| High temperature nanoindentation: The state of the art and future challenges JM Wheeler, DEJ Armstrong, W Heinz, R Schwaiger Current Opinion in Solid State and Materials Science 19 (6), 354-366, 2015 | 240 | 2015 |
| Investigation of the fatigue behavior of Al thin films with different microstructure W Heinz, R Pippan, G Dehm Materials Science and Engineering: A 527 (29-30), 7757-7763, 2010 | 46 | 2010 |
| Temperature dependent transition of intragranular plastic to intergranular brittle failure in electrodeposited Cu micro-tensile samples A Wimmer, M Smolka, W Heinz, T Detzel, W Robl, C Motz, V Eyert, ... Materials Science and Engineering: A 618, 398-405, 2014 | 43 | 2014 |
| Cyclic bending experiments on free-standing Cu micron lines observed by electron backscatter diffraction A Wimmer, W Heinz, T Detzel, W Robl, M Nellessen, C Kirchlechner, ... Acta materialia 83, 460-469, 2015 | 39 | 2015 |
| Damage evolution during cyclic tension–tension loading of micron-sized Cu lines A Wimmer, A Leitner, T Detzel, W Robl, W Heinz, R Pippan, G Dehm Acta Materialia 67, 297-307, 2014 | 37 | 2014 |
| Micro-tension study of miniaturized Cu lines at variable temperatures A Wimmer, W Heinz, A Leitner, T Detzel, W Robl, C Kirchlechner, G Dehm Acta Materialia 92, 243-254, 2015 | 20 | 2015 |
| High-temperature characterization of silicon dioxide films with wafer curvature S Bigl, W Heinz, M Kahn, H Schoenherr, MJ Cordill Jom 67, 2902-2907, 2015 | 15 | 2015 |
| Interface fracture and chemistry of a tungsten-based metallization on borophosphosilicate glass B Völker, W Heinz, K Matoy, R Roth, JM Batke, T Schöberl, C Scheu, ... Philosophical magazine 95 (16-18), 1967-1981, 2015 | 13 | 2015 |
| Downscaling metal-dielectric interface fracture experiments to sub-micron dimensions: A feasibility study using TEM B Völker, W Heinz, R Roth, JM Batke, M Cordill, G Dehm Surface & Coatings Technology, 2015 | 13 | 2015 |
| High cycle fatigue properties of Cu films T Walter, G Khatibi, M Nelhiebel, W Heinz, W Robl Microelectronic Engineering 137, 64-69, 2015 | 12 | 2015 |
| Influence of Initial Microstructure on Thermomechanical Fatigue Behavior of Cu Films on Substrates W Heinz, W Robl, D Gerhard Microelectronic Engineering, 2014 | 11 | 2014 |
| Grain resolved orientation changes and texture evolution in a thermally strained Al film on Si substrate W Heinz, G Dehm Surface and Coatings Technology 206 (7), 1850-1854, 2011 | 11 | 2011 |
| Mechanical and chemical investigation of the interface between tungsten-based metallizations and annealed borophosphosilicate glass B Völker, W Heinz, K Matoy, R Roth, JM Batke, T Schöberl, M Cordill, ... Thin Solid Films, 2015 | 10 | 2015 |
| Following crack path selection in multifilm structures with weak and strong interfaces by in situ 4-point-bending B Völker, S Venkatesan, W Heinz, K Matoy, R Roth, JM Batke, MJ Cordill, ... Journal of Materials Research 30, 1-8, 2015 | 8 | 2015 |
| Cyclic deformation behaviour of cu multilayered films on si substrates T Walter, G Khatibi, M Nelhiebel, W Heinz, W Robl Materials Science Forum 825, 983-991, 2015 | 3 | 2015 |
| Modeling fatigue life of power semiconductor devices with ε-N fields O Bluder, K Plankensteiner, M Nelhiebel, W Heinz, C Leitner Proceedings of the Winter Simulation Conference 2014, 2609-2616, 2014 | 2 | 2014 |
| Constitutive modeling of thin films under thermal cycling T Pélisset, W Heinz, B Karunamurthy, T Antretter 2013 Eurpoean Microelectronics Packaging Conference (EMPC), 1-5, 2013 | 2 | 2013 |
| Mikrostrukturelle Analyse von thermomechanisch verformten und ermüdeten Al Schichten W Heinz Montanuniversität Leoben, Lehrstuhl für Materialphysik, 2010 | 2 | 2010 |
| Haftungssteigerung von PVD-Beschichtungen durch Plasmabehandlung mit gitterlosen Anode-Layer-Source-Ionenquellen JM Lackner, W Heinz, W Waldhauser, E Brandstatter, M Schwarz JAHRBUCH OBERFLACHENTECHNIK 63, 114, 2007 | 1 | 2007 |
| Analysis of the interface fracture resistance of multi-layered thin film structures under various service conditions R Soler, S Venkatesan, W Heinz, R Roth, M Nelhiebel, J Fugger, ... ESMC2015, 2015 | | 2015 |
Gerhard DehmDirector, Max-Planck-Institut für Eisenforschung確認したメール アドレス: mpie.de
