| Carbon nanotube-based composite filaments for 3d printing of structural and conductive elements B Podsiadły, P Matuszewski, A Skalski, M Słoma Applied Sciences 11 (3), 1272, 2021 | 57 | 2021 |
| Heterophase materials for fused filament fabrication of structural electronics B Podsiadły, A Skalski, B Wałpuski, M Słoma Journal of Materials Science: Materials in Electronics 30, 1236-1245, 2019 | 38 | 2019 |
| Highly conductive carbon nanotube-thermoplastic polyurethane nanocomposite for smart clothing applications and beyond S Lepak-Kuc, B Podsiadły, A Skalski, D Janczak, M Jakubowska, ... Nanomaterials 9 (9), 1287, 2019 | 31 | 2019 |
| Are we able to print components as strong as injection molded?—comparing the properties of 3D printed and injection molded components made from ABS thermoplastic B Podsiadły, A Skalski, W Rozpiórski, M Słoma Applied Sciences 11 (15), 6946, 2021 | 24 | 2021 |
| Influence of process parameters on the resistivity of 3D printed electrically conductive structures K Dembek, B Podsiadły, M Słoma Micromachines 13 (8), 1203, 2022 | 11 | 2022 |
| 3d printed electronic circuits from fusible alloys B Podsiadły, L Bezgan, M Słoma Electronics 11 (22), 3829, 2022 | 8 | 2022 |
| CNT/Graphite/SBS conductive fibers for strain sensing in wearable telerehabilitation devices P Walter, B Podsiadły, M Zych, M Kamiński, A Skalski, T Raczyński, ... Sensors 22 (3), 800, 2022 | 8 | 2022 |
| Soldering of electronics components on 3D-printed conductive substrates B Podsiadły, A Skalski, M Słoma Materials 14 (14), 3850, 2021 | 8 | 2021 |
| Conductive ABS/Ni composite filaments for fused deposition modeling of structural electronics B Podsiadły, A Skalski, M Słoma Mechatronics 2019: Recent Advances Towards Industry 4.0, 62-70, 2020 | 7 | 2020 |
| Electrically conductive nanocomposite fibers for flexible and structural electronics B Podsiadły, P Walter, M Kamiński, A Skalski, M Słoma Applied Sciences 12 (3), 941, 2022 | 5 | 2022 |
| Electrical and rheological percolation threshold of graphene pastes for screen-printing L Dybowska-Sarapuk, D Janczak, B Podsiadly, M Jakubowska, M Sloma Circuit World 45 (1), 26-30, 2019 | 4 | 2019 |
| Electrically conductive acrylonitrile butadiene styrene (ABS)/copper composite filament for fused deposition modeling B Podsiadły, A Skalski, B Wałpuski, P Walter, M Słoma Photonics Applications in Astronomy, Communications, Industry, and High …, 2018 | 4 | 2018 |
| Common configurations and challenges in screen-printed enzymatic electrochemical biosensors P Walter, B Podsiadły, B Wałpuski, M Jakubowska Photonics Applications in Astronomy, Communications, Industry, and High …, 2018 | 4 | 2018 |
| Kami nski P Walter, B Podsiadły, M Zych M, 0 | 4 | |
| Mechanical and thermal properties of ABS/iron composite for fused deposition modeling B Podsiadły, A Skalski, M Słoma Photonics Applications in Astronomy, Communications, Industry, and High …, 2019 | 1 | 2019 |
| Opracowanie i badania właściwości materiałów kompozytowych do wytwarzania obwodów elektroniki strukturalnej technikami przyrostowymi B Podsiadły The Institute of Metrology and Biomedical Engineering, 2023 | | 2023 |
| Conductive Paths and Connections on Polymer Substrates for Structural Electronics B Wałpuski, B Podsiadły, JJ Krzemiński, M Słoma Periodica Polytechnica Electrical Engineering and Computer Science 63 (2), 94-98, 2019 | | 2019 |
| Electrical and rheological percolation threshold of the graphene screen printing pastes Ł Dybowska-Sarapuk, D Janczak, B Podsiadły, M Jakubowska, M Słoma Circuit World 45 (1), 2019 | | 2019 |
| Rapid prototyping in printed electronics B Wałpuski, JJ Szałapak, BJ Podsiadły, PA Walter, M Słoma Photonics Applications in Astronomy, Communications, Industry, and High …, 2018 | | 2018 |
| Development of polymer composites containing copper powder BJ Podsiadły Instytut Metrologii i Inżynierii Biomedycznej, 2017 | | 2017 |
