Synthesis of Sintering-Resistant Sorbents for CO2 Capture W Liu, B Feng, Y Wu, G Wang, J Barry, JC Diniz da Costa Environmental science & technology 44 (8), 3093-3097, 2010 | 272 | 2010 |
Deformation mechanism and force modelling of the grinding of YAG single crystals C Li, X Li, Y Wu, F Zhang, H Huang International Journal of Machine Tools and Manufacture 143, 23-37, 2019 | 263 | 2019 |
Synthesis, growth mechanism and thermal stability of copper nanoparticles encapsulated by multi-layer graphene S Wang, X Huang, Y He, H Huang, Y Wu, L Hou, X Liu, T Yang, J Zou, ... Carbon 50 (6), 2119-2125, 2012 | 256 | 2012 |
Deformation characteristics and surface generation modelling of crack-free grinding of GGG single crystals C Li, Y Wu, X Li, L Ma, F Zhang, H Huang Journal of Materials Processing Technology 279, 116577, 2020 | 125 | 2020 |
Nanoscratch-induced phase transformation of monocrystalline Si YQ Wu, H Huang, J Zou, LC Zhang, JM Dell Scripta Materialia 63 (8), 847-850, 2010 | 105 | 2010 |
Grinding of silicon wafers using an ultrafine diamond wheel of a hybrid bond material Z Zhang, F Huo, Y Wu, H Huang International Journal of Machine Tools and Manufacture 51 (1), 18-24, 2011 | 101 | 2011 |
Towards understanding the brittle–ductile transition in the extreme manufacturing T Zhang, F Jiang, H Huang, J Lu, Y Wu, Z Jiang, X Xu International Journal of Extreme Manufacturing 3 (2), 022001, 2021 | 93 | 2021 |
Kinetics of the η–η′ transformation in Cu6Sn5 K Nogita, CM Gourlay, SD McDonald, YQ Wu, J Read, QF Gu Scripta Materialia 65 (10), 922-925, 2011 | 89 | 2011 |
Effect of Ni on phase stability and thermal expansion of Cu6− xNixSn5 (X= 0, 0.5, 1, 1.5 and 2) K Nogita, D Mu, SD McDonald, J Read, YQ Wu Intermetallics 26, 78-85, 2012 | 83 | 2012 |
Superior electrical properties of crystalline Er2O3 films epitaxially grown on Si substrates S Chen, YY Zhu, R Xu, YQ Wu, XJ Yang, YL Fan, F Lu, ZM Jiang, J Zou Applied Physics Letters 88 (22), 2006 | 82 | 2006 |
Influence of strain rate effect on material removal and deformation mechanism based on ductile nanoscratch tests of Lu2O3 single crystal C Li, F Zhang, Y Wu, X Zhang Ceramics International 44 (17), 21486-21498, 2018 | 81 | 2018 |
Nanogrinding induced surface and deformation mechanism of single crystal β-Ga2O3 S Gao, Y Wu, R Kang, H Huang Materials Science in Semiconductor Processing 79, 165-170, 2018 | 70 | 2018 |
A new phase in stoichiometric Cu6Sn5 YQ Wu, JC Barry, T Yamamoto, QF Gu, SD McDonald, S Matsumura, ... Acta Materialia 60 (19), 6581-6591, 2012 | 70 | 2012 |
Deformation anisotropy of nano-scratching on C-plane of sapphire: A molecular dynamics study and experiment J Lin, F Jiang, Q Wen, Y Wu, J Lu, Z Tian, N Wang Applied Surface Science 546, 149091, 2021 | 69 | 2021 |
Nanoscratch-induced deformation of single crystal silicon YQ Wu, H Huang, J Zou, JM Dell Journal of Vacuum Science & Technology B: Microelectronics and Nanometer …, 2009 | 66 | 2009 |
Mechanical properties of single crystal tungsten microwhiskers characterized by nanoindentation H Huang, YQ Wu, SL Wang, YH He, J Zou, BY Huang, CT Liu Materials Science and Engineering: A 523 (1-2), 193-198, 2009 | 65 | 2009 |
Fracture strain of SiC nanowires and direct evidence of electron-beam induced amorphisation in the strained nanowires. S Wang, Y Wu, L Lin, Y He, H Huang Small (Weinheim an der Bergstrasse, Germany) 11 (14), 1672-1676, 2014 | 57 | 2014 |
Formation mechanism of nanocrystalline high-pressure phases in silicon during nanogrinding Y Wang, J Zou, H Huang, L Zhou, BL Wang, YQ Wu Nanotechnology 18 (46), 465705, 2007 | 55 | 2007 |
The removal mechanism and force modelling of gallium oxide single crystal in single grit grinding and nanoscratching Y Wang, X Li, Y Wu, D Mu, H Huang International Journal of Mechanical Sciences 204, 106562, 2021 | 52 | 2021 |
Deformation and removal of semiconductor and laser single crystals at extremely small scales Y Wu, D Mu, H Huang International Journal of Extreme Manufacturing 2 (1), 012006, 2020 | 52 | 2020 |