| New Insights into the transformation of calcium sulfate hemihydrate to gypsum using time-resolved cryogenic transmission electron microscopy A Saha, J Lee, SM Pancera, MF Bräeu, A Kempter, A Tripathi, A Bose Langmuir 28 (30), 11182-11187, 2012 | 121 | 2012 |
| Oil Emulsification Using Surface-Tunable Carbon Black Particles A Saha, A Nikova, P Venkataraman, VT John, A Bose ACS applied materials & interfaces 5 (8), 3094-3100, 2013 | 119 | 2013 |
| High capacity, stable silicon/carbon anodes for lithium-ion batteries prepared using emulsion-templated directed assembly Y Chen, M Nie, BL Lucht, A Saha, PR Guduru, A Bose ACS applied materials & interfaces 6 (7), 4678-4683, 2014 | 38 | 2014 |
| In Situ Assembly of Hydrophilic and Hydrophobic Nanoparticles at Oil–Water Interfaces as a Versatile Strategy To Form Stable Emulsions A Saha, VT John, A Bose ACS applied materials & interfaces 7 (38), 21010-21014, 2015 | 30 | 2015 |
| Shear free and blotless cryo-TEM imaging: a new method for probing early evolution of nanostructures J Lee, A Saha, SM Pancera, A Kempter, J Rieger, A Bose, A Tripathi Langmuir 28 (9), 4043-4046, 2012 | 25 | 2012 |
| Corrosion in Liquid Cooling Systems with Water-Based Coolant–Part 2: Corrosion Reliability Testing and Failure Model CU Kim, G Ni, G Kini, JY Chang, A Saha, A Antoniswamy, I Klein, ... 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2020 | 11 | 2020 |
| Corrosion in Liquid Cooling Systems with Water-Based Coolant–Part 1: Flow Loop Design for Reliability Tests G Kini, CU Kim, H Madanipour, JY Chang, A Saha, A Antoniswamy, ... 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2020 | 8 | 2020 |
| Impact of nearly water-insoluble additives on the properties of vesicular suspensions A Saha, S Chaudhuri, MP Godfrin, M Mamak, B Reeder, T Hodgdon, ... Industrial & Engineering Chemistry Research 56 (4), 899-906, 2017 | 8 | 2017 |
| Channeled lids for integrated circuit packages M Dubey, A Saha, MA Cartas, P Li, BD Falola US Patent 11,670,569, 2023 | 7 | 2023 |
| Integrated circuit packages with thermal interface materials with different material compositions SAC Arguedas, A Saha, MA Cartas, K Hackenberg, ET Valles US Patent 12,062,592, 2024 | 6 | 2024 |
| Integrated circuit packages with solder thermal interface materials with embedded particles A Saha, SAC Arguedas, MA Cartas, K Hackenberg, P Li US Patent App. 16/423,700, 2020 | 3 | 2020 |
| Thermal management solutions for integrated circuit packages A Saha, JY Chang, BK Gebrehiwot US Patent App. 16/273,633, 2020 | 3 | 2020 |
| Latex Ink Receptive Coating A Saha US Patent App. 16/336,186, 2019 | 2 | 2019 |
| Lids for integrated circuit packages with solder thermal interface materials BD Falola, SD Mahapatra, SAC Arguedas, P Li, A Saha US Patent 11,817,369, 2023 | 1 | 2023 |
| Solder thermal interface material (stim) with dopant SD Mahapatra, BD Falola, A Saha, P Li US Patent App. 16/406,593, 2020 | 1 | 2020 |
| UNDERSTANDING BEHAVIOR OF PARTICLE STABILIZED EMULSIONS AND TRANSFORMATIONS IN COLLOIDAL SYSTEMS A Saha | 1 | 2015 |
| Oil emulsification using responsive carbon black particles A Saha, A Nikova, P Venkataraman, V John, A Bose, PAH Reduces papers of the american chemical society, 1155, 2012 | 1 | 2012 |
| Thermal Management and Integrated Heat Spreader Assembly Challenges of Products with Variable Die Heights A Chowdhury, KV Valavala, A Saha, SAC Arguedas, SS Howell, P Li 2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical …, 2024 | | 2024 |
| Knowledge Based Qualification for Thermal Interface Material Reliability E Armagan, A Saha, KC Liu, B Gebrehiwot, M Cartas, A Das, T Rawlings, ... 2023 IEEE International Reliability Physics Symposium (IRPS), 1-7, 2023 | | 2023 |
| Thermal management solutions using self-healing polymeric thermal interface materials A Saha, S Gong, S Kothari US Patent 11,551,997, 2023 | | 2023 |
Arijit BoseUniversity of Rhode Island確認したメール アドレス: uri.edu