| Quantum error correction below the surface code threshold R Acharya, L Aghababaie-Beni, I Aleiner, TI Andersen, M Ansmann, ... arXiv preprint arXiv:2408.13687, 2024 | 93 | 2024 |
| A bulk-micromachined three-axis capacitive MEMS accelerometer on a single die S Tez, U Aykutlu, MM Torunbalci, T Akin Journal of Microelectromechanical Systems 24 (5), 1264-1274, 2015 | 87 | 2015 |
| An FBAR circulator MM Torunbalci, TJ Odelberg, S Sridaran, RC Ruby, SA Bhave IEEE Microwave and Wireless Components Letters 28 (5), 395-397, 2018 | 75 | 2018 |
| Wafer level hermetic sealing of MEMS devices with vertical feedthroughs using anodic bonding MM Torunbalci, SE Alper, T Akin Sensors and Actuators A: Physical 224, 169-176, 2015 | 70 | 2015 |
| Advanced MEMS process for wafer level hermetic encapsulation of MEMS devices using SOI cap wafers with vertical feedthroughs MM Torunbalci, SE Alper, T Akin Journal of Microelectromechanical Systems 24 (3), 556-564, 2015 | 45 | 2015 |
| Comparison of two alternative silicon-on-glass microfabrication processes for MEMS inertial sensors MM Torunbalci, E Tatar, SE Alper, T Akin Procedia Engineering 25, 900-903, 2011 | 35 | 2011 |
| Modular compact modeling of MTJ devices MM Torunbalci, P Upadhyaya, SA Bhave, KY Camsari IEEE Transactions on Electron Devices 65 (10), 4628-4634, 2018 | 33 | 2018 |
| Engineering new limits to magnetostriction through metastability in iron-gallium alloys PB Meisenheimer, RA Steinhardt, SH Sung, LD Williams, S Zhuang, ... Nature communications 12 (1), 2757, 2021 | 32 | 2021 |
| A method and electrical model for the anodic bonding of SOI and glass wafers E Tatar, MM Torunbalci, SE Alper, T Akin 2012 IEEE 25th International Conference on Micro Electro Mechanical Systems …, 2012 | 29 | 2012 |
| Double-free-layer magnetic tunnel junctions for probabilistic bits KY Camsari, MM Torunbalci, WA Borders, H Ohno, S Fukami Physical Review Applied 15 (4), 044049, 2021 | 28 | 2021 |
| Wafer level hermetic encapsulation of MEMS inertial sensors using SOI cap wafers with vertical feedthroughs MM Torunbalci, SE Alper, T Akin 2014 International Symposium on Inertial Sensors and Systems (INERTIAL), 1-2, 2014 | 25 | 2014 |
| An all-silicon process platform for wafer-level vacuum packaged MEMS devices MM Torunbalci, HD Gavcar, F Yesil, SE Alper, T Akin IEEE Sensors Journal 21 (13), 13958-13964, 2021 | 20 | 2021 |
| Method of wafer-level hermetic packaging with vertical feedthroughs SE Alper, MM Torunbalci, T Akin US Patent 9,556,020, 2017 | 17 | 2017 |
| Acceleration insensitive hemispherical shell resonators using pop-up rings MM Torunbalci, S Dai, A Bhat, SA Bhave 2018 IEEE Micro Electro Mechanical Systems (MEMS), 956-959, 2018 | 16 | 2018 |
| Gold-tin eutectic bonding for hermetic packaging of MEMS devices with vertical feedthroughs MM Torunbalci, EC Demir, I Donmez, SE Alper, T Akin SENSORS, 2014 IEEE, 2187-2190, 2014 | 15 | 2014 |
| Thermalization and criticality on an analogue–digital quantum simulator TI Andersen, N Astrakhantsev, AH Karamlou, J Berndtsson, J Motruk, ... Nature 638 (8049), 79-85, 2025 | 14 | 2025 |
| A method for wafer level hermetic packaging of SOI-MEMS devices with embedded vertical feedthroughs using advanced MEMS process MM Torunbalci, SE Alper, T Akin Journal of Micromechanics and Microengineering 25 (12), 125030, 2015 | 13 | 2015 |
| Fabrication and characterization of gold-tin eutectic bonding for hermetic packaging of MEMS devices EC Demir, MM Torunbalci, I Donmez, YE Kalay, T Akin 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC), 241-245, 2014 | 12 | 2014 |
| A novel method for fabricating MEMS three-axis accelerometers using low temperature Au-Sn eutectic bonding S Tez, MM Torunbalci, T Akin 2016 IEEE SENSORS, 1-3, 2016 | 11 | 2016 |
| A method of fabricating vacuum packages with vertical feedthroughs in a wafer level anodic bonding process MM Torunbalci, SE Alper, T Akin Procedia Engineering 87, 887-890, 2014 | 11 | 2014 |
Tayfun AKINMiddle East Technical UniversityPatvirtintas el. paštas metu.edu.tr