Shang Y. Hou 侯上勇

Shang Y. Hou 侯上勇

台灣積體電路有限公司
Patvirtintas el. paštas ms9.hinet.net
Cituoja 13333
Semiconductor packaging 3DIC
Hak-Sung Kim

Hak-Sung Kim

Mechanical Engineering, Hanyang University
Patvirtintas el. paštas hanyang.ac.kr
Cituoja 9095
Composite Printed electronics Light sintering technology Semiconductor packaging Nanocomposite
Youngsuk Nam

Youngsuk Nam

Associate Professor, Dept. of Mechanical Engineering at KAIST
Patvirtintas el. paštas kaist.ac.kr
Cituoja 7492
Phase change Heat transfer Semiconductor packaging Data center cooling Thermal materials
Niranjan Parab

Niranjan Parab

Intel corp.
Patvirtintas el. paštas intel.com
Cituoja 6174
Additive manufacturing Dynamic behavior of materials Brittle fracture Laser powder bed fusion semiconductor packaging
Michael Mack

Michael Mack

Luxtera, Inc.
Patvirtintas el. paštas luxtera.com
Cituoja 5258
Photonics LEDs Lasers Semiconductor Packaging
Le Cai (蔡乐)

Le Cai (蔡乐)

Meta Reality Labs-Research
Patvirtintas el. paštas meta.com
Cituoja 5234
TFT Flexible/Stretchable Hybrid Electronics Micro/Nano Fab Semiconductor Packaging
shintaro yamamichi

shintaro yamamichi

IBM Research -Tokyo
Patvirtintas el. paštas jp.ibm.com
Cituoja 4076
Semiconductor packaging AI Hardware Quantum Material Informatics
Bharathi M S

Bharathi MS

Institute of High Performance Computing
Patvirtintas el. paštas ihpc.a-star.edu.sg
Cituoja 3305
Thin film growth growth of 2D materials Semiconductor Packaging Nonlinear dynamics Multiscale Modeling
Yonghao Xiu

Yonghao Xiu

Apple
Patvirtintas el. paštas apple.com
Cituoja 3209
Polymer Surface physics Optical devices Semiconductor packaging
Stephanie Butler

Stephanie Butler

Technology Innovation Architect
Patvirtintas el. paštas wattsbutler.com
Cituoja 2847
power semiconductors advanced process control semiconductor packaging wide bandgap
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