| Design for reliability of power electronics modules H Lu, C Bailey, C Yin Microelectronics reliability 49 (9-11), 1250-1255, 2009 | 257 | 2009 |
| A finite volume procedure to solve elastic solid mechanics problems in three dimensions on an unstructured mesh C Bailey, M Cross International journal for numerical methods in engineering 38 (10), 1757-1776, 1995 | 175 | 1995 |
| Prognostic and health management for engineering systems: a review of the data‐driven approach and algorithms T Sutharssan, S Stoyanov, C Bailey, C Yin The Journal of engineering 2015 (7), 215-222, 2015 | 147 | 2015 |
| A control volume procedure for solving the elastic stress-strain equations on an unstructured mesh YD Fryer, C Bailey, M Cross, CH Lai Applied mathematical modelling 15 (11-12), 639-645, 1991 | 138 | 1991 |
| Dynamic solid mechanics using finite volume methods AK Slone, C Bailey, M Cross Applied mathematical modelling 27 (2), 69-87, 2003 | 137 | 2003 |
| Comparison of finite element and finite volume methods application in geometrically nonlinear stress analysis NA Fallah, C Bailey, M Cross, GA Taylor Applied Mathematical Modelling 24 (7), 439-455, 2000 | 123 | 2000 |
| Solution of the elastic/visco-plastic constitutive equations: A finite volume approach GA Taylor, C Bailey, M Cross Applied mathematical modelling 19 (12), 746-760, 1995 | 104 | 1995 |
| A vertex‐based finite volume method applied to non‐linear material problems in computational solid mechanics GA Taylor, C Bailey, M Cross International journal for numerical methods in engineering 56 (4), 507-529, 2003 | 87 | 2003 |
| Predicting optimal process conditions for flip-chip assembly using copper column bumped dies H Lu, C Bailey 4th Electronics Packaging Technology Conference, 2002., 338-343, 2002 | 77 | 2002 |
| A finite volume unstructured mesh approach to dynamic fluid–structure interaction: an assessment of the challenge of predicting the onset of flutter AK Slone, K Pericleous, C Bailey, M Cross, C Bennett Applied mathematical modelling 28 (2), 211-239, 2004 | 76 | 2004 |
| Discretisation procedures for multi-physics phenomena C Bailey, GA Taylor, M Cross, P Chow Journal of Computational and Applied Mathematics 103 (1), 3-17, 1999 | 74 | 1999 |
| Lifetime prediction for power electronics module substrate mount-down solder interconnect H Lu, T Tilford, C Bailey, DR Newcombe 2007 International Symposium on High Density packaging and Microsystem …, 2007 | 70 | 2007 |
| The effect of reflow process on the contact resistance and reliability of anisotropic conductive film interconnection for flip chip on flex applications CY Yin, MO Alam, YC Chan, C Bailey, H Lu Microelectronics Reliability 43 (4), 625-633, 2003 | 68 | 2003 |
| Predicting damage and life expectancy of subsea power cables in offshore renewable energy applications F Dinmohammadi, D Flynn, C Bailey, M Pecht, C Yin, P Rajaguru, V Robu IEEE access 7, 54658-54669, 2019 | 63 | 2019 |
| Analysis of fluid separation in microfluidic T-channels X Xue, MK Patel, M Kersaudy-Kerhoas, MPY Desmulliez, C Bailey, ... Applied Mathematical Modelling 36 (2), 743-755, 2012 | 62 | 2012 |
| The effect of curing on the performance of ACF bonded chip‐on‐flex assemblies after thermal ageing MJ Rizvi, YC Chan, C Bailey, H Lu, A Sharif Soldering & Surface Mount Technology 17 (2), 40-48, 2005 | 58 | 2005 |
| A non-Newtonian computational fluid dynamics study of the stencil printing process GP Glinski, C Bailey, KA Pericleous Proceedings of the Institution of Mechanical Engineers, Part C: Journal of …, 2001 | 57 | 2001 |
| Correlation of solder paste rheology with computational simulations of the stencil printing process R Durairaj, GJ Jackson, NN Ekere, G Glinski, C Bailey Soldering & Surface Mount Technology 14 (1), 11-17, 2002 | 56 | 2002 |
| Multiphysics modelling of the metals casting process C Bailey, P Chow, M Cross, Y Fryer, K Pericleous Proceedings of the Royal Society of London. Series A: Mathematical, Physical …, 1996 | 56 | 1996 |
| A multi-scale approach to microstructure-sensitive thermal fatigue in solder joints Y Xu, J Xian, S Stoyanov, C Bailey, RJ Coyle, CM Gourlay, FPE Dunne International Journal of Plasticity 155, 103308, 2022 | 55 | 2022 |
Hua LuUniversity of Greenwichgre.ac.uk의 이메일 확인됨