フォロー
Tung-Huan Su
Tung-Huan Su
Computational and Multicsale Mechanics Group (CMMG), Ansys
確認したメール アドレス: caece.net
タイトル
引用先
引用先
LS-DYNA machine learning–based multiscale method for nonlinear modeling of short fiber–reinforced composites
H Wei, CT Wu, W Hu, TH Su, H Oura, M Nishi, T Naito, S Chung, L Shen
Journal of Engineering Mechanics 149 (3), 04023003, 2023
222023
Multiscale computational solid mechanics: data and machine learning
TH Su, SJ Huang, JG Jean, CS Chen
Journal of Mechanics 38, 568-585, 2022
162022
Full-field stress and strain measurements revealing energy dissipation characteristics in martensitic band of Cu-Al-Mn shape memory alloy
TH Su, NH Lu, CH Chen, CS Chen
Materials Today Communications 24, 101321, 2020
152020
On the decrease in transformation stress in a bicrystal cu-al-mn shape-memory alloy during cyclic compressive deformation
TH Su, NH Lu, CH Chen, CS Chen
Materials 14 (16), 4439, 2021
72021
Coupled flow and fiber orientation analysis for 3D injection molding simulations of fiber composites
HC Tseng, TH Su
AIP Conference Proceedings 2065 (1), 2019
72019
Model-free data-driven identification algorithm enhanced by local manifold learning
TH Su, JG Jean, CS Chen
Computational Mechanics 71, 637-655, 2023
62023
Computer-implemented simulation method and non-transitory computer medium for use in molding process
TH Su, HS Chiu, RY Chang, CH Hsu, CC Chien, CC Hsu
US Patent 9,409,335, 2016
62016
Graph-enhanced deep material network: multiscale materials modeling with microstructural informatics
JG Jean, TH Su, SJ Huang, CT Wu, CS Chen
Computational Mechanics 75 (1), 113-136, 2025
32025
Decoding material networks: exploring performance of deep material network and interaction-based material networks
WN Wan, TJ Wei, TH Su, CS Chen
Journal of Mechanics 40, 796-807, 2024
12024
Molding system for preparing an in-mold decorated article
CC Hsu, SU Tung-Huan, C Hsien-Sen, CH Hsu, RY Chang
US Patent 10,864,667, 2020
12020
Ink-wash and Warpage Defect Prediction from the In-Mold Decoration Process Simulation
SP Sun, TH Su, D Hsu
SPE ANTEC, 2017
1*2017
Orientation-aware interaction-based deep material network in polycrystalline materials modeling
TJ Wei, TH Su, CS Chen
arXiv preprint arXiv:2502.02457, 2025
2025
Application of the ISPG Method in Various Manufacturing Processes Simulation
L Zhang, X Pan, TH Su, J Xu, CT Wu, P Ho
2024 International LS-DYNA Conference, 2024
2024
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