Frank Niklaus

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92 件の論文

16 件の論文

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Göran StemmeProfessor, Micro and Nanosystems, KTH Royal Institute of Technology, Sweden確認したメールアドレス: ee.kth.se
Andreas C FischerPh.D. from KTH Royal Institute of Technology in Stockholm, Sweden確認したメールアドレス: ee.kth.se
Kristinn B. GylfasonProfessor, Micro and Nanosystems, KTH Royal Institute of Technology確認したメールアドレス: kth.se
Niclas RoxhedAssistant Professor, KTH Royal Institute of Technology確認したメールアドレス: ee.kth.se
Fredrik ForsbergKTH Royal Institute of Technology確認したメールアドレス: ee.kth.se
Max C. LemmeProfessor, RWTH Aachen University, Germany, Director, AMO GmbH確認したメールアドレス: eld.rwth-aachen.de
Simon J. BleikerPhD Student in Micro and Nanosystmes, KTH Royal Institute of Technology確認したメールアドレス: kth.se
Stephan SchröderSenseair確認したメールアドレス: senseair.com
Anderson David SmithAssociate Professor, Chalmers University of Technology確認したメールアドレス: kth.se
Mikael ÖstlingKTH Royal Institute of Technology確認したメールアドレス: kth.se
Pierre EdingerPostdoctoral researcher, KTH Royal Institute of Technology確認したメールアドレス: kth.se
Xuge FanKTH Royal Institute of Technology確認したメールアドレス: kth.se
Wim BogaertsGhent University確認したメールアドレス: ugent.be
Peter Verheyen確認したメールアドレス: imec.be
Niels QuackThe University of Sydney確認したメールアドレス: sydney.edu.au
Alain Yuji TakabayashiEnlightra確認したメールアドレス: enlightra.com
Carlos Errando-HerranzTU Delft確認したメールアドレス: tudelft.nl
Georg S. DuesbergChair of Sensortechnology , Universität der Bundeswehr, Munich確認したメールアドレス: unibw.de
tommy haraldssonCTO Mercene Labs確認したメールアドレス: kth.se
Anna DelinProfessor of Computational Nanomagnetism, KTH, Stockholm確認したメールアドレス: kth.se

フォロー

Frank Niklaus

Professor of Micro and Nanosystems at KTH Royal Institute of Technology, Stockholm, Sweden

確認したメールアドレス: kth.se - ホームページ

MEMS NEMS Wafer Bonding Wafer-Level Packaging Micro 3D Printing


タイトル引用回数順公開年順タイトル順	引用先引用先	年
Handbook of Silicon Based MEMS Materials and Technologies M Tilli, T Motooka, VM Airaksinen, S Franssila, M Paulasto-Kröckel, ... Handbook of Silicon Based MEMS Materials and Technologies (Second Edition …, 2015	759*	2015
Adhesive wafer bonding F Niklaus, G Stemme, JQ Lu, RJ Gutmann Journal of applied physics 99 (3), 2006	699	2006
MEMS-based uncooled infrared bolometer arrays: a review F Niklaus, C Vieider, H Jakobsen MEMS/MOEMS technologies and applications III 6836, 125-139, 2008	468*	2008
Electromechanical piezoresistive sensing in suspended graphene membranes AD Smith, F Niklaus, A Paussa, S Vaziri, AC Fischer, M Sterner, ... Nano letters 13 (7), 3237-3242, 2013	449	2013
Resistive graphene humidity sensors with rapid and direct electrical readout AD Smith, K Elgammal, F Niklaus, A Delin, AC Fischer, S Vaziri, ... Nanoscale 7 (45), 19099-19109, 2015	360	2015
Integrating MEMS and ICs AC Fischer, F Forsberg, M Lapisa, SJ Bleiker, Stemme, Göran, N Roxhed, ... Microsystems & Nanoengineering 1 (1), 15005, 2015	354	2015
Low-temperature full wafer adhesive bonding F Niklaus, P Enoksson, E Kälvesten, G Stemme Journal of Micromechanics and Microengineering 11 (2), 100, 2001	326	2001
Method of joining components E Kälvesten, G Stemme, F Niklaus US Patent 7,067,345, 2006	265	2006
Sealing of adhesive bonded devices on wafer level J Oberhammer, F Niklaus, G Stemme Sensors and Actuators A: Physical 110 (1-3), 407-412, 2004	200	2004
Wearable all-solid-state potentiometric microneedle patch for intradermal potassium detection M Parrilla, M Cuartero, S Padrell Sánchez, M Rajabi, N Roxhed, F Niklaus, ... Analytical chemistry 91 (2), 1578-1586, 2018	181	2018
Handbook of wafer bonding P Ramm, JJQ Lu, MMV Taklo John Wiley & Sons, 2012	181	2012
Large-area integration of two-dimensional materials and their heterostructures by wafer bonding A Quellmalz, X Wang, S Sawallich, B Uzlu, M Otto, S Wagner, Z Wang, ... Nature communications 12 (1), 917, 2021	169	2021
Wafer-level heterogeneous integration for MOEMS, MEMS, and NEMS M Lapisa, G Stemme, F Niklaus IEEE Journal of Selected Topics in Quantum Electronics 17 (3), 629-644, 2011	166	2011
Hydrophobic valves of plasma deposited octafluorocyclobutane in DRIE channels H Andersson, W van der Wijngaart, P Griss, F Niklaus, G Stemme Sensors and Actuators B: Chemical 75 (1-2), 136-141, 2001	166	2001
Piezoresistive properties of suspended graphene membranes under uniaxial and biaxial strain in nanoelectromechanical pressure sensors AD Smith, F Niklaus, A Paussa, S Schröder, AC Fischer, M Sterner, ... ACS nano 10 (11), 9879-9886, 2016	154	2016
Nanoelectromechanical sensors based on suspended 2D materials MC Lemme, S Wagner, K Lee, X Fan, GJ Verbiest, S Wittmann, S Lukas, ... Research, 2020	152	2020
Selective wafer-level adhesive bonding with benzocyclobutene for fabrication of cavities J Oberhammer, F Niklaus, G Stemme Sensors and Actuators A: Physical 105 (3), 297-304, 2003	143	2003
Low temperature full wafer adhesive bonding of structured wafers F Niklaus, H Andersson, P Enoksson, G Stemme Sensors and Actuators A: Physical 92 (1-3), 235-241, 2001	140	2001
Encyclopedia of sensors CA Grimes, EC Dickey, MV Pishko, RA Marcus (No Title), 2006	133	2006
Performance model for uncooled infrared bolometer arrays and performance predictions of bolometers operating at atmospheric pressure F Niklaus, A Decharat, C Jansson, G Stemme Infrared Physics & Technology 51 (3), 168-177, 2008	117	2008

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