| Mechanical properties of intermetallic inclusions in Al 7075 alloys by micropillar compression SS Singh, E Guo, H Xie, N Chawla Intermetallics 62, 69-75, 2015 | 74 | 2015 |
| On the relationship between solder-controlled and intermetallic compound (IMC)-controlled fracture in Sn-based solder joints KE Yazzie, HX Xie, JJ Williams, N Chawla Scripta Materialia 66 (8), 586-589, 2012 | 69 | 2012 |
| Fabrication of Ag/polypyrrole coaxial nanocables through common ions adsorption effect A Chen, H Xie, H Wang, H Li, X Li Synthetic Metals 156 (2-4), 346-350, 2006 | 69 | 2006 |
| Mechanical characterization of microconstituents in a cast duplex stainless steel by micropillar compression EY Guo, HX Xie, SS Singh, A Kirubanandham, T Jing, N Chawla Materials Science and Engineering: A 598, 98-105, 2014 | 65 | 2014 |
| Electromigration damage characterization in Sn-3.9 Ag-0.7 Cu and Sn-3.9 Ag-0.7 Cu-0.5 Ce solder joints by three-dimensional X-ray tomography and scanning electron microscopy HX Xie, D Friedman, K Mirpuri, N Chawla Journal of electronic materials 43, 33-42, 2014 | 42 | 2014 |
| Mechanical shock behavior of Sn–3.9 Ag–0.7 Cu and Sn–3.9 Ag–0.7 Cu–0.5 Ce solder joints HX Xie, N Chawla Microelectronics Reliability 53 (5), 733-740, 2013 | 23 | 2013 |
| Thermal and mechanical stability of Ce-containing Sn-3.9 Ag-0.7 Cu lead-free solder on Cu and electroless Ni-P metallizations H Xie, N Chawla, K Mirpuri Journal of electronic materials 41, 3249-3258, 2012 | 23 | 2012 |
| Orientation dependence of indentation behavior in Al–SiC nanolaminate composites C Mayer, LW Yang, SS Singh, H Xie, YL Shen, J Llorca, ... Materials Letters 168, 129-133, 2016 | 20 | 2016 |
| The synthesis of Ag/polypyrrole coaxial nanocables via ion adsorption method using different oxidants T Qiu, H Xie, J Zhang, A Zahoor, X Li Journal of Nanoparticle Research 13, 1175-1182, 2011 | 19 | 2011 |
| Mechanisms of deformation in high-ductility Ce-containing Sn–Ag–Cu solder alloys HX Xie, N Chawla, YL Shen Microelectronics Reliability 51 (6), 1142-1147, 2011 | 18 | 2011 |
| Microstructure‐based modeling of deformation in steels based on constitutive relationships from micropillar compression EY Guo, SS Singh, H Xie, JJ Williams, T Jing, N Chawla steel research international 85 (6), 946-953, 2014 | 13 | 2014 |
| Effect of cerium addition on wetting, undercooling, and mechanical properties of Sn-3.9 Ag-0.7 Cu Pb-free solder alloys HX Xie, L Jiang, N Chawla Journal of Materials Science: Materials in Electronics 24, 3456-3466, 2013 | 11 | 2013 |
| Enhancing the ductility of Sn-Ag-Cu lead-free solder joints by addition of compliant intermetallics HX Xie, N Chawla Journal of electronic materials 42, 527-536, 2013 | 11 | 2013 |
| Tensile behavior of single-crystal tin whiskers SS Singh, R Sarkar, HX Xie, C Mayer, J Rajagopalan, N Chawla Journal of electronic materials 43, 978-982, 2014 | 6 | 2014 |
| Fabrication of Ag/Polypyrrole (PPy) Coaxial Nanocables Through Ions Adsorption Method HX XIE, T QIU, XY LI CHEMICAL JOURNAL OF CHINESE UNIVERSITIES, 2008 | 2* | 2008 |
| Properties of Cerium Containing Lead Free Solder H Xie Arizona State University, 2012 | | 2012 |
Nikhilesh ChawlaPurdue University確認したメール アドレス: purdue.edu
