| Microstructural, optical, and electrical characteristics of Ni/C doped BST thin films F Emadi, A Nemati, M Hinterstein, E Adabifiroozjaei Ceramics International 45 (5), 5503-5510, 2019 | 16 | 2019 |
| Co, In, and Co–In alloyed Cu6Sn5 interconnects: Microstructural and mechanical characteristics F Emadi, V Vuorinen, G Ross, M Paulasto-Kröckel Materials Science and Engineering: A 881, 145398, 2023 | 13 | 2023 |
| Microstructural and mechanical characterization of Cu/Sn SLID bonding utilizing Co as contact metallization layer F Emadi, V Vuorinen, S Mertin, K Widell, M Paulasto-Kröckel Journal of Alloys and Compounds 929, 167228, 2022 | 10 | 2022 |
| Ionic interdiffusion as interaction mechanism between Al and Si3N4 E Adabifiroozjaei, P Koshy, F Emadi, SS Mofarah, H Ma, E Rastkerdar, ... Journal of the American Ceramic Society 102 (8), 4835-4847, 2019 | 7 | 2019 |
| Investigation of the microstructural evolution and detachment of Co in contact with Cu–Sn electroplated silicon chips during solid-liquid interdiffusion bonding F Emadi, V Vuorinen, H Dong, G Ross, M Paulasto-Kröckel Journal of Alloys and Compounds 890, 161852, 2022 | 6 | 2022 |
| Thermoelectric characteristics of InAs nanowire networks directly grown on flexible plastic substrates T Koskinen, V Khayrudinov, F Emadi, H Jiang, T Haggren, H Lipsanen, ... ACS Applied Energy Materials 4 (12), 14727-14734, 2021 | 6 | 2021 |
| Low-temperature die attach for power components: Cu-Sn-In solid-liquid interdiffusion bonding F Emadi, S Liu, A Klami, N Tiwary, V Vuorinen, M Paulasto-Kröckel 2022 14th International Conference on Advanced Semiconductor Devices and …, 2022 | 4 | 2022 |
| Utilizing Co as a contact metallization for wafer-level Cu-Sn-In SLID bonding used in MEMS and MOEMS packaging F Emadi, V Vuorinen, M Paulasto-Kröckel 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC …, 2022 | 4 | 2022 |
| Novel Low-Temperature Interconnects for 2.5-/3-D MEMS Integration: Demonstration and Reliability F Emadi, V Vuorinen, S Liu, M Paulusto-Kröckel IEEE Transactions on Components, Packaging and Manufacturing Technology 14 …, 2024 | 1 | 2024 |
| Low-temperature SLID-TSV Interconnects for 3D (MEMS) Packaging F Emadi, S Liu, V Vuorinen, M Paulasto-Kröckel IEEE Transactions on Components, Packaging and Manufacturing Technology, 2025 | | 2025 |
| Contact Metallization Design for Low-Temperature Interconnects in MEMS Integration F Emadi | | 2024 |
Vesa VuorinenAalto University確認したメール アドレス: tkk.fi