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Tomoki Matsuda
Tomoki Matsuda
Graduate School of Engineering, Osaka University
mapse.eng.osaka-u.ac.jp의 이메일 확인됨
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Femtosecond laser peening of 2024 aluminum alloy without a sacrificial overlay under atmospheric conditions
T Sano, T Eimura, R Kashiwabara, T Matsuda, Y Isshiki, A Hirose, ...
Journal of Laser Applications 29 (1), 2017
992017
Relationship between intermetallic compound layer thickness with deviation and interfacial strength for dissimilar joints of aluminum alloy and stainless steel
R Hatano, T Ogura, T Matsuda, T Sano, A Hirose
Materials science and Engineering: A 735, 361-366, 2018
772018
High-frequency linear friction welding of aluminum alloys
H Mogami, T Matsuda, T Sano, R Yoshida, H Hori, A Hirose
Materials & Design 139, 457-466, 2018
432018
High-frequency linear friction welding of aluminum alloys to stainless steel
T Matsuda, H Adachi, T Sano, R Yoshida, H Hori, S Ono, A Hirose
Journal of Materials Processing Technology 269, 45-51, 2019
422019
Fracture dominant in friction stir spot welded joint between 6061 aluminum alloy and galvannealed steel based on microscale tensile testing
T Matsuda, T Ogaki, K Hayashi, C Iwamoto, T Nozawa, M Ohata, A Hirose
Materials & Design 213, 110344, 2022
382022
Microscale tensile test of galvannealed steel/aluminum dissimilar joint for estimation of intrinsic interfacial strength
T Matsuda, T Sano, M Munekane, M Ohata, A Hirose
Scripta Materialia 186, 196-201, 2020
352020
Evolution of transient liquid-phase sintered Cu–Sn skeleton microstructure during thermal aging
H Tatsumi, A Lis, H Yamaguchi, T Matsuda, T Sano, Y Kashiba, A Hirose
Applied Sciences 9 (1), 157, 2019
342019
Effect of mismatch in mechanical properties on interfacial strength of aluminum alloy/steel dissimilar joints
T Matsuda, R Hatano, T Ogura, R Suzuki, H Shoji, T Sano, M Ohata, ...
Materials Science and Engineering: A 786, 139437, 2020
332020
Silver oxide decomposition mediated direct bonding of silicon-based materials
T Matsuda, K Inami, K Motoyama, T Sano, A Hirose
Scientific reports 8 (1), 10472, 2018
332018
Low-temperature metal-to-alumina direct bonding process utilizing redox reaction between silver oxide and organic agent
K Asama, T Matsuda, T Ogura, T Sano, M Takahashi, A Hirose
Materials Science and Engineering: A 702, 398-405, 2017
332017
Dislocation structure produced by an ultrashort shock pulse
T Matsuda, T Sano, K Arakawa, A Hirose
Journal of Applied Physics 116 (18), 2014
322014
Multiple-shocks induced nanocrystallization in iron
T Matsuda, T Sano, K Arakawa, A Hirose
Applied Physics Letters 105 (2), 2014
322014
Friction stir spot welding of aluminum and carbon fiber reinforced thermoplastic using hybrid surface treatment improving interfacial properties
E Ota, T Matsuda, H Shoji, T Ogura, F Miyasaka, T Sano, M Ohata, ...
Materials & Design 212, 110221, 2021
312021
Hardening and softening effects in aluminium alloys during high-frequency linear friction welding
A Lis, H Mogami, T Matsuda, T Sano, R Yoshida, H Hori, A Hirose
Journal of Materials Processing Technology 255, 547-558, 2018
292018
Influence of interfacial structure on the fracture behavior of friction stir spot welded dissimilar joints
T Matsuda, K Owada, A Numata, H Shoji, T Sano, M Ohata, A Hirose
Materials Science and Engineering: A 772, 138743, 2020
282020
In Situ Study of Reduction Process of CuO Paste and Its Effect on Bondability of Cu-to-Cu Joints
T Yao, T Matsuda, T Sano, C Morikawa, A Ohbuchi, H Yashiro, A Hirose
Journal of Electronic Materials 47, 2193-2197, 2018
242018
Femtosecond laser-driven shock-induced dislocation structures in iron
T Matsuda, T Sano, K Arakawa, O Sakata, H Tajiri, A Hirose
Applied Physics Express 7 (12), 122704, 2014
242014
AlN-to-Metal Direct Bonding Process Utilizing Sintering of Ag Nanoparticles Derived from the Reduction of Ag2O
K Motoyama, T Matsuda, T Sano, A Hirose
Journal of Electronic Materials 47, 5780-5787, 2018
202018
Analysis of mechanical properties of dissimilar material joint using scrubbing refill friction stir spot welding
N Takeoka, T Tsuchida, T Matsuda, T Ogura, R Ohashi, A Hirose
Journal of Advanced Joining Processes 5, 100112, 2022
182022
Thermal stability and characteristic properties of pressureless sintered Ag layers formed with Ag nanoparticles for power device applications
T Watanabe, M Takesue, T Matsuda, T Sano, A Hirose
Journal of Materials Science: Materials in Electronics 31, 17173-17182, 2020
172020
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학술자료 1–20