| A* 3d dataset: Towards autonomous driving in challenging environments QH Pham, P Sevestre, RS Pahwa, H Zhan, CH Pang, Y Chen, A Mustafa, ... 2020 IEEE International conference on Robotics and Automation (ICRA), 2267-2273, 2020 | 190 | 2020 |
| A revisit to MRF-based depth map super-resolution and enhancement J Lu, D Min, RS Pahwa, MN Do 2011 IEEE International Conference on Acoustics, Speech and Signal …, 2011 | 121 | 2011 |
| Faultnet: Faulty rail-valves detection using deep learning and computer vision RS Pahwa, J Chao, J Paul, Y Li, MTL Nwe, S Xie, A James, ... 2019 IEEE Intelligent Transportation Systems Conference (ITSC), 559-566, 2019 | 34 | 2019 |
| Locating 3D object proposals: A depth-based online approach RS Pahwa, J Lu, N Jiang, TT Ng, MN Do IEEE Transactions on Circuits and Systems for Video Technology 28 (3), 626-639, 2016 | 26 | 2016 |
| From the rendering equation to stratified light transport inversion TT Ng, RS Pahwa, J Bai, KH Tan, R Ramamoorthi International journal of computer vision 96, 235-251, 2012 | 21 | 2012 |
| Radiometric compensation using stratified inverses TT Ng, RS Pahwa, J Bai, TQS Quek, KH Tan 2009 IEEE 12th International Conference on Computer Vision, 1889-1894, 2009 | 20 | 2009 |
| Improving 3d brain tumor segmentation with predict-refine mechanism using saliency and feature maps TL Nwe, OZ Min, S Gopalakrishnan, D Lin, S Prasad, S Dong, Y Li, ... 2020 IEEE International conference on image processing (ICIP), 2671-2675, 2020 | 19 | 2020 |
| Dense 3D Reconstruction for Visual Tunnel Inspection using Unmanned Aerial Vehicle RS Pahwa, KY Chan, J Bai, VB Saputra, MN Do, S Foong 2019 IEEE/RSJ International Conference on Intelligent Robots and Systems (IROS), 2019 | 19 | 2019 |
| Automated attribute measurements of buried package features in 3D X-ray images using deep learning RS Pahwa, MTL Nwe, R Chang, OZ Min, W Jie, S Gopalakrishnan, ... 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 2196-2204, 2021 | 17 | 2021 |
| Deep learning analysis of 3d x-ray images for automated object detection and attribute measurement of buried package features R Pahwa, TL Nwe, R Chang, W Jie, OZ Min, SW Ho, R Qin, VS Rao, ... 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC), 221-227, 2020 | 17 | 2020 |
| Machine-learning based methodologies for 3D X-Ray measurement, characterization and optimization for buried structures in advanced IC packages RS Pahwa, SW Ho, R Qin, R Chang, OZ Min, W Jie, VS Rao, TL Nwe, ... 2020 International Wafer Level Packaging Conference (IWLPC), 01-07, 2020 | 14 | 2020 |
| Robust Detection, Segmentation, and Metrology of High Bandwidth Memory 3D Scans Using an Improved Semi-Supervised Deep Learning Approach J Wang, R Chang, Z Zhao, RS Pahwa Sensors 23 (12), 5470, 2023 | 12 | 2023 |
| Automated detection and segmentation of hbms in 3d x-ray images using semi-supervised deep learning RS Pahwa, R Chang, W Jie, X Xun, OZ Min, FC Sheng, CS Choong, ... 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 1890-1897, 2022 | 12 | 2022 |
| Da-cil: Towards domain adaptive class-incremental 3d object detection Z Zhao, M Xu, P Qian, RS Pahwa, R Chang arXiv preprint arXiv:2212.02057, 2022 | 11 | 2022 |
| Automated void detection in TSVs from 2D X-ray scans using supervised learning with 3D X-ray scans RS Pahwa, S Gopalakrishnan, H Su, OE Ping, H Dai, DHS Wee, R Qin, ... 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 842-849, 2021 | 10 | 2021 |
| Future of tamarind and tartrate in preventing recurrence of renal calculi BK Sur, HN Pandey, S Deshpande, R Pahwa, RK Singh, Tarachandra Urolithiasis: Clinical and basic research, 333-336, 1981 | 9 | 1981 |
| 3d defect detection and metrology of hbms using semi-supervised deep learning RS Pahwa, R Chang, W Jie, Z Ziyuan, C Lile, X Xun, FC Sheng, ... 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 943-950, 2023 | 8 | 2023 |
| Feature-less Stitching of Cylindrical Tunnel RS Pahwa, WK Leong, S Foong, K Leman, MN Do IEEE International Conference on Computer and Information Science (ICIS), 2018 | 8 | 2018 |
| Tracking objects using 3D object proposals RS Pahwa, TT Ng, MN Do 2017 Asia-Pacific Signal and Information Processing Association Annual …, 2017 | 8 | 2017 |
| Improved bump detection and defect identification for hbms using refined machine learning approach W Jie, R Chang, X Xun, C Lile, CS Foo, RS Pahwa 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC), 848-853, 2022 | 7 | 2022 |
Richard ChangInstitute for Infocomm Researchi2r.a-star.edu.sg의 이메일 확인됨