| 3-D topologies for networks-on-chip VF Pavlidis, EG Friedman Very Large Scale Integration (VLSI) Systems, IEEE Transactions on 15 (10 …, 2007 | 600 | 2007 |
| Three-dimensional integrated circuit design VF Pavlidis, EG Friedman Morgan Kaufmann Pub, 2009 | 483* | 2009 |
| Three-dimensional integrated circuits VF Pavlidis, EG Friedman Burlington, MA: Morgan Kaufmann, 2009 | 482* | 2009 |
| Performance analysis of 3-D monolithic integrated circuits S Bobba, A Chakraborty, O Thomas, P Batude, VF Pavlidis, G De Micheli 2010 IEEE International 3D Systems Integration Conference (3DIC), 1-4, 2010 | 262 | 2010 |
| Interconnect-based design methodologies for three-dimensional integrated circuits VF Pavlidis, EG Friedman Proceedings of the IEEE 97 (1), 123-140, 2009 | 160 | 2009 |
| Clock distribution networks for 3-D integrated Circuits VF Pavlidis, I Savidis, EG Friedman Custom Integrated Circuits Conference, 2008. CICC 2008. IEEE, 651-654, 2008 | 79 | 2008 |
| Clock distribution networks in 3-D integrated systems VF Pavlidis, I Savidis, EG Friedman IEEE Transactions on very large scale integration (VLSI) systems 19 (12 …, 2011 | 62 | 2011 |
| Miniaturized SIW Bandpass Filter Based on TSV Technology for THz Applications F Wang, VF Pavlidis, N Yu IEEE Transactions on Terahertz Science and Technology, 2020 | 54 | 2020 |
| Analytical heat transfer model for thermal through-silicon vias H Xu, VF Pavlidis, G De Micheli Design, Automation & Test in Europe Conference & Exhibition (DATE), 2011, 1-6, 2011 | 52 | 2011 |
| Monolithic 3D Integrated Circuits: Recent Trends and Future Prospects K Dhananjay, P Shukla, VF Pavlidis, A Coskun, E Salman IEEE Transactions on Circuits and Systems II: Express Briefs 68 (3), 837-843, 2021 | 45 | 2021 |
| Nanoscale Room-Temperature Multilayer Skyrmionic Synapse for Deep Spiking Neural Networks R Chen, C Li, Y Li, JJ Miles, G Indiveri, S Furber, VF Pavlidis, C Moutafis Physical Review Applied 14 (1), 014096, 2020 | 38 | 2020 |
| An Overview of Thermal Challenges and Opportunities for Monolithic 3D ICs P Shukla, AK Coskun, VF Pavlidis, E Salman Proceedings of the 2019 on Great Lakes Symposium on VLSI, 439-444, 2019 | 37 | 2019 |
| Interconnect delay minimization through interlayer via placement in 3-D ICs VF Pavlidis, EG Friedman Proceedings of the 15th ACM Great Lakes symposium on VLSI, 20-25, 2005 | 37 | 2005 |
| A novel framework for exploring 3-D FPGAs with heterogeneous interconnect fabric K Siozios, VF Pavlidis, D Soudris ACM Transactions on Reconfigurable Technology and Systems (TRETS) 5 (1), 4, 2012 | 29 | 2012 |
| Emerging monolithic 3D integration: Opportunities and challenges from the computer system perspective Y Cheng, X Guo, VF Pavlidis Integration 85, 97-107, 2022 | 26 | 2022 |
| Power distribution paths in 3-D ICS VF Pavlidis, G De Micheli Proceedings of the 19th ACM Great Lakes symposium on VLSI, 263-268, 2009 | 26 | 2009 |
| Skyrmionic interconnect device R Chen, Y Li, VF Pavlidis, C Moutafis Physical Review Research 2 (4), 043312, 2020 | 23 | 2020 |
| The MTA: An Advanced and Versatile Thermal Simulator for Integrated Systems S Ladenheim, YC Chen, M Mihajlović, VF Pavlidis IEEE Transactions on Computer-Aided Design of Integrated Circuits and …, 2018 | 22 | 2018 |
| Effect of process variations in 3D global clock distribution networks H Xu, VF Pavlidis, G De Micheli ACM Journal on Emerging Technologies in Computing Systems (JETC) 8 (3), 20, 2012 | 20 | 2012 |
| A software-supported methodology for designing high-performance 3D FPGA architectures K Siozios, K Sotiriadis, VF Pavlidis, D Soudris 2007 IFIP International Conference on Very Large Scale Integration, 54-59, 2007 | 20 | 2007 |
Eby G. FriedmanDistinguished Professor, University of Rochester確認したメール アドレス: ece.rochester.edu
