| A bioinspired coating for stabilizing Li metal batteries C Wang, C Ying, J Shang, SE Karcher, J McCloy, J Liu, WH Zhong ACS Applied Materials & Interfaces 14 (38), 43886-43896, 2022 | 18 | 2022 |
| The effects of Sn solder grain size on the morphology and evolution of Cu6Sn5 in the aging process Z Zhao, J Shang, A Hu, M Li Materials Letters 185, 92-95, 2016 | 12 | 2016 |
| Diffusion barrier effect of Ta/Ti bilayer in organic dielectric/Cu interconnects J Shang, J Hao, T Hang, M Li Thin Solid Films 653, 113-118, 2018 | 10 | 2018 |
| An ambient temperature ultrasonic bonding technology based on Cu micro-cone arrays for 3D packaging P Xu, F Hu, J Shang, A Hu, M Li Materials Letters 176, 155-158, 2016 | 9 | 2016 |
| Study on TSV-Cu protrusion under different annealing conditions and optimization Q Deng, L Huang, J Shang, M Li 2016 17th International Conference on Electronic Packaging Technology (ICEPT …, 2016 | 7 | 2016 |
| Interface adhesion study of Cu interconnection and low-k organic materials J Shang, J Hao, Q Deng, T Hang, M Li 2016 17th International Conference on Electronic Packaging Technology (ICEPT …, 2016 | 7 | 2016 |
| The effect of dopant concentration and annealing treatments on N-type Iodine doped CdTe J Shang, M Murugesan, S Bigbee-Hansen, SK Swain, JN Duenow, ... Journal of Alloys and Compounds 960, 170625, 2023 | 6 | 2023 |
| Converting commercial Fe2O3 to effective anode material using glucose as “etching” agent C Wang, P Sireesha, J Shang, JS McCloy, J Liu, WH Zhong Ceramics International 49 (20), 32652-32662, 2023 | 4 | 2023 |
| Impact of substrate materials on packages warpage J Hao, J Shang, X Liu, T Hang, L Gao, M Li 2017 18th International Conference on Electronic Packaging Technology (ICEPT …, 2017 | 3 | 2017 |
| Impact of tensile strength on thermal fatigue properties and failure modes of Sn-Ag-Cu-Ni solder joints X Liu, J Shang, J Hao, A Hu, L Gao, M Li 2017 18th International Conference on Electronic Packaging Technology (ICEPT …, 2017 | 3 | 2017 |
| Structural and Electronic Properties of Indium-Doped n-type Cd-Se-Te Crystals J Shang, M Murugesan, R Gul, S Bigbee-Hansen, JM Tallan, JN Duenow, ... Journal of Electronic Materials, 1-13, 2024 | 1 | 2024 |
| Soy protein as a dual-functional bridge enabling high performance solid electrolyte for Li metal batteries C Wang, LL Ren, C Ying, J Shang, J McCloy, J Liu, WH Zhong Journal of Power Sources 620, 235260, 2024 | | 2024 |
| Characterization of n-Type Iodine-Doped and Indium-Doped CdTe/Cd-Se-Te Thin Films Fabricated by Close-Spaced Sublimation Epitaxy J Shang, JN Duenow, SW Johnston, HR Moutinho, M Murugesan, ... 2024 IEEE 52nd Photovoltaic Specialist Conference (PVSC), 1523-1531, 2024 | | 2024 |
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