| In situ techniques for developing robust Li–S batteries M Li, Z Amirzadeh, R De Marco, XF Tan, A Whittaker, X Huang, R Wepf, ... Small Methods 2 (11), 1800133, 2018 | 49 | 2018 |
| Characterisation of lithium-ion battery anodes fabricated via in-situ Cu6Sn5 growth on a copper current collector XF Tan, SD McDonald, Q Gu, Y Hu, L Wang, S Matsumura, T Nishimura, ... Journal of Power Sources 415, 50-61, 2019 | 47 | 2019 |
| In-Situ Observation of the Continuous Phase Transition in Determining the High Thermoelectric Performance of Polycrystalline Sn0.98Se M Dargusch, XL Shi, XQ Tran, T Feng, F Somidin, X Tan, W Liu, K Jack, ... The Journal of Physical Chemistry Letters 10 (21), 6512-6517, 2019 | 42 | 2019 |
| Hydrogen storage performance and phase transformations in as-cast and extruded Mg-Ni-Gd-Y-Zn-Cu alloys H Yao, G Zeng, XF Tan, Q Gu, K Nogita, J Guo, Q Li Journal of Materials Science & Technology 151, 162-177, 2023 | 31 | 2023 |
| Strategies to enhance hydrogen storage performances in bulk Mg-based hydrides XF Tan, M Kim, K Yasuda, K Nogita Journal of Materials Science & Technology 153, 139-158, 2023 | 27 | 2023 |
| Systematic investigation of the effect of Ni concentration in Cu-xNi/Sn couples for high temperature soldering XF Tan, Q Gu, M Bermingham, SD McDonald, K Nogita Acta Materialia 226, 117661, 2022 | 23 | 2022 |
| Evidence of Copper Separation in Lithiated Cu6Sn5 Lithium-Ion Battery Anodes XF Tan, W Yang, K Aso, S Matsumura, SD McDonald, K Nogita ACS Applied Energy Materials 3 (1), 141-145, 2019 | 17 | 2019 |
| The effects of Ni on inhibiting the separation of Cu during the lithiation of Cu6Sn5 lithium-ion battery anodes XF Tan, SD McDonald, Q Gu, L Wang, S Matsumura, K Nogita Journal of Power Sources 440, 227085, 2019 | 17 | 2019 |
| Effect of trace Na additions on the hydriding kinetics of hypo-eutectic Mg–Ni alloys XQ Tran, SD McDonald, Q Gu, XF Tan, K Nogita International Journal of Hydrogen Energy 42 (10), 6851-6861, 2017 | 16 | 2017 |
| The effects of temperature and solute diffusion on volume change in Sn-Bi solder alloys Q Hao, XF Tan, Q Gu, K Sweatman, SD McDonald, K Nogita JOM 74 (4), 1739-1750, 2022 | 15 | 2022 |
| Rapid fabrication of tin-copper anodes for lithium-ion battery applications XF Tan, SA Belyakov, TC Su, Q Gu, S Liu, SD McDonald, CM Gourlay, ... Journal of Alloys and Compounds 867, 159031, 2021 | 14 | 2021 |
| Na-modified cast hypo-eutectic Mg–Mg2Si alloys for solid-state hydrogen storage XF Tan, M Kim, Q Gu, JP Piraquive, G Zeng, SD McDonald, K Nogita Journal of Power Sources 538, 231538, 2022 | 13 | 2022 |
| Hydrogen sorption behaviour of Mg-5wt.% La alloys after the initial hydrogen absorption process M Kim, XF Tan, Q Gu, SD McDonald, Y Ali, S Matsumura, K Nogita International Journal of Hydrogen Energy 47 (36), 16132-16143, 2022 | 13 | 2022 |
| Systems based on hypo-eutectic Mg–Mg2Ni alloys for medium to large scale hydrogen storage and delivery S Moroz, XF Tan, J Pierce, M Greaves, A Duguid, K Dumur, J Ng Journal of alloys and compounds 580, S329-S332, 2013 | 13 | 2013 |
| Temperature dependency of the growth rate of (Cu, Ni) 6Sn5 on Cu-xNi substrates XF Tan, NRA Razak, MH Husain, S McDonald, K Nogita IOP Conference Series: Materials Science and Engineering 701 (1), 012007, 2019 | 12 | 2019 |
| Properties of Sn-3 wt% Ag-5 wt% Cu alloys with Cu6Sn5 intermetallics grain refined by Mg CY Tan, MAAM Salleh, XF Tan, H Yasuda, N Saud, MII Ramli, K Nogita Materials Today Communications 31, 103221, 2022 | 11 | 2022 |
| Interfacial reactions between Ga and Cu-xNi (x= 0, 2, 6, 10, 14) substrates and the strength of Cu-xNi/Ga/Cu-xNi joints S Liu, XF Tan, SD McDonald, Q Gu, S Matsumura, K Nogita Intermetallics 133, 107168, 2021 | 10 | 2021 |
| The effects of Sb on the lattice and microstructure characteristics of hypo-eutectic Sn-Bi alloys XF Tan, Q Hao, Q Gu, SD McDonald, K Sweatman, M Bermingham, ... Materials Characterization 201, 112934, 2023 | 9 | 2023 |
| Mechanical Properties and Microstructure of Binary In-Sn Alloys for Flexible Low Temperature Electronic Joints J Zhou, XF Tan, SD McDonald, K Nogita Materials 15 (23), 8321, 2022 | 9 | 2022 |
| Comparison of the mechanical properties of conventional Pb-free solders and eutectic Sn-Bi solder Q Hao, XF Tan, SD McDonald, K Sweatman, T Nishimura, T Nishimura, ... 2022 International Conference on Electronics Packaging (ICEP), 173-174, 2022 | 8 | 2022 |