond testable low-power clock tree design for 3D stacked ICs‏
X Zhao, DL Lewis, HHS Lee, SK Lim‏
Proceedings of the 2009 International Conference on Computer-Aided Design …, 2009‏
122*2009
VLSI placement parameter optimization using deep reinforcement learning‏
A Agnesina, K Chang, SK Lim‏
Proceedings of the 39th international conference on computer-aided design, 1-9, 2020‏
1092020
Multiway partitioning with pairwise movement‏
J Cong, SK Lim‏
Proceedings of the 1998 IEEE/ACM international conference on Computer-aided …, 1998‏
1061998
Fast and accurate analytical modeling of through-silicon-via capacitive coupling‏
DH Kim, S Mukhopadhyay, SK Lim‏
IEEE Transactions on Components, Packaging and Manufacturing Technology 1 (2 …, 2011‏
1042011
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מאמרים 1–20