| Scalable, sub 2μm pitch, Cu/SiCN to Cu/SiCN hybrid wafer-to-wafer bonding technology E Beyne, SW Kim, L Peng, N Heylen, J De Messemaeker, OO Okudur, ... 2017 IEEE International Electron Devices Meeting (IEDM), 32.4. 1-32.4. 4, 2017 | 159 | 2017 |
| Composite polymer core–ceria shell abrasive particles during oxide cmp: A defectivity study S Armini, J De Messemaeker, CM Whelan, M Moinpour, K Maex Journal of the Electrochemical Society 155 (9), H653, 2008 | 116 | 2008 |
| Reliability study on cobalt and ruthenium as alternative metals for advanced interconnects OV Pedreira, K Croes, A Leśniewska, C Wu, MH Van Der Veen, ... 2017 IEEE international reliability physics symposium (irps), 6B-2.1-6B-2.8, 2017 | 82 | 2017 |
| Degradation of Cu6Sn5 intermetallic compound by pore formation in solid–liquid interdiffusion Cu/Sn microbump interconnects I Panchenko, K Croes, I De Wolf, J De Messemaeker, E Beyne, KJ Wolter Microelectronic engineering 117, 26-34, 2014 | 74 | 2014 |
| Impact of post-plating anneal and through-silicon via dimensions on Cu pumping J De Messemaeker, OV Pedreira, B Vandevelde, H Philipsen, I De Wolf, ... 2013 IEEE 63rd electronic components and technology conference, 586-591, 2013 | 65 | 2013 |
| Correlation between Cu microstructure and TSV Cu pumping J De Messemaeker, OV Pedreira, H Philipsen, E Beyne, I De Wolf, ... 2014 IEEE 64th Electronic Components and Technology Conference (ECTC), 613-619, 2014 | 63 | 2014 |
| Texture of IF steel after equal channel angular pressing (ECAP) J De Messemaeker, B Verlinden, J Van Humbeeck Acta Materialia 53 (15), 4245-4257, 2005 | 53 | 2005 |
| On the impossibility of multi-pass equal-channel angular drawing J Alkorta, M Rombouts, J De Messemaeker, L Froyen, JG Sevillano Scripta materialia 47 (1), 13-18, 2002 | 45 | 2002 |
| Reliability challenges related to TSV integration and 3D stacking K Croes, J De Messemaeker, Y Li, W Guo, O Pedreira, V Cherman, ... IEEE Design & Test of Computers, 1-1, 2016 | 42 | 2016 |
| On the strength of boundaries in submicron IF steel J De Messemaeker, B Verlinden, J Van Humbeeck Materials Letters 58 (29), 3782-3786, 2004 | 29 | 2004 |
| Growth of millimeter-sized graphene single crystals on Al2O3 (0001)/Pt (111) template wafers using chemical vapor deposition K Verguts, Y Defossez, A Leonhardt, J De Messemaeker, K Schouteden, ... ECS Journal of Solid State Science and Technology 7 (12), M195, 2018 | 27 | 2018 |
| New Cu “Bulge-Out” Mechanism Supporting SubMicron Scaling of Hybrid Wafer-to-Wafer Bonding J De Messemaeker, L Witters, B Zhang, YW Tsau, F Fodor, J De Vos, ... 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 109-113, 2023 | 20 | 2023 |
| Statistical distribution of through-silicon via Cu pumping J De Messemaeker, PJ Roussel, OV Pedreira, T Van der Donck, ... IEEE Transactions on Device and Materials Reliability 17 (3), 549-559, 2017 | 20 | 2017 |
| Microstructure simulation of grain growth in Cu through silicon vias using phase-field modeling N Nabiollahi, N Moelans, M Gonzalez, J De Messemaeker, CJ Wilson, ... Microelectronics reliability 55 (5), 765-770, 2015 | 20 | 2015 |
| Impact of through silicon vias on front-end-of-line performance after thermal cycling and thermal storage VO Cherman, J De Messemaeker, K Croes, B Dimcic, G Van der Plas, ... 2012 IEEE International Reliability Physics Symposium (IRPS), 2B. 3.1-2B. 3.5, 2012 | 19 | 2012 |
| Effect of test structure on electromigration characteristics in three-dimensional through silicon via stacked devices Y Oba, J De Messemaeker, AM Tyrovouzi, Y Miyamori, J De Vos, T Wang, ... Japanese Journal of Applied Physics 54 (5S), 05EE01, 2015 | 17 | 2015 |
| Interaction forces between a glass surface and ceria-modified PMMA-based abrasives for CMP measured by colloidal probe AFM S Armini, R Burtovyy, M Moinpour, I Luzinov, J De Messemaeker, ... Journal of the Electrochemical Society 155 (4), H218, 2008 | 16 | 2008 |
| Impact of oxide liner properties on TSV Cu pumping and TSV stress J De Messemaeker, OV Pedreira, A Moussa, N Nabiollahi, K Vanstreels, ... 2015 IEEE International Reliability Physics Symposium, 4C. 5.1-4C. 5.10, 2015 | 15 | 2015 |
| Diffusion growth of Cu3Sn phase in the bump and thin film Cu/Sn structures B Dimcic, R Labie, J De Messemaeker, K Vanstreels, K Croes, ... Microelectronics Reliability 52 (9-10), 1971-1974, 2012 | 15 | 2012 |
| The challenges and solutions of Cu/SiCN wafer-to-wafer hybrid bonding scaling down to 400nm pitch SA Chew, B Zhang, K Vanstreels, E Chery, J De Messemaeker, L Witters, ... 2023 International Electron Devices Meeting (IEDM), 1-4, 2023 | 14 | 2023 |
