| Study on wear properties of aluminium–silicon piston alloy MM Haque, A Sharif Journal of Materials Processing Technology 118, 69–73, 2001 | 214 | 2001 |
| Effect of volume in interfacial reaction between eutectic Sn-3.5% Ag-0.5% Cu solder and Cu metallization in microelectronic packaging MN Islam, A Sharif, YC Chan Journal of electronic materials 34, 143-149, 2005 | 130 | 2005 |
| The influence of addition of Al nano-particles on the microstructure and shear strength of eutectic Sn–Ag–Cu solder on Au/Ni metallized Cu pads AK Gain, T Fouzder, YC Chan, A Sharif, NB Wong, WKC Yung Journal of Alloys and Compounds 506 (1), 216-223, 2010 | 109 | 2010 |
| Effect of indium addition in Sn-rich solder on the dissolution of Cu metallization A Sharif, YC Chan Journal of Alloys and Compounds 390 (1-2), 67-73, 2005 | 100 | 2005 |
| Interfacial reactions of BGA Sn–3.5% Ag–0.5% Cu and Sn–3.5% Ag solders during high-temperature aging with Ni/Au metallization A Sharif, MN Islam, YC Chan Materials science and engineering: B 113 (3), 184-189, 2004 | 98 | 2004 |
| Effect of volume in interfacial reaction between eutectic Sn–Pb solder and Cu metallization in microelectronic packaging A Sharif, YC Chan, RA Islam Materials Science and Engineering: B 106 (2), 120-125, 2004 | 98 | 2004 |
| Transient liquid phase Ag-based solder technology for high-temperature packaging applications A Sharif, CL Gan, Z Chen Journal of Alloys and Compounds 587, 365-368, 2014 | 88 | 2014 |
| Influence of SrTiO3 nano-particles on the microstructure and shear strength of Sn–Ag–Cu solder on Au/Ni metallized Cu pads T Fouzder, I Shafiq, YC Chan, A Sharif, WKC Yung Journal of Alloys and Compounds 509 (5), 1885-1892, 2011 | 88 | 2011 |
| Dissolution kinetics of BGA Sn–Pb and Sn–Ag solders with Cu substrates during reflow A Sharif, YC Chan Materials Science and Engineering: B 106 (2), 126-131, 2004 | 88 | 2004 |
| Comparative study of the dissolution kinetics of electrolytic Ni and electroless Ni–P by the molten Sn3. 5Ag0. 5Cu solder alloy MN Islam, YC Chan, A Sharif, MO Alam Microelectronics Reliability 43 (12), 2031-2037, 2003 | 88 | 2003 |
| Influence of small amount of Al and Cu on the microstructure, microhardness and tensile properties of Sn–9Zn binary eutectic solder alloy SK Das, A Sharif, YC Chan, NB Wong, WKC Yung Journal of alloys and compounds 481 (1-2), 167-172, 2009 | 86 | 2009 |
| Effect of micron size Ni particle addition in Sn–8Zn–3Bi lead-free solder alloy on the microstructure, thermal and mechanical properties MM Billah, KM Shorowordi, A Sharif Journal of Alloys and Compounds 585, 32-39, 2014 | 68 | 2014 |
| Influence of Ag micro-particle additions on the microstructure, hardness and tensile properties of Sn–9Zn binary eutectic solder alloy M Ahmed, T Fouzder, A Sharif, AK Gain, YC Chan Microelectronics Reliability 50 (8), 1134-1141, 2010 | 61 | 2010 |
| Interfacial microstructure and shear strength of Ag nano particle doped Sn–9Zn solder in ball grid array packages AK Gain, YC Chan, A Sharif, NB Wong, WKC Yung Microelectronics Reliability 49 (7), 746-753, 2009 | 58 | 2009 |
| The effect of curing on the performance of ACF bonded chip‐on‐flex assemblies after thermal ageing MJ Rizvi, YC Chan, C Bailey, H Lu, A Sharif Soldering & Surface Mount Technology 17 (2), 40-48, 2005 | 57 | 2005 |
| Dissolution of electroless Ni metallization by lead-free solder alloys A Sharif, YC Chan, MN Islam, MJ Rizvi Journal of Alloys and Compounds 388 (1), 75-82, 2005 | 57 | 2005 |
| Evidence of superparamagnetism and improved electrical properties in Ba and Ta co-doped BiFeO3 ceramics MR Islam, MS Islam, MA Zubair, HM Usama, MS Azam, A Sharif Journal of Alloys and Compounds 735, 2584-2596, 2018 | 55 | 2018 |
| Polylactic acid (PLA)-based nanocomposites: Processing and properties A Sharif, S Mondal, ME Hoque Bio-based polymers and nanocomposites: Preparation, processing, properties …, 2019 | 53 | 2019 |
| Effect of nano Al2O3 additions on the microstructure, hardness and shear strength of eutectic Sn–9Zn solder on Au/Ni metallized Cu pads T Fouzder, AK Gain, YC Chan, A Sharif, WKC Yung Microelectronics Reliability 50 (12), 2051-2058, 2010 | 53 | 2010 |
| Understanding solubility, spinnability and electrospinning behaviour of cellulose acetate using different solvent systems S Majumder, MA Matin, A Sharif, MT Arafat Bulletin of Materials Science 42 (4), 171, 2019 | 52 | 2019 |
Y C ChanCity University of Hong Kong確認したメール アドレス: cityu.edu.hk
