| Thermal transient characteristics of die attach in high power LED PKG HH Kim, SH Choi, SH Shin, YK Lee, SM Choi, S Yi Microelectronics Reliability 48 (3), 445-454, 2008 | 189 | 2008 |
| The significance of (an) isotropic viscoelastic Poisson ratio stress and time dependencies HH Hilton, S Yi International Journal of Solids and Structures 35 (23), 3081-3095, 1998 | 133 | 1998 |
| Fracture toughening mechanism of shape memory alloys due to martensite transformation S Yi, S Gao International journal of solids and structures 37 (38), 5315-5327, 2000 | 123 | 2000 |
| A finite element approach for cure simulation of thermosetting matrix composites S Yi, HH Hilton, MF Ahmad Computers & structures 64 (1-4), 383-388, 1997 | 120 | 1997 |
| Dynamic finite element analysis of viscoelastic composite plates in the time domain S Yi, HH Hilton International Journal for Numerical Methods in Engineering 37 (23), 4081-4096, 1994 | 103 | 1994 |
| Fracture toughening mechanism of shape memory alloys under mixed-mode loading due to martensite transformation S Yi, S Gao, L Shen International Journal of Solids and Structures 38 (24-25), 4463-4476, 2001 | 99 | 2001 |
| Large deformation finite element analyses of composite structures integrated with piezoelectric sensors and actuators S Yi, SF Ling, M Ying Finite Elements in Analysis and Design 35 (1), 1-15, 2000 | 98 | 2000 |
| Die package and method of manufacturing the same JS Kang, YH Kim, Y Do Kweon, JG Kim, S Yi US Patent 8,026,590, 2011 | 89 | 2011 |
| Anisotropic viscoelastic finite element analysis of mechanically and hygrothermally loaded composites HH Hilton, S Yi Composites Engineering 3 (2), 123-135, 1993 | 89 | 1993 |
| A hybrid stress ANS solid‐shell element and its generalization for smart structure modelling. Part II—smart structure modelling KY Sze, LQ Yao, S Yi International Journal for Numerical Methods in Engineering 48 (4), 565-582, 2000 | 85 | 2000 |
| Scaffold characteristics, fabrication methods, and biomaterials for the bone tissue engineering JW Jang, KE Min, C Kim, J Shin, J Lee, S Yi International Journal of Precision Engineering and Manufacturing 24 (3), 511-529, 2023 | 72 | 2023 |
| Solder joint reliability of plastic ball grid array packages C Hua Zhong, S Yi Soldering & surface mount technology 11 (1), 44-48, 1999 | 72 | 1999 |
| Finite element formulation for anisotropic coupled piezoelectro‐hygro‐thermo‐viscoelasto‐dynamic problems S Yi, SF Ling, M Ying, HH Hilton, JR Vinson International journal for numerical methods in engineering 45 (11), 1531-1546, 1999 | 67 | 1999 |
| An effective inclusion model for effective moduli of heterogeneous materials with ellipsoidal inhomogeneities L Shen, S Yi International Journal of Solids and Structures 38 (32-33), 5789-5805, 2001 | 65 | 2001 |
| Thermal deformation analysis of BGA package by digital image correlation technique J Zhang, M Li, CY Xiong, J Fang, S Yi Microelectronics international 22 (1), 34-42, 2005 | 64 | 2005 |
| Prediction and verification of process induced warpage of electronic packages WD Van Driel, GQ Zhang, JHJ Janssen, LJ Ernst, F Su, KS Chian, S Yi Microelectronics Reliability 43 (5), 765-774, 2003 | 64 | 2003 |
| Effects of thermo-mechanical properties of composites on viscosity, temperature and degree of cure in thick thermosetting composite laminates during curing process S Yi, HH Hilton Journal of Composite Materials 32 (7), 600-622, 1998 | 64 | 1998 |
| Dynamic responses of plates with viscoelastic damping treatment S Yi, MF Ahmad, HH Hilton International Design Engineering Technical Conferences and Computers and …, 1993 | 63 | 1993 |
| Wafer level package with removable chip protecting layer JS Kang, S Yi, Y Do Kweon US Patent 8,110,914, 2012 | 60 | 2012 |
| Analysis of interlaminar stresses in viscoelastic composites KY Lin, Y Sung International Journal of Solids and Structures 27 (7), 929-945, 1991 | 60 | 1991 |