עקוב אחר
Jeffrey A. Eastman
Jeffrey A. Eastman
Materials Science Division, Argonne National Laboratory
כתובת אימייל מאומתת בדומיין anl.gov - דף הבית
כותרת
צוטט על ידי
צוטט על ידי
שנה
Enhancing thermal conductivity of fluids with nanoparticles
SUS Choi, JA Eastman
Argonne National Lab.(ANL), Argonne, IL (United States), 1995
194281995
Anomalously increased effective thermal conductivities of ethylene glycol-based nanofluids containing copper nanoparticles
JA Eastman, SUS Choi, S Li, W Yu, LJ Thompson
Applied physics letters 78 (6), 718-720, 2001
53752001
Measuring thermal conductivity of fluids containing oxide nanoparticles
S Lee, SUS Choi, S Li, JA Eastman
41801999
Mechanisms of heat flow in suspensions of nano-sized particles (nanofluids)
P Keblinski, SR Phillpot, SUS Choi, JA Eastman
International journal of heat and mass transfer 45 (4), 855-863, 2002
30012002
Enhanced thermal conductivity through the development of nanofluids
JA Eastman, US Choi, S Li, LJ Thompson, S Lee
MRS Online Proceedings Library (OPL) 457, 3, 1996
16101996
Ferroelectricity in ultrathin perovskite films
DD Fong, GB Stephenson, SK Streiffer, JA Eastman, O Auciello, PH Fuoss, ...
Science 304 (5677), 1650-1653, 2004
15662004
Nanofluids for thermal transport
P Keblinski, JA Eastman, DG Cahill
Materials today 8 (6), 36-44, 2005
12042005
Elastic and tensile behavior of nanocrystalline copper and palladium
PG Sanders, JA Eastman, JR Weertman
Acta materialia 45 (10), 4019-4025, 1997
11871997
Thermal transport in nanofluids
JA Eastman, SR Phillpot, SUS Choi, P Keblinski
Annu. Rev. Mater. Res. 34 (1), 219-246, 2004
11272004
Observation of Nanoscale Stripe Domains in Ferroelectric Thin Films
SK Streiffer, JA Eastman, DD Fong, C Thompson, A Munkholm, ...
Physical review letters 89 (6), 067601, 2002
6312002
Effect of liquid layering at the liquid–solid interface on thermal transport
L Xue, P Keblinski, SR Phillpot, SUS Choi, JA Eastman
International Journal of Heat and Mass Transfer 47 (19-20), 4277-4284, 2004
6212004
Rapid stress-driven grain coarsening in nanocrystalline Cu at ambient and cryogenic temperatures
K Zhang, JR Weertman, JA Eastman
Applied Physics Letters 87 (6), 2005
4982005
Stabilization of Monodomain Polarization in Ultrathin Films
DD Fong, AM Kolpak, JA Eastman, SK Streiffer, PH Fuoss, ...
Physical review letters 96 (12), 127601, 2006
4562006
Novel thermal properties of nanostructured materials.
JA Eastman
Argonne National Lab., IL (US), 1999
3981999
Interfacial thermal resistance in nanocrystalline yttria-stabilized zirconia
HS Yang, GR Bai, LJ Thompson, JA Eastman
Acta Materialia 50 (9), 2309-2317, 2002
3672002
Functional links between stability and reactivity of strontium ruthenate single crystals during oxygen evolution
SH Chang, N Danilovic, KC Chang, R Subbaraman, AP Paulikas, ...
Nature communications 5 (1), 4191, 2014
3372014
Grain boundaries in nanophase palladium: high resolution electron microscopy and image simulation
GJ Thomas, RW Siegel, JA Eastman
Scripta Metallurgica et Materialia 24 (1), 201-206, 1990
3131990
Reversible chemical switching of a ferroelectric film
RV Wang, DD Fong, F Jiang, MJ Highland, PH Fuoss, C Thompson, ...
Physical review letters 102 (4), 047601, 2009
3072009
Two regimes of thermal resistance at a liquid–solid interface
L Xue, P Keblinski, SR Phillpot, SUS Choi, JA Eastman
The Journal of chemical physics 118 (1), 337-339, 2003
2922003
The influence of time, temperature, and grain size on indentation creep in high-purity nanocrystalline and ultrafine grain copper
K Zhang, JR Weertman, JA Eastman
Applied Physics Letters 85 (22), 5197-5199, 2004
2712004
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מאמרים 1–20