Molecular dynamics simulation of nanoindentation on Cu/Ni nanotwinned multilayer films using a spherical indenter T Fu, X Peng, X Chen, S Weng, N Hu, Q Li, Z Wang Scientific reports 6 (1), 35665, 2016 | 146 | 2016 |
Molecular dynamics study of strengthening mechanism of nanolaminated graphene/Cu composites under compression S Weng, H Ning, T Fu, N Hu, Y Zhao, C Huang, X Peng Scientific reports 8 (1), 3089, 2018 | 135 | 2018 |
Preparation and characterization of graphene oxide/silk fibroin hybrid aerogel for dye and heavy metal adsorption S Wang, H Ning, N Hu, K Huang, S Weng, X Wu, L Wu, J Liu Composites Part B: Engineering 163, 716-722, 2019 | 121 | 2019 |
Environmentally‐friendly and multifunctional graphene‐silk fabric strain sensor for human‐motion detection S Wang, H Ning, N Hu, Y Liu, F Liu, R Zou, K Huang, X Wu, S Weng, ... Advanced materials interfaces 7 (1), 1901507, 2020 | 108 | 2020 |
Strengthening effects of twin interface in Cu/Ni multilayer thin films–A molecular dynamics study S Weng, H Ning, N Hu, C Yan, T Fu, X Peng, S Fu, J Zhang, C Xu, D Sun, ... Materials & Design 111, 1-8, 2016 | 97 | 2016 |
The interfacial mechanical properties of functionalized graphene–polymer nanocomposites F Liu, N Hu, J Zhang, S Atobe, S Weng, H Ning, Y Liu, L Wu, Y Zhao, F Mo, ... RSC advances 6 (71), 66658-66664, 2016 | 71 | 2016 |
Rapid volatilization induced mechanically robust shape-morphing structures toward 4D printing Q Zhang, X Kuang, S Weng, Z Zhao, H Chen, D Fang, HJ Qi ACS applied materials & interfaces 12 (15), 17979-17987, 2020 | 67 | 2020 |
Molecular dynamics simulation of effects of twin interfaces on Cu/Ni multilayers T Fu, X Peng, S Weng, Y Zhao, F Gao, L Deng, Z Wang Materials Science and Engineering: A 658, 1-7, 2016 | 65 | 2016 |
Shape‐memory balloon structures by pneumatic multi‐material 4D printing Q Zhang, X Kuang, S Weng, L Yue, DJ Roach, D Fang, HJ Qi Advanced Functional Materials 31 (21), 2010872, 2021 | 63 | 2021 |
Design for the reduction of volume shrinkage-induced distortion in digital light processing 3D printing Q Zhang, S Weng, CM Hamel, SM Montgomery, J Wu, X Kuang, K Zhou, ... Extreme Mechanics Letters 48, 101403, 2021 | 59 | 2021 |
Molecular dynamics simulation of TiN (001) thin films under indentation T Fu, X Peng, Y Zhao, R Sun, S Weng, C Feng, Z Wang Ceramics International 41 (10), 14078-14086, 2015 | 51 | 2015 |
A comprehensive review of characterization and simulation methods for thermo-stamping of 2D woven fabric reinforced thermoplastics Y Gong, Z Song, H Ning, N Hu, X Peng, X Wu, R Zou, F Liu, S Weng, ... Composites Part B: Engineering 203, 108462, 2020 | 46 | 2020 |
4D printing of glass fiber-regulated shape shifting structures with high stiffness S Weng, X Kuang, Q Zhang, CM Hamel, DJ Roach, N Hu, H Jerry Qi ACS Applied Materials & Interfaces 13 (11), 12797-12804, 2020 | 43 | 2020 |
Strain rate dependence of tension and compression behavior in nano-polycrystalline vanadium nitride T Fu, X Peng, C Huang, S Weng, Y Zhao, Z Wang, N Hu Ceramics International 43 (15), 11635-11641, 2017 | 42 | 2017 |
Synergistic effect of CB and MWCNT on the strain-induced DC and AC electrical properties of PVDF-HFP composites K Huang, H Ning, N Hu, X Wu, S Wang, S Weng, W Yuan, L Wu, Y Liu Carbon 144, 509-518, 2019 | 26 | 2019 |
In-plane anisotropy and twin boundary effects in vanadium nitride under nanoindentation T Fu, X Peng, C Huang, H Xiang, S Weng, Z Wang, N Hu Scientific reports 7 (1), 4768, 2017 | 26 | 2017 |
Anisotropic phase transformation in B2 crystalline CuZr alloy S Weng, T Fu, X Peng, X Chen Nanoscale Research Letters 14, 1-12, 2019 | 25 | 2019 |
Mode-II interlaminar fracture toughness of GFRP/Al laminates improved by surface modified VGCF interleaves H Ning, S Weng, N Hu, C Yan, J Liu, J Yao, Y Liu, X Peng, S Fu, J Zhang Composites Part B: Engineering 114, 365-372, 2017 | 25 | 2017 |
Grain size dependence of tensile properties in nanocrystalline diamond C Huang, X Peng, B Yang, S Weng, Y Zhao, T Fu Computational Materials Science 157, 67-74, 2019 | 24 | 2019 |
Dislocation reaction-based formation mechanism of stacking fault tetrahedra in FCC high-entropy alloy Q Liang, S Weng, T Fu, S Hu, X Peng Materials Chemistry and Physics 282, 125997, 2022 | 23 | 2022 |