| Review on microstructure evolution in Sn–Ag–Cu solders and its effect on mechanical integrity of solder joints M Sona, KN Prabhu Journal of Materials Science: Materials in Electronics 24, 3149-3169, 2013 | 91 | 2013 |
| Individual dispersion of carbon nanotubes in epoxy via a novel dispersion–curing approach using ionic liquids N Hameed, NV Salim, TL Hanley, M Sona, BL Fox, Q Guo Physical Chemistry Chemical Physics 15 (28), 11696-11703, 2013 | 52 | 2013 |
| Evaluation of final irrigation regimens with maleic acid for smear layer removal and wettability of root canal sealer NV Ballal, CM Ferrer-Luque, M Sona, KN Prabhu, T Arias-Moliz, P Baca Acta Odontologica Scandinavica 76 (3), 199-203, 2018 | 24 | 2018 |
| Effects of smear layer removal agents on the physical properties and microstructure of mineral trioxide aggregate cement NV Ballal, M Sona, FR Tay Journal of dentistry 66, 32-36, 2017 | 23 | 2017 |
| The effect of reflow time on reactive wetting, evolution of interfacial IMCs and shear strength of eutectic Sn–Cu solder alloy M Sona, KN Prabhu Journal of Materials Science: Materials in Electronics 25, 1446-1455, 2014 | 23 | 2014 |
| Effect of reflow time on wetting behavior, microstructure evolution, and joint strength of Sn-2.5 Ag-0.5 Cu solder on bare and nickel-coated copper substrates M Sona, KN Prabhu Journal of Electronic Materials 45, 3744-3758, 2016 | 15 | 2016 |
| Spreading behaviour and joint reliability of Sn–0.3 Ag–0.7 Cu lead-free solder alloy on nickel coated copper substrate as a function of reflow time M Sona, K Narayan Prabhu Transactions of the Indian Institute of Metals 68, 1027-1031, 2015 | 10 | 2015 |
| Wettability and bond shear strength of Sn-9Zn lead-free solder alloy reflowed on copper substrate S Tikale, M Sona, KN Prabhu Materials Science Forum 830, 215-218, 2015 | 5 | 2015 |
| The effect of wetting gravity regime on shear strength of SAC and Sn-Pb solder Lap joints M Sona, KN Prabhu Journal of Materials Engineering and Performance 26, 4177-4187, 2017 | 4 | 2017 |
| Wettability, interfacial intermetallic growth and joint shear strength of eutectic Sn–Cu solder reflowed on bare and nickel-coated copper substrates M Sona, S Tikale, N Prabhu Transactions of the Indian Institute of Metals 72, 1579-1583, 2019 | 2 | 2019 |
| Effect of cooling rate on joint shear strength of Sn-9Zn lead-free solder alloy reflowed on copper substrate S Tikale, M Sona, K Narayan Prabhu Materials Performance and Characterization 6 (1), 46-54, 2017 | 1 | 2017 |
| Assessment of Joint Reliability of Sn–2.5 Ag–0.5 Cu Solder/Cu as a Function of Reflow Time M Sona, KN Prabhu Transactions of the Indian Institute of Metals 69, 941-947, 2016 | 1 | 2016 |
| Effect of reflow time on wetting kinetics, microstructure and joint strength of Sn-Cu and Sn-Ag-Cu solders M Sona National Institute of Technology Karnataka, Surathkal, 2017 | | 2017 |
| Wetting kinetics and joint strength of Sn-0.3 Ag-0.7 Cu lead-free solder alloy on copper substrate as a function of reflow time M Sona, K Narayan Prabhu Materials Science Forum 830, 286-289, 2015 | | 2015 |
| Improving the dispersion and mechanical properties of epoxy/carbon nanotube composites N Hameed, M Sona, N Salim, T Hanley, Q Guo Deakin University, 2011 | | 2011 |
K. NARAYAN PRABHUProfessor, Department of Metallurgical and Materials Engineering, NITK確認したメール アドレス: nitk.edu.in