| Growth, surface morphology, and electrical resistivity of fully strained substoichiometric epitaxial TiNx (0.67x<1.0) layers on MgO(001) J Greene | 151 | 2004 |
| Duplex TiN coatings deposited by arc plating for increased corrosion resistance of stainless steel substrates S Rudenja, C Leygraf, J Pan, P Kulu, E Talimets, V Mikli Surface and Coatings Technology 114 (2-3), 129-136, 1999 | 116 | 1999 |
| Passivation and anodic oxidation of duplex TiN coating on stainless steel S Rudenja, J Pan, IO Wallinder, C Leygraf, P Kulu Journal of The Electrochemical Society 146 (11), 4082, 1999 | 67 | 1999 |
| Surface interpenetrating networks of poly (ethylene terephthalate) and polyamides for effective biocidal properties S Liu, N Zhao, S Rudenja Macromolecular Chemistry and Physics 211 (3), 286-296, 2010 | 55 | 2010 |
| Low-temperature deposition of stoichiometric HfO2 on silicon: Analysis and quantification of the HfO2/Si interface from electrical and XPS measurements S Rudenja, A Minko, DA Buchanan Applied surface science 257 (1), 17-21, 2010 | 41 | 2010 |
| Electrodeposition of copper on Ru (0 0 0 1) in sulfuric acid solution: Growth kinetics and nucleation behavior J Kelber, S Rudenja, C Bjelkevig Electrochimica acta 51 (15), 3086-3090, 2006 | 38 | 2006 |
| The effects of an iodine surface layer on Ru reactivity in air and during Cu electrodeposition J Liu, J Lei, N Magtoto, S Rudenja, M Garza, JA Kelber Journal of the Electrochemical Society 152 (2), G115, 2004 | 34 | 2004 |
| Surface interpenetrating networks of polyacrylamide in poly (ethylene terephthalate) as a means of surface modification S Rudenja, N Zhao, S Liu European polymer journal 46 (10), 2078-2084, 2010 | 25 | 2010 |
| Cu electrodeposition on Ru (0001): Perchlorate dissociation and its effects on Cu deposition J Lei, S Rudenja, N Magtoto, JA Kelber Thin Solid Films 497 (1-2), 121-129, 2006 | 24 | 2006 |
| Electrodeposition of adherent copper film on unmodified tungsten C Wang, J Lei, C Bjelkevig, S Rudenja, N Magtoto, J Kelber Thin solid films 445 (1), 72-79, 2003 | 19 | 2003 |
| Seedless electrodeposition of Cu on unmodified tungsten C Wang, J Lei, S Rudenja, N Magtoto, J Kelber Electrochemical and solid-state letters 5 (9), C82, 2002 | 13 | 2002 |
| Corrosion performance of duplex TiN coatings deposited by arc plating S Rudenja, P Kulu, E Tallimets, V Mikli, CA Straede Surface and Coatings Technology 100, 247-250, 1998 | 11 | 1998 |
| Plasmonic device, system, and methods S Rudenja, MS Freund US Patent 8,314,445, 2012 | 9 | 2012 |
| Enhanced passivity of austenitic AISI 304 stainless steel by low-temperature ion nitriding S Rudenja, J Pan, IO Wallinder, C Leygraf, P Kulu, V Mikli Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films 19 (4 …, 2001 | 9 | 2001 |
| Conductor structures including penetrable materials JA Kelber, J Lei, NP Magtoto, S Rudenja US Patent 7,534,967, 2009 | 6 | 2009 |
| Corrosion Performance of Titanium-Based Composite Coatings Deposited by Physical Vapour Deposition S Rudenja, P KULU, E TALIMETS, V Mikli, O Forsen Proc. Estonian Acad. Sci. Engin 2 (1), 1996 | 4 | 1996 |
| Photoexcitation of Intrinsic Plasmon in Emeraldine Electroactive Device S Rudenja, MS Freund Journal of The Electrochemical Society 157 (8), H787, 2010 | 2 | 2010 |
| Conducting interpenetrating polymer networks, related methods, compositions and systems S Rudenja US Patent App. 14/098,520, 2015 | 1 | 2015 |
| Corrosion performance and structure of the titanium-based coatings deposited onto stainless steel substrate with arc plating S Rudenja, P Kulu, E Talimets, V Mikli, F Erikhov, C Straede Society of Vacuum Coaters 40 th Annual Technical Conference, 58-63, 1997 | 1 | 1997 |
| Effect of Low Power Deposition and Low Oxidation Temperature on the Interfacial and Structural Properties of sputtered HfO2 Gate Dielectrics A Minko, GS Belo, S Rudenja, DA Buchanan MRS Online Proceedings Library (OPL) 1394, mrsf11-1394-m04-10, 2012 | | 2012 |
