| Compute-capable block RAMs for efficient deep learning acceleration on FPGAs X Wang, V Goyal, J Yu, V Bertacco, A Boutros, E Nurvitadhi, C Augustine, ... 2021 IEEE 29th Annual International Symposium on Field-Programmable Custom …, 2021 | 29 | 2021 |
| Analysis of microbump overheads for 2.5 D disintegrated design P Ehrett, V Goyal, O Matthews, R Das, T Austin, V Bertacco UMich. Ann Arbor Tech. Rep. CSE-TR-002-17, 2017 | 12 | 2017 |
| Neksus: An interconnect for heterogeneous system-in-package architectures V Goyal, X Wang, V Bertacco, R Das 2020 IEEE International Parallel and Distributed Processing Symposium (IPDPS …, 2020 | 8 | 2020 |
| Hardware-friendly user-specific machine learning for edge devices V Goyal, R Das, V Bertacco ACM Transactions on Embedded Computing Systems (TECS) 21 (5), 1-29, 2022 | 6 | 2022 |
| Myml: User-driven machine learning V Goyal, V Bertacco, R Das 2021 58th ACM/IEEE Design Automation Conference (DAC), 145-150, 2021 | 4 | 2021 |
| FirmLeak: A framework for efficient and accurate runtime estimation of leakage power by firmware A Joseph, A Haridass, C Lefurgy, S Rachamalla, S Pai, D Chinnakkonda, ... 2015 28th International Conference on VLSI Design, 464-469, 2015 | 2 | 2015 |
| Seesaw: end-to-end dynamic sensing for IoT using machine learning V Goyal, V Bertacco, R Das 2020 57th ACM/IEEE Design Automation Conference (DAC), 1-19, 2020 | 1 | 2020 |
| Evergreen: Comprehensive Carbon Model for Performance-Emission Tradeoffs T Adem, A McCrabb, V Goyal, V Bertacco 2024 IEEE International Symposium on Workload Characterization (IISWC), 132-143, 2024 | | 2024 |
| Duet: A Collaborative User Driven Recommendation System for Edge Devices V Goyal, V Bertacco, R Das Proceedings of the 61st ACM/IEEE Design Automation Conference, 1-6, 2024 | | 2024 |
| Building User-Driven Edge Devices V Goyal University of Michigan Ann Arbor, 2022 | | 2022 |
| Efficient System-In-Package Architecture for Heterogeneous Systems V Goyal, X Wang, V Bertacco, R Das | | |
Valeria BertaccoMary Lou Dorf Professor, Computer Science and Engineering, University of Michigan確認したメール アドレス: umich.edu