LS-DYNA machine learning–based multiscale method for nonlinear modeling of short fiber–reinforced composites H Wei, CT Wu, W Hu, TH Su, H Oura, M Nishi, T Naito, S Chung, L Shen Journal of Engineering Mechanics 149 (3), 04023003, 2023 | 22 | 2023 |
Multiscale computational solid mechanics: data and machine learning TH Su, SJ Huang, JG Jean, CS Chen Journal of Mechanics 38, 568-585, 2022 | 16 | 2022 |
Full-field stress and strain measurements revealing energy dissipation characteristics in martensitic band of Cu-Al-Mn shape memory alloy TH Su, NH Lu, CH Chen, CS Chen Materials Today Communications 24, 101321, 2020 | 15 | 2020 |
On the decrease in transformation stress in a bicrystal cu-al-mn shape-memory alloy during cyclic compressive deformation TH Su, NH Lu, CH Chen, CS Chen Materials 14 (16), 4439, 2021 | 7 | 2021 |
Coupled flow and fiber orientation analysis for 3D injection molding simulations of fiber composites HC Tseng, TH Su AIP Conference Proceedings 2065 (1), 2019 | 7 | 2019 |
Model-free data-driven identification algorithm enhanced by local manifold learning TH Su, JG Jean, CS Chen Computational Mechanics 71, 637-655, 2023 | 6 | 2023 |
Computer-implemented simulation method and non-transitory computer medium for use in molding process TH Su, HS Chiu, RY Chang, CH Hsu, CC Chien, CC Hsu US Patent 9,409,335, 2016 | 6 | 2016 |
Graph-enhanced deep material network: multiscale materials modeling with microstructural informatics JG Jean, TH Su, SJ Huang, CT Wu, CS Chen Computational Mechanics 75 (1), 113-136, 2025 | 3 | 2025 |
Decoding material networks: exploring performance of deep material network and interaction-based material networks WN Wan, TJ Wei, TH Su, CS Chen Journal of Mechanics 40, 796-807, 2024 | 1 | 2024 |
Molding system for preparing an in-mold decorated article CC Hsu, SU Tung-Huan, C Hsien-Sen, CH Hsu, RY Chang US Patent 10,864,667, 2020 | 1 | 2020 |
Ink-wash and Warpage Defect Prediction from the In-Mold Decoration Process Simulation SP Sun, TH Su, D Hsu SPE ANTEC, 2017 | 1* | 2017 |
Orientation-aware interaction-based deep material network in polycrystalline materials modeling TJ Wei, TH Su, CS Chen arXiv preprint arXiv:2502.02457, 2025 | | 2025 |
Application of the ISPG Method in Various Manufacturing Processes Simulation L Zhang, X Pan, TH Su, J Xu, CT Wu, P Ho 2024 International LS-DYNA Conference, 2024 | | 2024 |