| The phenotypic variability of amyotrophic lateral sclerosis B Swinnen, W Robberecht Nature Reviews Neurology 10 (11), 661-670, 2014 | 732 | 2014 |
| 3-D technology assessment: Path-finding the technology/design sweet-spot P Marchal, B Bougard, G Katti, M Stucchi, W Dehaene, A Papanikolaou, ... Proceedings of the IEEE 97 (1), 96-107, 2009 | 306 | 2009 |
| 3D integration by Cu-Cu thermo-compression bonding of extremely thinned bulk-Si die containing 10 μm pitch through-Si vias B Swinnen, W Ruythooren, P De Moor, L Bogaerts, L Carbonell, ... 2006 international electron devices meeting, 1-4, 2006 | 266 | 2006 |
| 3D stacked IC demonstration using a through silicon via first approach J Van Olmen, A Mercha, G Katti, C Huyghebaert, J Van Aelst, E Seppala, ... 2008 IEEE International Electron Devices Meeting, 1-4, 2008 | 182 | 2008 |
| Intravenous alteplase for stroke with unknown time of onset guided by advanced imaging: systematic review and meta-analysis of individual patient data G Thomalla, F Boutitie, H Ma, M Koga, P Ringleb, LH Schwamm, O Wu, ... The Lancet 396 (10262), 1574-1584, 2020 | 176 | 2020 |
| RNA toxicity in non‐coding repeat expansion disorders B Swinnen, W Robberecht, L Van Den Bosch The EMBO journal 39 (1), e101112, 2020 | 157 | 2020 |
| A zebrafish model for C9orf72 ALS reveals RNA toxicity as a pathogenic mechanism B Swinnen, A Bento-Abreu, TF Gendron, S Boeynaems, E Bogaert, ... Acta neuropathologica 135, 427-443, 2018 | 155 | 2018 |
| Comprehensive analysis of the impact of single and arrays of through silicon vias induced stress on high-k/metal gate CMOS performance A Mercha, G Van der Plas, V Moroz, I De Wolf, P Asimakopoulos, N Minas, ... 2010 International Electron Devices Meeting, 2.2. 1-2.2. 4, 2010 | 144 | 2010 |
| Impact of 3D design choices on manufacturing cost D Velenis, M Stucchi, EJ Marinissen, B Swinnen, E Beyne 2009 IEEE International Conference on 3D System Integration, 1-5, 2009 | 127 | 2009 |
| Through-silicon via and die stacking technologies for microsystems-integration E Beyne, P De Moor, W Ruythooren, R Labie, A Jourdain, H Tilmans, ... 2008 IEEE International Electron Devices Meeting, 1-4, 2008 | 127 | 2008 |
| Mechanical reliability of Au and Cu wire bonds to Al, Ni/Au and Ni/Pd/Au capped Cu bond pads P Ratchev, S Stoukatch, B Swinnen Microelectronics Reliability 46 (8), 1315-1325, 2006 | 113 | 2006 |
| Method for chip singulation E Beyne, B Swinnen, S Vanhaelemeersch US Patent 7,566,634, 2009 | 95 | 2009 |
| HDAC6 inhibition restores TDP‐43 pathology and axonal transport defects in human motor neurons with TARDBP mutations R Fazal, S Boeynaems, A Swijsen, M De Decker, L Fumagalli, M Moisse, ... The EMBO journal 40 (7), e106177, 2021 | 93 | 2021 |
| Elongator subunit 3 (ELP3) modifies ALS through tRNA modification A Bento-Abreu, G Jager, B Swinnen, L Rué, S Hendrickx, A Jones, ... Human molecular genetics 27 (7), 1276-1289, 2018 | 88 | 2018 |
| Extraction of the appropriate material property for realistic modeling of through-silicon-vias using μ-Raman spectroscopy C Okoro, Y Yang, B Vandevelde, B Swinnen, D Vandepitte, B Verlinden, ... 2008 International Interconnect Technology Conference, 16-18, 2008 | 87 | 2008 |
| Via first plus via last technique for IC interconnects K Kaskoun, S Gu, B Swinnen US Patent 7,939,926, 2011 | 84 | 2011 |
| 3D stacked ICs using Cu TSVs and die to wafer hybrid collective bonding G Katti, A Mercha, J Van Olmen, C Huyghebaert, A Jourdain, M Stucchi, ... 2009 IEEE international electron devices meeting (IEDM), 1-4, 2009 | 84 | 2009 |
| Styloid and hyoid bone proximity is a risk factor for cervical carotid artery dissection D Renard, S Azakri, C Arquizan, B Swinnen, P Labauge, V Thijs Stroke 44 (9), 2475-2479, 2013 | 76 | 2013 |
| C9orf72 loss-of-function: a trivial, stand-alone or additive mechanism in C9 ALS/FTD? E Braems, B Swinnen, L Van Den Bosch Acta neuropathologica 140 (5), 625-643, 2020 | 74 | 2020 |
| Scalable through silicon via with polymer deep trench isolation for 3D wafer level packaging DS Tezcan, F Duval, H Philipsen, O Luhn, P Soussan, B Swinnen 2009 59th Electronic Components and Technology Conference, 1159-1164, 2009 | 71 | 2009 |
