| Piezoelectric materials for energy harvesting and sensing applications: roadmap for future smart materials SD Mahapatra, PC Mohapatra, AI Aria, G Christie, YK Mishra, S Hofmann, ... Advanced Science 8 (17), 2100864, 2021 | 448 | 2021 |
| Recent advances in mitigation of whiskers from electroplated tin BS Majumdar, I Dutta, S Bhassyvasantha, S Das Mahapatra JOM 72, 906-917, 2020 | 15 | 2020 |
| Co-electrodeposition of tin with 0.2–20% indium: Implications on tin whisker growth SD Mahapatra, I Dutta Surface and Coatings Technology 337, 478-483, 2018 | 10 | 2018 |
| Elimination of Whisker Growth by Indium Addition in Electroplated Tin on Copper Substrate SD Mahapatra Washington State University, 2017 | 9 | 2017 |
| Whisker mitigation mechanisms in indium-doped tin thin films: role of the surface S Bhassyvasantha, N Fredj, SD Mahapatra, W Jennings, I Dutta, ... Journal of Electronic Materials 47, 6229-6240, 2018 | 6 | 2018 |
| Role of surface oxide in mitigating tin whisker growth: A finite element study SD Mahapatra, I Dutta Materials Science and Engineering: A 706, 181-191, 2017 | 5 | 2017 |
| Controlling tin whisker growth via oxygen-mediated decomposition of Ti2SnC H Tang, B Yan, P Zhang, X Yin, Z Tian, S Das Mahapatra, W Zheng, ... Journal of Materials Science 59 (5), 1958-1967, 2024 | 4 | 2024 |
| Eliminating whisker growth by indium addition in electroplated Sn on copper substrate S Das Mahapatra, BS Majumdar, I Dutta, S Bhassyvasantha Journal of Electronic Materials 46, 4062-4075, 2017 | 4 | 2017 |
| Elimination of Tin Whisker Growth by Indium Addition to Electroplated Tin in Electronic Packages BSMID S. Das Mahapatra 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena …, 2017 | 4 | 2017 |
| Influence of Indium Addition on Whisker Growth in Electroplated Sn ID S. Das Mahapatra, H. Yang, L. Meinshausen, S. Bhassyvasantha, S Banerjee ... The Ninth Pacific Rim International Conference on Advanced Materials and …, 2016 | 4* | 2016 |
| Method of electroplating tin films with indium using an alkanesulfonic acid based electrolyte I Dutta, SD Mahapatra US Patent App. 15/654,291, 2017 | 2 | 2017 |
| Chip-scale package architectures containing a die back side metal and a solder thermal interface material SD Mahapatra, M Sankarasubramanian, S Howell, J Harper, M Modi US Patent 12,040,246, 2024 | 1 | 2024 |
| Solder Thermal Interface Material (STIM) with Dopant PL Susmriti Das Mahapatra, Bamidele Falola, Amitesh Saha, Sergio Chan US Patent App. 16/406,593, 2019 | 1* | 2019 |
| Lids for Integrated Circuit Packages with Solder Thermal Interface Materials PL Bamidele Falola, Susmriti Das Mahapatra, Amitesh Saha, Sergio Chan US Patent App. 16/435,355, 2019 | 1* | 2019 |
| Chip-scale package architectures containing a die back side metal and a solder thermal interface material SD Mahapatra, M Sankarasubramanian, S Howell, J Harper, M Modi US Patent App. 18/744,108, 2024 | | 2024 |
Indranath DuttaWashington State University確認したメール アドレス: wsu.edu
