| Impact and delamination failure of woven-fabric composites JK Kim, ML Sham Composites Science and Technology 60 (5), 745-761, 2000 | 487 | 2000 |
| Surface functionalities of multi-wall carbon nanotubes after UV/Ozone and TETA treatments ML Sham, JK Kim Carbon 44 (4), 768-777, 2006 | 417 | 2006 |
| Moisture barrier characteristics of organoclay–epoxy nanocomposites JK Kim, C Hu, RSC Woo, ML Sham Composites Science and Technology 65 (5), 805-813, 2005 | 417 | 2005 |
| Morphology and properties of UV/ozone treated graphite nanoplatelet/epoxy nanocomposites J Li, ML Sham, JK Kim, G Marom Composites Science and Technology 67 (2), 296-305, 2007 | 261 | 2007 |
| Nanoscale characterisation of interphase in silane treated glass fibre composites JK Kim, ML Sham, J Wu Composites Part A: applied science and manufacturing 32 (5), 607-618, 2001 | 228 | 2001 |
| Conductive graphite nanoplatelet/epoxy nanocomposites: Effects of exfoliation and UV/ozone treatment of graphite J Li, JK Kim, ML Sham Scripta Materialia 53 (2), 235-240, 2005 | 215 | 2005 |
| Tensile strength of glass fibres with carbon nanotube–epoxy nanocomposite coating NA Siddiqui, ML Sham, BZ Tang, A Munir, JK Kim Composites Part A: Applied Science and Manufacturing 40 (10), 1606-1614, 2009 | 185 | 2009 |
| Cleaning and functionalization of polymer surfaces and nanoscale carbon fillers by UV/ozone treatment: a review ML Sham, J Li, PC Ma, JK Kim Journal of composite materials 43 (14), 1537-1564, 2009 | 130 | 2009 |
| Tensile strength of glass fibres with carbon nanotube–epoxy nanocomposite coating: effects of CNT morphology and dispersion state NA Siddiqui, EL Li, ML Sham, BZ Tang, SL Gao, E Mäder, JK Kim Composites Part A: Applied Science and Manufacturing 41 (4), 539-548, 2010 | 112 | 2010 |
| Evolution of residual stresses in modified epoxy resins for electronic packaging applications ML Sham, JK Kim Composites Part A: applied science and manufacturing 35 (5), 537-546, 2004 | 71 | 2004 |
| Effects of the Rib Cage on Thoracic Spine Flexibility / Einfluss des Brustkorbs auf die Flexibilität der Brustwirbelsäule ML Sham, T Zander, A Rohlmann, G Bergmann Walter de Gruyter 50 (11), 361-365, 2005 | 67 | 2005 |
| Piezoelectric module for energy harvesting, such as in a tire pressure monitoring system Z Gao, ML Sham, CH Chung US Patent 8,011,237, 2011 | 49 | 2011 |
| Stacked multi-chip package with EMI shielding LW Leung, YC Chen, ML Sham, CH Chung US Patent 7,514,774, 2009 | 45 | 2009 |
| Effect of hybrid layers with different silane coupling agents on impact response of glass fabric reinforced vinylester matrix composites JK Kim, ML Sham, MS Sohn, H Hamada Polymer 42 (17), 7455-7460, 2001 | 44 | 2001 |
| Numerical analysis of plastic encapsulated electronic package reliability: Viscoelastic properties of underfill resin ML Sham, JK Kim, JH Park Computational materials science 40 (1), 81-89, 2007 | 39 | 2007 |
| Challenges and opportunities in system-in-package (SiP) business ML Sham, YC Chen, LW Leung, JR Lin, T Chung 2006 7th International Conference on Electronic Packaging Technology, 1-5, 2006 | 33 | 2006 |
| Study on the fire resistance performance of cementitious composites containing recycled glass cullets (RGCs) B Chen, H Zhu, B Li, M Sham, Z Li Construction and Building Materials 242, 117992, 2020 | 26 | 2020 |
| Thermal performance of flip chip packages: Numerical study of thermo-mechanical interactions ML Sham, JK Kim, JH Park Computational materials science 43 (3), 469-480, 2008 | 23 | 2008 |
| Adhesion characteristics of underfill resins with flip chip package components ML Sham, JK Kim Journal of adhesion science and technology 17 (14), 1923-1944, 2003 | 20 | 2003 |
| Curing behavior and residual stresses in polymeric resins used for encapsulanting electronic packages ML Sham, JK Kim Journal of applied polymer science 96 (1), 175-182, 2005 | 19 | 2005 |
